Patents by Inventor Yu-Chi Liu
Yu-Chi Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12009464Abstract: A display device includes a pixel array substrate and a circuit board. The pixel array substrate has a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface. Multiple bonding pads are located on the first surface. The circuit board is bent from above the first surface of the pixel array substrate to below the second surface. The circuit board is electrically connected to the bonding pads and includes a thermoplastic substrate. The thermoplastic substrate includes a third surface facing the pixel array substrate and a fourth surface opposite to the third surface. The thermoplastic substrate includes a first bend formed by thermoplastics.Type: GrantFiled: November 1, 2021Date of Patent: June 11, 2024Assignee: Au Optronics CorporationInventors: Wei-Fu Wu, Yu Tseng, Yu-Ting Liu, Chih-Cheng Kao, Tsai-Chi Yeh
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Publication number: 20240163978Abstract: An electric heating material processing device includes a material transporting module, a material feeding controller, a material discharging controller, a gas vent, and an electric heating thermal desorption device. The material transporting module has a material inlet and a material outlet. The material feeding controller is connected to the material inlet, and is configured to control a feeding quantity and a feeding speed of the materials. The material discharging controller is connected to the material outlet, and is configured to control a discharging quantity and a discharging speed of the materials. The gas vent is disposed on an end of the material transporting module. The electric heating thermal desorption device is disposed on an outer surface of the material transporting module, and is configured to perform a thermal desorption process on the materials. The electric heating thermal desorption device includes an electric heating acceptor and plural electric heaters.Type: ApplicationFiled: February 24, 2023Publication date: May 16, 2024Inventors: Huang-Long LIN, Yuan-Hung LIU, Yu-Chi CHANG
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Patent number: 11984419Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.Type: GrantFiled: July 26, 2022Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li, Shih-Yen Chen, Cheng-Nan Hsieh, Kuo-Chio Liu, Chen-Shien Chen, Chin-Yu Ku, Te-Hsun Pang, Yuan-Feng Wu, Sen-Chi Chiang
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Publication number: 20230373100Abstract: The present disclosure is directed to a transfer blade including a first end segment, a second end segment opposite to the first end segment, and an intermediate segment extending from the first end segment to the second end segment. The first end segment includes a first contact region and the second end segment includes a second contact region. The first and second contact regions are configured to contact locations of a surface of a workpiece that do not overlap or are not aligned with a sensitive area of the workpiece. The sensitive area of the workpiece may be an EUV frame or a reticle of the workpiece. A non-contact region extends continuously along the first end segment, the intermediate segment, and the second end segment, and the non-contact region overlaps the sensitive area of the workpiece and is spaced apart from the sensitive area of the workpiece.Type: ApplicationFiled: May 19, 2022Publication date: November 23, 2023Inventors: Chih-Wei CHOU, Sheng-Yuan LIN, Yuan-Hsin CHI, Hung-Chih WANG, Yu-Chi LIU
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Publication number: 20230207365Abstract: A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.Type: ApplicationFiled: March 6, 2023Publication date: June 29, 2023Inventors: Chih-Wei CHOU, Sheng-Yuan LIN, Yuan-Hsin CHI, Yin-Tun CHOU, Hung-Chih WANG, Yu-Chi LIU
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Patent number: 11600506Abstract: A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.Type: GrantFiled: July 22, 2021Date of Patent: March 7, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Chih-Wei Chou, Sheng-Yuan Lin, Yuan-Hsin Chi, Yin-Tun Chou, Hung-Chih Wang, Yu-Chi Liu
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Publication number: 20230065818Abstract: An apparatus for performing a deposition process on a semiconductor wafer includes a chamber, a wafer holder, and a shielding structure. The chamber contains a reaction area, the wafer holder is disposed in the chamber to hold the semiconductor wafer, and the reaction area is above the semiconductor wafer. The shielding structure is disposed in the chamber and isolates an inner sidewall of the chamber from the reaction area. The shielding structure includes a base member, a first member, and a second member. The base member is disposed between the inner sidewall of the chamber and the wafer holder. The first member is disposed on the base member and is windowless. The second member is disposed on the base member and within the first member, and the second member includes a sidewall provided with a first window to transfer the semiconductor wafer.Type: ApplicationFiled: August 30, 2021Publication date: March 2, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Wei Chou, Sheng-Yuan Lin, Yuan-Hsin Chi, Yin-Tun Chou, Hung-Chih Wang, Yu-Chi Liu
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Publication number: 20230068139Abstract: A clamp ring including an inner periphery of increased diameter at locations where inwardly extending tabs are not located reduces the risk a workpiece that is placed in close proximity to the clamp ring or which contacts the clamp ring during processing will stick to the clamp ring.Type: ApplicationFiled: August 27, 2021Publication date: March 2, 2023Inventors: Chih-Wei CHOU, Yuan-Hsin CHI, Yin-Tun CHOU, Hung-Chih WANG, Yu-Chi LIU, Chih-Ming WANG
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Publication number: 20220344191Abstract: A wafer pod transfer assembly is provided. The wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.Type: ApplicationFiled: July 22, 2021Publication date: October 27, 2022Inventors: Chih-Wei CHOU, Sheng-Yuan Lin, Yuan-Hsin Chi, Yin-Tun Chou, Hung-Chih Wang, Yu-Chi Liu
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Publication number: 20220301947Abstract: A deposition tool includes a power cable pedestal including a pedestal body with a first surface and a second surface and a guide hole that extends through the pedestal body from the first surface to the second surface, where at least a portion of a sidewall of the guide hole has a slanted surface, and where the pedestal body is formed from a first material with a melting point that is higher than a melting point of Polyoxymethylene (POM). The deposition tool includes a bushing arranged over the guide hole, where the bushing is formed from a second material with a melting point that is higher than the melting point of POM.Type: ApplicationFiled: June 11, 2021Publication date: September 22, 2022Inventors: Chih-Wei CHOU, Yuan-Hsin CHI, Sheng-Yuan LIN, Yin-Tun CHOU, Hung-Chih WANG, Yu-Chi LIU
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Publication number: 20210298594Abstract: Methods and systems for analysing a property of a cornea of an eye using terahertz (THz) radiation are provided. The method includes projecting a first THz wave onto a surface of the cornea and detecting a first reflected wave being a reflection of the first THz wave reflected from the surface of the cornea. The method further includes deforming the cornea by projecting visible light or puffing air to the surface of the cornea, projecting a second THz wave onto the surface of the cornea after the deforming, and detecting a second reflected wave being a reflection of the second THz wave reflected from the surface of the cornea after the deforming. Finally, the method includes calculating the property of the cornea based on the first reflected wave and the second reflected wave. The invention particularly relates to systems and methods for corneal elasticity and/or rigidity analysis using terahertz (THz) time-domain spectroscopy.Type: ApplicationFiled: July 10, 2019Publication date: September 30, 2021Inventors: Lin KE, Hongwei LIU, Nan ZHANG, Jod S MEHTA, Yu Chi LIU
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Publication number: 20210259540Abstract: Methods and systems for dry eye analysis using terahertz (THz) radiation. The method includes projecting a THz wave onto a surface of an eye and detecting a reflected wave being a reflection of the THz wave reflected from the surface of the eye. The method further includes analysing properties of the eye in response to the THz wave reflected from the surface of the eye, the properties of the eye including thickness of the eye's cornea and ambient tissues, and analyzing the properties of the eye comprises measuring the thickness of the cornea and/or the ambient tissues and/or measuring an amount of chemical components of one or more of the eye's layers.Type: ApplicationFiled: July 10, 2019Publication date: August 26, 2021Inventors: Lin KE, Hongwei LIU, Nan ZHANG, Jod S MEHTA, Yu Chi LIU
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Publication number: 20190152008Abstract: The present invention relates to a control system and control method. The control system is applied to a machine tool and includes a horizontal monitor unit, a temperature monitor unit, a temperature adjustment device and a controller. The horizontal monitor unit is configured to measure a horizontal angle of a table and the temperature monitor unit is configured to measure a temperature information of a sensing area in a machining device. The controller receives the horizontal angle and the temperature information, then generates a compensation signal to the temperature adjustment device to change the temperature of an adjusting area in the machining device so that the horizontal angle of the table and the vertical inclination of the machining device are orthogonal to each other.Type: ApplicationFiled: December 4, 2017Publication date: May 23, 2019Inventors: Chow-Shih Wang, Yu-Chi Liu, Yao-Cheng Tsai, Bo-Jyun Jhang, Hung-Sheng Chiu
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Patent number: 10218415Abstract: An antenna system includes a first transmission line, a second transmission line, a third transmission line, a fourth transmission line, a first dipole antenna, a second dipole antenna, a third dipole antenna, a fourth dipole antenna, a fifth dipole antenna, a sixth dipole antenna, a seventh dipole antenna, and an eighth dipole antenna. Each dipole antenna is coupled through a corresponding transmission line to a feeding point. Each of the fifth dipole antenna, the sixth dipole antenna, the seventh dipole antenna, and the eighth dipole antenna is positioned between the feeding point and a corresponding one of the first dipole antenna, the second dipole antenna, the third dipole antenna, and the fourth dipole antenna. Each of the partial dipole antennas includes a positive radiation branch and a negative radiation branch. The angle between the positive radiation branch and the negative radiation branch is less than 100 degrees.Type: GrantFiled: August 24, 2017Date of Patent: February 26, 2019Assignee: WISTRON NEWEB CORP.Inventors: Chung-Yen Chen, Yu Tao, Yu-Chi Liu
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Publication number: 20180269936Abstract: An antenna system includes a first transmission line, a second transmission line, a third transmission line, a fourth transmission line, a first dipole antenna, a second dipole antenna, a third dipole antenna, a fourth dipole antenna, a fifth dipole antenna, a sixth dipole antenna, a seventh dipole antenna, and an eighth dipole antenna. Each dipole antenna is coupled through a corresponding transmission line to a feeding point. Each of the fifth dipole antenna, the sixth dipole antenna, the seventh dipole antenna, and the eighth dipole antenna is positioned between the feeding point and a corresponding one of the first dipole antenna, the second dipole antenna, the third dipole antenna, and the fourth dipole antenna. Each of the partial dipole antennas includes a positive radiation branch and a negative radiation branch. The angle between the positive radiation branch and the negative radiation branch is less than 100 degrees.Type: ApplicationFiled: August 24, 2017Publication date: September 20, 2018Inventors: Chung-Yen CHEN, Yu TAO, Yu-Chi LIU
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Publication number: 20180143654Abstract: The present disclosure provides warm-up compensation system and method. This method includes steps as follow. Critical area of a machine is analyzed, where the critical area includes a plurality of critical temperature-sensitive blocks and at least one critical heating block. Then, temperature sensors are used to detect the temperature of the critical areas of the machine. The correspondence relationship among temperature changes of critical areas, tilt angle changes of a spindle of the machine and temperature changes of the at least one critical heating block along heating time. The critical area of the machine is compensated in accordance with the correspondence relationship. Whether the temperature of the spindle has reached equilibrium is determined.Type: ApplicationFiled: December 6, 2016Publication date: May 24, 2018Inventors: Chow-Shih WANG, Hung-Sheng CHIU, Yu-Chi LIU, Hsiao-Chen CHANG, Yao-Chang TSAI
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Publication number: 20170113369Abstract: A tool measurement method includes receiving, through a first communication component, at least one first sensing signal from a tool sensor; receiving, through a second communication component, a plurality of coordinates from a machine tool controller; calculating a tool diameter of a cutting tool according to at least first one target coordinate of the coordinates, wherein the at least one first target coordinate corresponds to the first sensing signal; and providing, through the second communication component, the tool diameter of the cutting tool to the machine tool controller.Type: ApplicationFiled: November 27, 2015Publication date: April 27, 2017Inventors: Hung-Sheng CHIU, Yu-Chi LIU, Ming-Hao HSIAO, Chin-Huang CHANG, Hsiao-Chen CHANG
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Publication number: 20060114373Abstract: A planar light source including a transflective film, a plurality of cold cathode fluorescence flat lamps and at least one reflective component to provide a uniform light source is described. A portion of the light emitted from the emitting areas of the cold cathode fluorescence flat lamps passes through the transflective film, and the other portion of the light is reflected to the reflective component by the transflective film. Then, the light is reflected to the dark areas between the emitting areas to compensate the brightness of the dark areas. When the brightness of the dark areas is compensated, the planar light source provides a uniform light without dark stripes.Type: ApplicationFiled: March 28, 2005Publication date: June 1, 2006Inventors: Yu-Chi Liu, Wen-Chi Wu, Yuan-Wen Liu, Kung-Tung Pan, Yui-Shin Fran