Patents by Inventor Yucun Dou

Yucun Dou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component carrier with electrically reliable bridge with sufficiently thick vertical thickness in through hole of thin dielectric
    Patent number: 11483927
    Abstract: A component carrier includes an electrically insulating layer structure having a first main surface and a second main surface with a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface. An electrically conductive bridge structure connects opposing sidewalls of the electrically insulating layer structure delimiting the through hole. A vertical thickness of the electrically insulating layer structure is not more than 200 ?m and a narrowest vertical thickness of the bridge structure is at least 20 ?m.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: October 25, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Ismadi Bin Ismail, Valerian Yun Khim Chung, Alex Yucun Dou, Seok Kim Tay
  • Component Carrier With Electrically Reliable Bridge With Sufficiently Thick Vertical Thickness in Through Hole of Thin Dielectric
    Publication number: 20210161012
    Abstract: A component carrier includes an electrically insulating layer structure having a first main surface and a second main surface with a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface. An electrically conductive bridge structure connects opposing sidewalls of the electrically insulating layer structure delimiting the through hole. A vertical thickness of the electrically insulating layer structure is not more than 200 ?m and a narrowest vertical thickness of the bridge structure is at least 20 ?m.
    Type: Application
    Filed: February 2, 2021
    Publication date: May 27, 2021
    Inventors: Ismadi Bin Ismail, Valerian Yun Khim Chung, Alex Yucun Dou, Seok Kim Tay
  • Component carrier with electrically reliable bridge with sufficiently thick vertical thickness in through hole of thin dielectric
    Patent number: 10966318
    Abstract: A component carrier includes an electrically insulating layer structure having a first main surface and a second main surface with a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface. An electrically conductive bridge structure connects opposing sidewalls of the electrically insulating layer structure delimiting the through hole. A vertical thickness of the electrically insulating layer structure is not more than 200 ?m and a narrowest vertical thickness of the bridge structure is at least 20 ?m.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: March 30, 2021
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Ismadi Bin Ismail, Valerian Yun Khim Chung, Alex Yucun Dou, Seok Kim Tay
  • Component Carrier With Electrically Reliable Bridge With Sufficiently Thick Vertical Thickness in Through Hole of Thin Dielectric
    Publication number: 20200253053
    Abstract: A component carrier includes an electrically insulating layer structure having a first main surface and a second main surface with a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface. An electrically conductive bridge structure connects opposing sidewalls of the electrically insulating layer structure delimiting the through hole. A vertical thickness of the electrically insulating layer structure is not more than 200 ?m and a narrowest vertical thickness of the bridge structure is at least 20 ?m.
    Type: Application
    Filed: January 30, 2020
    Publication date: August 6, 2020
    Inventors: Ismadi Bin Ismail, Valerian Yun Khim Chung, Alex Yucun Dou, Seok Kim Tay
  • Component carrier comprising a copper filled multiple-diameter laser drilled bore
    Patent number: 10701793
    Abstract: A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore extends into the layer stack and has a first bore section with a first diameter (D1) and a connected second bore section with a second diameter (D2) differing from the first diameter (D1). A thermally conductive material fills substantially the entire bore. The bore is in particular formed by laser drilling.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: June 30, 2020
    Assignee: AT&S (China) Co., Ltd.
    Inventors: Nikolaus Bauer-Öppinger, ZhaoJian Chen, Yucun Dou, Wilhelm Tamm
  • Component Carrier Comprising a Copper Filled Multiple-Diameter Laser Drilled Bore
    Publication number: 20190215950
    Abstract: A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore extends into the layer stack and has a first bore section with a first diameter (D1) and a connected second bore section with a second diameter (D2) differing from the first diameter (D1). A thermally conductive material fills substantially the entire bore. The bore is in particular formed by laser drilling.
    Type: Application
    Filed: March 19, 2019
    Publication date: July 11, 2019
    Inventors: Nikolaus Bauer-Öppinger, ZhaoJian Chen, Yucun Dou, Wilhelm Tamm
  • Component carrier comprising a copper filled multiple-diameter laser drilled bore
    Patent number: 10278280
    Abstract: A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore extends into the layer stack and has a first bore section with a first diameter (D1) and a connected second bore section with a second diameter (D2) differing from the first diameter (D1). A thermally conductive material fills substantially the entire bore. The bore is in particular formed by laser drilling.
    Type: Grant
    Filed: January 28, 2017
    Date of Patent: April 30, 2019
    Assignee: AT&S (China) Co. Ltd.
    Inventors: Nikolaus Bauer-Öppinger, ZhaoJian Chen, Yucun Dou, Wilhelm Tamm
  • Component Carrier Comprising a Copper Filled Multiple-Diameter Laser Drilled Bore
    Publication number: 20170223820
    Abstract: A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore extends into the layer stack and has a first bore section with a first diameter (D1) and a connected second bore section with a second diameter (D2) differing from the first diameter (D1). A thermally conductive material fills substantially the entire bore. The bore is in particular formed by laser drilling.
    Type: Application
    Filed: January 28, 2017
    Publication date: August 3, 2017
    Inventors: Nikolaus Bauer-Öppinger, ZhaoJian Chen, Yucun Dou, Wilhelm Tamm