Abstract: A camera module is manufactured by attaching a lens module to an image sensor. The lens module includes at least one lens element which has a plurality of centers of curvature. A tilt angle of an imaging axis of the image sensor is determined, and a tilt angle of an optical axis of the lens module is also determined by using an optical device to identify locations of multiple centers of curvature of the at least one lens element included in the lens module. At least one of the lens module and the image sensor are then adjusted accordingly so that the imaging axis and the optical axis are aligned, and thereafter, the lens module is fixedly attached with respect to the image sensor to form the camera module.

Abstract: A bonding apparatus comprises a movable bond head collet, a reference marker configured to move with the bond head collet, a flip head collet, first and second imaging devices and an adjusting mechanism. In use, the first imaging device captures one or more images of the reference marker and the flip head collet, and the second imaging device captures one or more images of the reference marker and the bond head collet. The adjusting mechanism aligns a position of the bond head collet with a position of the flip head collet based on an offset that is determined from the images of the flip head collet, bond head collet and reference marker. The flip head collet retrieves an electrical component and transfers the electrical component to the bond head collet at the alignment position.

Abstract: Disclosed is a die bonding tool comprising: a rigid body; and a collet having a die-holding portion; wherein the collet is mechanically coupled to the rigid body by a flexible element which is configured to angularly deflect relative to the rigid body on application of a torque to the collet and/or to a die held by the collet. Also disclosed is a die bonding system comprising the die bonding tool, and an adhesive dispenser for a die bonding system.

Abstract: A bonding apparatus comprises a movable bond head collet, a reference marker configured to move with the bond head collet, a flip head collet, first and second imaging devices and an adjusting mechanism. In use, the first imaging device captures one or more images of the reference marker and the flip head collet, and the second imaging device captures one or more images of the reference marker and the bond head collet. The adjusting mechanism aligns a position of the bond head collet with a position of the flip head collet based on an offset that is determined from the images of the flip head collet, bond head collet and reference marker. The flip head collet retrieves an electrical component and transfers the electrical component to the bond head collet at the alignment position.

Abstract: Disclosed is a die bonding tool comprising: a rigid body; and a collet having a die-holding portion; wherein the collet is mechanically coupled to the rigid body by a flexible element which is configured to angularly deflect relative to the rigid body on application of a torque to the collet and/or to a die held by the collet. Also disclosed is a die bonding system comprising the die bonding tool, and an adhesive dispenser for a die bonding system.

Abstract: An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually leveled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.

Abstract: A semiconductor die is attached onto a substrate on a process platform during manufacturing of a semiconductor package. A dispenser dispenses an adhesive onto the substrate, and the semiconductor die is bonded onto the adhesive which has been dispensed onto the substrate with a bonding tool. Thereafter, a bond line thickness between a bottom surface of the semiconductor die and a top surface of the substrate on the process platform is measured using a measuring device.

Abstract: An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing is disclosed. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually levelled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.

Abstract: A die bonding apparatus and method is provided to automatically adjust a level of a die bonder to compensate for any physical changes occurring in the die bonder during bonding. A bond arm support is drivable to a bonding level to position a die onto a bonding surface, and a bond arm is slidably mounted to the bond arm support for holding and bonding the die. The bond arm is configured to be urged by the bonding surface to move relative to the bond arm support upon contact of the die onto the bonding surface. A measuring device is provided for determining a distance moved by the bond arm relative to the bond arm support during bonding, and a controller is responsive to the distance determined by the measuring device to change the bonding level to which the bond arm support is driven.

Abstract: A sensor is provided for the detection of a marker in a sample in which the sensor includes a high frequency 500 kHz-1 GHz piezoelectric ceramic resonator, with the system measuring resonant frequency change. In one embodiment, the piezoelectric sensor operates in the thickness extensional (TE) mode, with the high frequency and TE mode permitting fabrication of an exceptionally small size sensor capable of being arrayed in a handheld unit.

Abstract: A die bonding apparatus and method is provided to automatically adjust a level of a die bonder to compensate for any physical changes occurring in the die bonder during bonding. A bond arm support is drivable to a bonding level to position a die onto a bonding surface, and a bond arm is slidably mounted to the bond arm support for holding and bonding the die. The bond arm is configured to be urged by the bonding surface to move relative to the bond arm support upon contact of the die onto the bonding surface. A measuring device is provided for determining a distance moved by the bond arm relative to the bond arm support during bonding, and a controller is responsive to the distance determined by the measuring device to change the bonding level to which the bond arm support is driven.

Abstract: A hair clip comprises first and second elongate members moveable between open and closed configurations. One of the first and second elongate members mounts a plurality of notches, and the other of the elongate members mounts a plate, the plate and the plurality of notches being disposed laterally of one another, and in the closed position the plurality of notches are adjacent and substantially overlap the plate. In use hair is located between the first and second elongate member and the plate which serves to press the hair into the notches.

Abstract: The invention provides an apparatus for die attachment onto a substrate including non-metallic material, and metallic material that is adapted to receive a die having a eutectic coating. A heating conduit is provided through which the substrate is movable for heating the metallic material to a eutectic bonding temperature to facilitate bonding between the die and the metallic material at a die-attach position. An induction heating device at the die-attach position heats the metallic material of the substrate to the eutectic bonding temperature prior to attaching a die onto the metallic material.

Abstract: A walking device (10) comprising a body portion (11), defining a front, a rear and sides extending between the front and rear. A pair of legs (12) are disposed on each side of the body portion (11) and are connected at an upper end thereto and define a heel (18) at the other end. A foot (13) is disposed at the lower end of each leg (12). The legs (18) are connected to the body portion (11), by a pair of spaced-apart shafts (15, 16) and each shaft includes an eccentric end portion (15b, 16b), which is received in an opening formed in each respective leg (12). One of the openings (21) is a journal opening which confines the end portion (16b) to rotation relative to the leg (12), while the second opening (23) is formed as a slot and permits the end portion (15b) rotational and lengthwise movement within the opening (23) relative to the leg (12). Rotation of the pair of shafts (15, 16) causes the legs (12) to move in a walking motion, in generally opposite directions.

Abstract: A walking device 10 comprising a body portion 11, defining a front, a rear and sides extending between the front and rear. A pair of legs 12 are disposed on each side of the body portion 11 and are connected at an upper end thereto and define a heel 18 at the other end. A foot 13 is disposed at the lower end of each leg 12. The legs 18 are connected to the body portion 11, by a pair of spaced-apart shafts 15, 16 and each shaft includes an eccentric end portion 15b, 16b, which is received in an opening formed in each respective leg 12. One of the openings 21 is a journal opening which confines the end portion 16b to rotation relative to the leg 12, while the second opening 23 is formed as a slot and permits the end portion 15b rotational and lengthwise movement within the opening 23 relative to the leg 12. Rotation of the pair of shafts 15, 16 causes the legs 12 to move in a walking motion, in generally opposite directions.