Patents by Inventor Yuen Yew Kay

Yuen Yew Kay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process and support carrier for flexible substrates
    Patent number: 6581278
    Abstract: A substrate carrier which is used through beginning assembly operations such as solder reflow for attaching ball grid array devices to flexible substrates. The carrier includes a main structural support for centerly placing the substrate. The support member include two pairs of pins protruding from the support member to engage with a matching pair of datum apertures disposed inboard of the side edges of the substrate. A plurality of high temperature magnetic inserts are affixed into holes of the support member disposed parallel and outboard of the pins. The cover has two rows of apertures for engagement with the pins of the support member is attracted by the magnetic inserts forcing the outer periphery of the cover against the top surface of the substrate.
    Type: Grant
    Filed: January 16, 2001
    Date of Patent: June 24, 2003
    Assignee: St Assembly Test Service Ltd.
    Inventor: Yuen Yew Kay
  • Process carrier for flexible substrates
    Publication number: 20020093080
    Abstract: A substrate carrier which is used through beginning assembly operations such as solder reflow for attaching ball grid array devices to flexible substrates. The carrier includes a main structural support for centerly placing the substrate. The support member include two pairs of pins protruding from the support member to engage with a matching pair of datum apertures disposed inboard of the side edges of the substrate. A plurality of high temperature magnetic inserts are affixed into holes of the support member disposed parallel and outboard of the pins. The cover has two rows of apertures for engagement with the pins of the support member is attracted by the magnetic inserts forcing the outer periphery of the cover against the top surface of the substrate.
    Type: Application
    Filed: January 16, 2001
    Publication date: July 18, 2002
    Applicant: St Assembly Test Services Pte Ltd
    Inventor: Yuen Yew Kay