Abstract: A backlit-module-embedded illuminated keyswitch structure includes a baseplate, a mask film disposed below the baseplate and having a first coating configured to substantially reflect a light, a light guide sheet disposed at one side of the mask film and having a light source hole, a reflective layer disposed at one side of the light guide sheet opposite to the mask film and having an opening communicating with the light source hole, a top glue configured to connect the mask film and the light guide sheet around the light source hole, and a bottom glue configured to connect the light guide sheet and the reflective layer around the light source hole. The first coating covers the light source hole. In a stacked direction of the mask film, the light guide sheet, and the reflective layer, at least one of the top glue and the bottom glue overlaps the first coating.

Abstract: The disclosure provides an electrolyte composition and dye-sensitized solar cell using the same. The electrolyte composition includes a diionic liquid of Formula: Z?(X-Y-X)Z??, wherein X includes ammonium, imidazolium, pyridinium or phosphonium, Y is (CH2)n, n is an integer of 1-16, Z is I, and Z? is I, PF6, BF4, N(SO2CF3), NCS or N(CN)2.

Abstract: A chiller's performance tester includes two flowrate sensors, four temperature sensors, one current sensor, one voltage sensor, all sensors being externally connectable, and an enclosure in which a thermal energy calculation IC board, an electrical power calculation IC board, and a programmable logic controller are arranged. The enclosure has a front side to which a man-machine interface panel that displays measurement readings and provides function-related operations is mounted. The enclosure has a back side to which a socket-carrying panel that is connectable to cables of the sensors is mounted. Readings of flowrate, temperature, current, and voltage are transmitted to the programmable logic controller in which software is executed to compile and integrate these signals to be further transmitted to a computer for subsequent analysis and monitoring. Test of a water chiller is made simple and cost, man power, and working hours are saved.

Abstract: The present invention relates to a condenser tubes cleaning system for alleviating the common disadvantage of the prior arts includes a flow diverter, a first branch pipe, a second branch pipe, a three-way valve, a first one-way valve, a bypass pipe, a ball barrel, a liquid supply pipe, a cleaning ball supply pipe, a cleaning ball return pipe, a liquid return pipe, a second one-way valve, a normally open two-way valve, and a ball trap. Thus, the flow diverter is provided with the three-way valve, and the ball trap is provided with the normally open two-way valve, so that the flow diverter and the ball trap have a bypass function that the prior arts do not have, to maintain the constant flow rate in the main supply pipe and the main return pipe without increasing the electrical power load of the main circulating pump.

Abstract: A chiller's performance tester includes two flowrate sensors, four temperature sensors, one current sensor, one voltage sensor, all sensors being externally connectable, and an enclosure in which a thermal energy calculation IC board, an electrical power calculation IC board, and a programmable logic controller are arranged. The enclosure has a front side to which a man-machine interface panel that displays measurement readings and provides function-related operations is mounted. The enclosure has a back side to which a socket-carrying panel that is connectable to cables of the sensors is mounted. Readings of flowrate, temperature, current, and voltage are transmitted to the programmable logic controller in which software is executed to compile and integrate these signals to be further transmitted to a computer for subsequent analysis and monitoring. Test of a water chiller is made simple and cost, man power, and working hours are saved.

Abstract: The invention provides an electrolyte composition and dye-sensitized solar cell using the same. The electrolyte composition includes a diionic liquid of Formula: Z? (X—Y—X)Z?, wherein X includes ammonium, imidazolium, pyridinium or phosphonium, Y is (CH2)n, n is an integer of 1-16, Z is I, and Z? is I, PF6, BF4, N(SO2CF3), NCS or N(CN)2.

Abstract: The present invention relates to a condenser tubes cleaning system for alleviating the common disadvantage of the prior arts includes a flow diverter, a first branch pipe, a second branch pipe, a three-way valve, a first one-way valve, a bypass pipe, a ball barrel, a liquid supply pipe, a cleaning ball supply pipe, a cleaning ball return pipe, a liquid return pipe, a second one-way valve, a normally open two-way valve, and a ball trap. Thus, the flow diverter is provided with the three-way valve, and the ball trap is provided with the normally open two-way valve, so that the flow diverter and the ball trap have a bypass function that the prior arts do not have, to maintain the constant flow rate in the main supply pipe and the main return pipe without increasing the electrical power load of the main circulating pump.

Abstract: Free radical polymerization process for preparing polymers with low polydispersity index and polymers obtained thereby. The process includes polymerizing at least one reactive monomer with at least one initiator and at least one ionic liquid (serving as solvent) to obtain polymers having a low polydispersity index of less than 1.5, wherein the reactive monomer is a nitrogen-containing monomer. In addition, the free radical polymerization processes have reaction time within 3 hours.

Abstract: A common drain dual MOSFET chip scale package and a method of fabricating same are provided.

Abstract: An electronic package for containing at least a top packaging module vertically stacked on a bottom packaging module. Each of the packaging modules includes a semiconductor chip packaged and connected by via connectors and connectors disposed on a laminated board fabricated with a standard printed-circuit board process wherein the top and bottom packaging module further configured as a surface mountable modules for conveniently stacking and mounting to prearranged electrical contacts without using a leadframe. At least one of the top and bottom packaging modules is a multi-chip module (MCM) containing at least two semiconductor chips. At least one of the top and bottom packaging modules includes a ball grid array (BGA) for surface mounting onto the prearranged electrical contacts. At least one of the top and bottom packaging modules includes a plurality of solder bumps on one of the semiconductor chips for surface mounting onto the prearranged electrical contacts.

Abstract: This invention discloses an electronic package for containing a vertical semiconductor chip that includes a laminated board having a via connector and conductive traces distributed on multiple layers of the laminated board connected to the via connector. The semiconductor chip having at least one electrode connected to the conductive traces for electrically connected to the conductive traces at a different layer on the laminated board and the via connector dissipating heat generated from the vertical semiconductor. A ball grid array (BGA) connected to the via connector functioning as contact at a bottom surface of the package for mounting on electrical terminals disposed on a printed circuit board (PCB) wherein the laminated board having a thermal expansion coefficient in substantially a same range the PCB whereby the BGA having a reliable electrical contact with the electrical terminals.

Abstract: This invention discloses a power device package for containing, protecting and providing electrical contacts for a power transistor. The power device package includes a top and bottom lead frames for directly no-bump attaching to the power transistor. The power transistor is attached to the bottom lead frame as a flip-chip with a source contact and a gate contact directly no-bumping attaching to the bottom lead frame. The power transistor has a bottom drain contact attaching to the top lead frame. The top lead frame further includes an extension for providing a bottom drain electrode substantially on a same side with the bottom lead frame. In a preferred embodiment, the power device package further includes a joint layer between device metal of source, gate or drain and top or bottom lead frame, through applying ultrasonic energy.

Abstract: The present invention discloses an organic ionic compound having anti-viral activity and the method for antagonizing virus in vitro by putting the compounds in contact with the virus.

Abstract: Free radical polymerization process for preparing polymers with low polydispersity index and polymers obtained thereby. The process includes polymerizing at least one reactive monomer with at least one initiator and at least one ionic liquid (serving as solvent) to obtain polymers having a low polydispersity index of less than 1.5, wherein the reactive monomer is a nitrogen-containing monomer. In addition, the free radical polymerization processes have reaction time within 3 hours.

Abstract: The present invention discloses an organic ionic compound having anti-viral activity and the method for antagonizing virus in vitro by putting the compounds in contact with the virus.

Abstract: An electrical receptacle/connector having a releasable locking portion for securing most standard electrical male plugs in part is disclosed. The said receptacle/connector having relative positioned jut elements which accept and restrain the holes near the ends of the contact blades of a male plug; the male plug insert action is the same as mating with a non locking receptacle/connector. A locking release button is used to disengage the said jut element portion which constructed within the receptacle/connector to release the contact blades of the male plug, therefore to free the contact blades from said invention.

Abstract: An electrical receptacle/connector with a releasable locking portion is disclosed. The contacts of the said receptacle/connector for the straight terminal blades/prongs of most standard plugs have protrusion knobs of which locks in the holes of the blades/prongs once it is plugged in. A push release button is used to push aside the protrusion knobs/contacts away from the holes of the blades, to release the blades, allowing it to be freed. This invention uses the fact that most standard plugs have a hole near the end of each of its blades/prongs.