Patents by Inventor Yucheng GAO

Yucheng GAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240076188
    Abstract: Methods and systems for producing graphene from spent lithium-ion batteries are disclosed. One method includes applying an acid leaching solution to an anode of a lithium-ion battery to produce expanded graphite, applying a hydrothermal process to the expanded graphite to produce purified graphite, and subjecting the purified graphite to a shear mixing process to produce dispersed graphene. In some examples, the shear mixing process is combined with a hydrogen passivation process, which collectively improves each of graphene quality, graphene conversion rate, and graphene production efficiency.
    Type: Application
    Filed: January 24, 2022
    Publication date: March 7, 2024
    Inventors: Xiaodong Li, Yucheng Zhou, Zan Gao
  • Patent number: 11864357
    Abstract: A double-sided cold plate includes a manifold comprising openings extending from a first surface of the manifold through the manifold to a second surface of the manifold forming recesses within the manifold and an inlet channel and an outlet channel fluidly coupled to the recesses within the manifold, a plurality of first heat sinks coupled to the first surface of the manifold enclosing the openings on the first surface, and a plurality of second heat sinks positioned adjacent each other along a length of the manifold and coupled to the second surface of the manifold, enclosing the openings on the second surface, a width of the plurality of second heat sinks is greater than a width of the manifold thereby forming an overhanging portion on each lengthwise side of the manifold, the overhanging portion configured to mechanically support a plurality of electrical components positioned around a perimeter of the manifold.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: January 2, 2024
    Assignees: Toyota Motor Engineering and Manufacturing North America, Inc., University of Colorado Boulder
    Inventors: Feng Zhou, Yuqing Zhou, Ercan Mehmet Dede, Robert Erickson, Dragan Maksimovic, Vivek Sankaranarayanan, Yucheng Gao
  • Patent number: 11596088
    Abstract: A cold plate having a manifold includes a recess extending from a first side to a second side of the manifold, where the recess includes openings to the recess positioned lengthwise along the first side and a single opening to the recess on the second side, an inlet and an outlet fluidly coupled to the recess, a plurality of plates fastened to the first side enclosing the openings, a heat sink fastened to the second side enclosing the single opening on the second side, and a plurality of fluid cores one of each positioned between each of the plurality of plates and the heat sink. The plurality of fluid cores include a flow distribution insert, a first plate fin positioned between the flow distribution insert and the heat sink fastened to the second side, and a second plate fin positioned between the flow distribution insert and the heat sink.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: February 28, 2023
    Assignees: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., UNIVERSITY OF COLORADO BOULDER
    Inventors: Feng Zhou, Ercan Mehmet Dede, Hiroshi Ukegawa, Robert Erickson, Dragan Maksimovic, Vivek Sankaranarayanan, Yucheng Gao
  • Patent number: 11545297
    Abstract: Embodiments of the disclosure relate to apparatuses for enhanced thermal management of an inductor assembly using functionally-graded thermal vias for heat flow control in the windings of the inductor. In one embodiment, a PCB for an inductor assembly includes a top surface and a bottom surface. Two or more electrically-conductive layers are embedded within the PCB and stacked vertically between the top surface and the bottom surface. The two or more electrically-conductive layers are electrically connected to form an inductor winding. A plurality of thermal vias thermally connects each of the two or more electrically-conductive layers to a cold plate thermally connected to the bottom surface. A number of thermal vias thermally connecting each electrically-conductive layer to the cold plate is directly proportional to a predetermined rate of heat dissipation from the electrically-conductive layer.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: January 3, 2023
    Assignees: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., UNIVERSITY OF COLORADO BOULDER
    Inventors: Ercan Dede, Yucheng Gao, Vivek Sankaranarayanan, Aritra Ghosh, Robert Erickson, Dragan Maksimovic
  • Publication number: 20220386509
    Abstract: A double-sided cold plate includes a manifold comprising openings extending from a first surface of the manifold through the manifold to a second surface of the manifold forming recesses within the manifold and an inlet channel and an outlet channel fluidly coupled to the recesses within the manifold, a plurality of first heat sinks coupled to the first surface of the manifold enclosing the openings on the first surface, and a plurality of second heat sinks positioned adjacent each other along a length of the manifold and coupled to the second surface of the manifold, enclosing the openings on the second surface, a width of the plurality of second heat sinks is greater than a width of the manifold thereby forming an overhanging portion on each lengthwise side of the manifold, the overhanging portion configured to mechanically support a plurality of electrical components positioned around a perimeter of the manifold.
    Type: Application
    Filed: May 25, 2021
    Publication date: December 1, 2022
    Applicants: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., University of Colorado Boulder
    Inventors: Feng Zhou, Yuqing Zhou, Ercan Mehmet Dede, Robert Erickson, Dragan Maksimovic, Vivek Sankaranarayanan, Yucheng Gao
  • Publication number: 20220248560
    Abstract: A cold plate having a manifold includes a recess extending from a first side to a second side of the manifold, where the recess includes openings to the recess positioned lengthwise along the first side and a single opening to the recess on the second side, an inlet and an outlet fluidly coupled to the recess, a plurality of plates fastened to the first side enclosing the openings, a heat sink fastened to the second side enclosing the single opening on the second side, and a plurality of fluid cores one of each positioned between each of the plurality of plates and the heat sink. The plurality of fluid cores include a flow distribution insert, a first plate fin positioned between the flow distribution insert and the heat sink fastened to the second side, and a second plate fin positioned between the flow distribution insert and the heat sink.
    Type: Application
    Filed: January 29, 2021
    Publication date: August 4, 2022
    Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., University of Colorado Boulder
    Inventors: Feng Zhou, Ercan Mehmet Dede, Hiroshi Ukegawa, Robert Erickson, Dragan Maksimovic, Vivek Sankaranarayanan, Yucheng Gao
  • Publication number: 20210184578
    Abstract: A bidirectional composite converter is provided. The bidirectional composite converter can be used with power electronics, such as but not limited to electric vehicles and other applications. In some implementations, for example, the composite converter may be used in a powertrain of an electric vehicle to couple batteries to a high voltage bus of the vehicle to provide power to the motors and to one or more integrated charging ports (e.g., ac grid wired connections or a wireless charging port) for extremely fast charging. In various implementations, the bidirectional converter architecture may comprise one or more dc transformer modules (DCX's) arranged with output port(s) coupled in series at an output port of the composite converter.
    Type: Application
    Filed: August 16, 2019
    Publication date: June 17, 2021
    Inventors: Robert ERICKSON, Dragan MAKSIMOVIC, Vivek SANKARANARAYANAN, Aritra GHOSH, Yucheng GAO
  • Publication number: 20210159007
    Abstract: Embodiments of the disclosure relate to apparatuses for enhanced thermal management of a planar inductor assembly. In one embodiment, a cooling package for an inductor assembly includes a cold plate and a heat-spreading bracket mechanically coupled to the cold plate at a first end of the heat-spreading bracket. The cold plate has a slotted recess for mounting a first inductor core along a first end thereof. The heat-spreading bracket is configured to apply a clamping force to a second inductor core at a second end opposite to the first end of the heat-spreading bracket.
    Type: Application
    Filed: November 22, 2019
    Publication date: May 27, 2021
    Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., University of Colorado Boulder
    Inventors: Ercan M. DEDE, Tsuyoshi NOMURA, Robert ERICKSON, Dragan MAKSIMOVIC, Vivek SANKARANARAYANAN, Yucheng GAO, Aritra GHOSH
  • Publication number: 20200388432
    Abstract: Embodiments of the disclosure relate to apparatuses for enhanced thermal management of an inductor assembly using functionally-graded thermal vias for heat flow control in the windings of the inductor. In one embodiment, a PCB for an inductor assembly includes a top surface and a bottom surface. Two or more electrically-conductive layers are embedded within the PCB and stacked vertically between the top surface and the bottom surface. The two or more electrically-conductive layers are electrically connected to form an inductor winding. A plurality of thermal vias thermally connects each of the two or more electrically-conductive layers to a cold plate thermally connected to the bottom surface. A number of thermal vias thermally connecting each electrically-conductive layer to the cold plate is directly proportional to a predetermined rate of heat dissipation from the electrically-conductive layer.
    Type: Application
    Filed: November 22, 2019
    Publication date: December 10, 2020
    Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., University of Colorado Boulder
    Inventors: Ercan DEDE, Yucheng GAO, Vivek SANKARANARAYANAN, Aritra GHOSH, Robert ERICKSON, Dragan MAKSIMOVIC