Patents by Inventor Yuexing Zhao
Yuexing Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7079354Abstract: A magnetic head including a second magnetic pole (P2 pole) that is fabricated upon a write gap layer that is deposited upon a flat surface. To achieve the flat surface, a P1 pole pedestal is formed upon the P1 pole layer with a sufficient thickness that the induction coil structure can be fabricated beneath the write gap layer. In the preferred embodiment, an etch stop layer is formed upon the P1 pole layer and an ion etching process is utilized to form the induction coil trenches in an etchable material that is deposited upon the etch stop layer. Following the fabrication of the induction coil structure a CMP process is conducted to obtain a polished flat surface upon which to deposit the write gap layer, and the P2 pole is then fabricated upon the flat write gap layer.Type: GrantFiled: August 14, 2000Date of Patent: July 18, 2006Assignee: Hitachi Global Storage Technologies Netherlands, B.V.Inventors: Robert E. Fontana, Richard Hsiao, Yuexing Zhao
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Patent number: 6949200Abstract: The magnetic head of the present invention, includes a second magnetic pole (P2 pole) that is fabricated upon a write gap layer that is deposited upon a flat surface. To achieve the flat surface, a P1 pole pedestal is formed upon the P1 pole layer with a sufficient thickness that the induction coil structure can be fabricated beneath the write gap layer. In the preferred embodiment, an etch stop layer is formed upon the P1 pole layer and an ion etching process is utilized to form the induction coil trenches in an etchable material that is deposited upon the etch stop layer. Following the fabrication of the induction coil structure a CMP process is conducted to obtain a polished flat surface upon which to deposit the write gap layer, and the P2 pole is then fabricated upon the flat write gap layer. The magnetic head of the present invention can be reliably fabricated with a more narrow P2 pole tip base width, such that data tracks written by the magnetic head are likewise narrower.Type: GrantFiled: June 30, 2003Date of Patent: September 27, 2005Assignee: Hitachi Global Storage Technologies Netherlands, B.V.Inventors: Robert E. Fontana, Richard Hsiao, Yuexing Zhao
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Patent number: 6927198Abstract: A cleaning solution, method, and apparatus for cleaning semiconductor substrates after chemical mechanical polishing of copper films is described. The present invention includes a cleaning solution which combines deionized water, an organic compound, and a fluoride compound in an acidic pH environment for cleaning the surface of a semiconductor substrate after polishing a copper layer. Such methods of cleaning semiconductor substrates after copper CMP alleviate the problems associated with brush loading and surface and subsurface contamination.Type: GrantFiled: August 12, 2003Date of Patent: August 9, 2005Assignee: Lam Research CorporationInventors: Liming Zhang, Yuexing Zhao, Diane J. Hymes, Wilbur C. Krusell
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Patent number: 6712679Abstract: An apparatus for improving performance of a wafer polishing apparatus is described. The apparatus includes a platen in a support assembly having a plurality of fluid channels and at least one region of altered topography positioned on a portion of the platen surface.Type: GrantFiled: August 8, 2001Date of Patent: March 30, 2004Assignee: Lam Research CorporationInventors: Travis R. Taylor, Cangshan Xu, Kevin T. Crofton, Eugene Yuexing Zhao
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Publication number: 20040033917Abstract: A cleaning solution, method, and apparatus for cleaning semiconductor substrates after chemical mechanical polishing of copper films is described. The present invention includes a cleaning solution which combines deionized water, an organic compound, and a fluoride compound in an acidic pH environment for cleaning the surface of a semiconductor substrate after polishing a copper layer. Such methods of cleaning semiconductor substrates after copper CMP alleviate the problems associated with brush loading and surface and subsurface contamination.Type: ApplicationFiled: August 12, 2003Publication date: February 19, 2004Applicant: Lam Research CorporationInventors: Liming Zhang, Yuexing Zhao, Diane J. Hymes, Wilbur C. Krusell
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Publication number: 20040001283Abstract: The magnetic head of the present invention, includes a second magnetic pole (P2 pole) that is fabricated upon a write gap layer that is deposited upon a flat surface. To achieve the flat surface, a P1 pole pedestal is formed upon the P1 pole layer with a sufficient thickness that the induction coil structure can be fabricated beneath the write gap layer. In the preferred embodiment, an etch stop layer is formed upon the P1 pole layer and an ion etching process is utilized to form the induction coil trenches in an etchable material that is deposited upon the etch stop layer. Following the fabrication of the induction coil structure a CMP process is conducted to obtain a polished flat surface upon which to deposit the write gap layer, and the P2 pole is then fabricated upon the flat write gap layer.Type: ApplicationFiled: June 30, 2003Publication date: January 1, 2004Inventors: Robert E. Fontana, Richard Hsiao, Yuexing Zhao
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Patent number: 6593282Abstract: A cleaning solution, method, and apparatus for cleaning semiconductor substrates after chemical mechanical polishing of copper films is described. The present invention includes a cleaning solution which combines deionized water, an organic compound, and an ammonium compound in an acidic pH environment for cleaning the surface of a semiconductor substrate after polishing a copper layer. Such methods of cleaning semiconductor substrates after copper CMP alleviate the problems associated with brush loading and surface and subsurface contamination.Type: GrantFiled: March 9, 1998Date of Patent: July 15, 2003Assignee: Lam Research CorporationInventors: Xu Li, Yuexing Zhao, Diane J. Hymes, John M. de Larios
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Patent number: 6552812Abstract: A method and system for measuring threshold length of a planarization process, and for comparing the planarization abilities of such processes. The method and system measure a thickness profile of a film on a blanket wafer, and from the thickness profile, a threshold length is calculated.Type: GrantFiled: August 10, 2000Date of Patent: April 22, 2003Assignee: Lam Research CorporationInventors: Cangshan Xu, Yuexing Zhao
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Publication number: 20030032379Abstract: An apparatus for improving performance of a wafer polishing apparatus is described. The apparatus includes a platen in a support assembly having a plurality of fluid channels and at least one region of altered topography positioned on a portion of the platen surface.Type: ApplicationFiled: August 8, 2001Publication date: February 13, 2003Applicant: Lam Research CorportionInventors: Travis R. Taylor, Cangshan Xu, Kevin T. Crofton, Eugene Yuexing Zhao
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Patent number: 6479443Abstract: A cleaning solution for cleaning a semiconductor substrate is formed by mixing an amount of citric acid, an amount of ammonium fluoride, and an amount of hydrogen fluoride in deionized water. In one embodiment, the amount of citric acid is in a range from about 0.09% by weight to about 0.11% by weight, the amount of ammonium fluoride is in a range from about 0.4% by weight to about 0.6% by weight, the amount of hydrogen fluoride is in a range from about 0.09% by weight to about 0.11% by weight, and the cleaning solution has a pH of about 4. A method for cleaning a semiconductor substrate having a polished copper layer in which a concentrated cleaning solution is mixed with deionized water proximate to a scrubbing apparatus also is described.Type: GrantFiled: May 9, 2000Date of Patent: November 12, 2002Assignee: Lam Research CorporationInventors: Liming Zhang, Yuexing Zhao, Diane J. Hymes, Wilbur C. Krusell
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Publication number: 20020077260Abstract: A cleaning solution for cleaning a semiconductor substrate is formed by mixing an amount of citric acid and an amount of ammonia in deionized water. In one embodiment, the amount of citric acid is in a range from about 0.18% by weight to about 0.22% by weight and the amount of ammonia is in a range from about 0.0225% by weight to about 0.0275% by weight, and the cleaning solution has a pH of about 4. A method for cleaning a semiconductor substrate having a polished copper layer in which a concentrated cleaning solution is mixed with deionized water proximate to a scrubbing apparatus also is described.Type: ApplicationFiled: August 31, 2001Publication date: June 20, 2002Inventors: Xu Li, Yuexing Zhao, Diane J. Hymes, John M. de Larios
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Patent number: 6303551Abstract: A cleaning solution for cleaning a semiconductor substrate is formed by mixing an amount of citric acid and an amount of ammonia in deionized water. In one embodiment, the amount of citric acid is in a range from about 0.18% by weight to about 0.22% by weight and the amount of ammonia is in a range from about 0.0225% by weight to about 0.0275% by weight, and the cleaning solution has a pH of about 4. A method for cleaning a semiconductor substrate having a polished copper layer in which a concentrated cleaning solution is mixed with deionized water proximate to a scrubbing apparatus also is described.Type: GrantFiled: May 9, 2000Date of Patent: October 16, 2001Assignee: Lam Research CorporationInventors: Xu Li, Yuexing Zhao, Diane J. Hymes, John M. de Larios
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Patent number: 6294027Abstract: A cleaning solution, method, and apparatus for cleaning semiconductor substrates after chemical mechanical polishing of copper films is described. The present invention includes a cleaning solution which combines deionized water, an organic compound, and an ammonium compound in an acidic pH environment for cleaning the surface of a semiconductor substrate after polishing a copper layer. Such methods of cleaning semiconductor substrates after copper CMP alleviate the problems associated with brush loading and surface and subsurface contamination.Type: GrantFiled: January 7, 1999Date of Patent: September 25, 2001Assignee: Lam Research CorporationInventors: Xu Li, Yuexing Zhao, Diane J. Hymes, John M. de Larios
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Patent number: 6165956Abstract: A cleaning solution, method, and apparatus for cleaning semiconductor substrates after chemical mechanical polishing of copper films is described. The present invention includes a cleaning solution which combines deionized water, an organic compound, and a fluoride compound in an acidic pH environment for cleaning the surface of a semiconductor substrate after polishing a copper layer. Such methods of cleaning semiconductor substrates after copper CMP alleviate the problems associated with brush loading and surface and subsurface contamination.Type: GrantFiled: October 21, 1997Date of Patent: December 26, 2000Assignee: Lam Research CorporationInventors: Liming Zhang, Yuexing Zhao, Diane J. Hymes, Wilbur C. Krusell
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Patent number: 6162301Abstract: A cleaning solution, method, and apparatus for cleaning semiconductor substrates after chemical mechanical polishing of copper films is described. The present invention includes a cleaning solution which combines deionized water, an organic compound, and a fluoride compound in an acidic pH environment for cleaning the surface of a semiconductor substrate after polishing a copper layer. Such methods of cleaning semiconductor substrates after copper CMP alleviate the problems associated with brush loading and surface and subsurface contamination.Type: GrantFiled: January 7, 1999Date of Patent: December 19, 2000Assignee: Lam Research CorporationInventors: Liming Zhang, Yuexing Zhao, Diane J. Hymes, Wilbur C. Krusell