Abstract: A breast support has a supporting bracket being elastic, integrally formed as a single part, and having two arc-shaped frame plates. An outer end of each arc-shaped frame plate bends inwardly to form a holding portion. With the breast support, contact area between the breast support and two breasts of a wearer is greatly reduced. Thus, discomfort due to sweltering and sweating can be avoided. Moreover, the breast support is stably mounted on a chest of the wearer and holds lower portions of the two breasts. Therefore, the breast support does not fall from the wearer due to the loss of stickiness. Accordingly, the breast support is able to push the breasts upward and inward and prevents the breasts from expansion and sagging.

Abstract: A breast support has a supporting bracket being made of hard and elastic material, integrally formed as a single part, and having two arc-shaped frame plates. An outer end of each arc-shaped frame plate bends inwardly to form a holding portion. With the breast support, contact area between the breast support and two breasts of a wearer is greatly reduced. Thus, discomfort due to sweltering and sweating can be avoided. Moreover, the breast support is stably mounted on a chest of the wearer and holds lower portions of the two breasts. Therefore, the breast support does not fall from the wearer due to the loss of stickiness. Accordingly, the breast support is able to push the breasts upward and inward and prevents the breasts from expansion and sagging.

Abstract: A LED packaging method includes a procedure of placing a screen plate having stepped holes on a substrate carrying LED chips, a procedure of reversing the screen plate with respect to the substrate, and a procedure of packaging the LED chips with a first packaging adhesive and a second packaging adhesive by means of applying the first packaging adhesive to the small diameter portion of each stepped hole when the first side of the screen plate is attached to the substrate and then applying the second packaging adhesive to the big diameter portion of each stepped hole after the screen plate is reversed.

Abstract: A LED packaging method includes a procedure of placing a screen plate having stepped holes on a substrate carrying LED chips, a procedure of reversing the screen plate with respect to the substrate, and a procedure of packaging the LED chips with a first packaging adhesive and a second packaging adhesive by means of applying the first packaging adhesive to the small diameter portion of each stepped hole when the first side of the screen plate is attached to the substrate and then applying the second packaging adhesive to the big diameter portion of each stepped hole after the screen plate is reversed.