Patents by Inventor Yuh-Shiuan LIU

Yuh-Shiuan LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11856728
    Abstract: A liquid cooling device includes a heat dissipation shell and a dual fin module. The heat dissipation shell includes a cooling cavity, and the dual fin module is fixed in the cooling cavity to separate the cooling cavity into an upper cooling space and a lower cooling space, so that a cooling fluid enters the cooling cavity and flows into the upper cooling space and the lower cooling space to cool a chip in the lower cooling space.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: December 26, 2023
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Chien-Yu Chen, Wei-Hao Chen, Yuh-Shiuan Liu
  • Publication number: 20220141998
    Abstract: A liquid cooling device includes a heat dissipation shell and a dual fin module. The heat dissipation shell includes a cooling cavity, and the dual fin module is fixed in the cooling cavity to separate the cooling cavity into an upper cooling space and a lower cooling space, so that a cooling fluid enters the cooling cavity and flows into the upper cooling space and the lower cooling space to cool a chip in the lower cooling space.
    Type: Application
    Filed: October 29, 2021
    Publication date: May 5, 2022
    Inventors: Chien-Yu CHEN, Wei-Hao CHEN, Yuh-Shiuan LIU