Patents by Inventor Yuhao Sun

Yuhao Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11941047
    Abstract: Embodiments of the present disclosure provide a music playing method and device, where the method includes: receiving a first operation instruction in a first application with a function of video playing; and invoking a music player to play music in the first application in response to the first operation instruction. According to the embodiments of the present disclosure, music can be played in a first application through a first operation instruction of a user, avoiding that the user exits from the first application and then enters the music application to play music, and reducing an operation complexity of the user.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: March 26, 2024
    Assignee: BEIJING ZITIAO NETWORK TECHNOLOGY CO., LTD.
    Inventors: Yuhao Yang, Peng Chen, Hai Ning, Lei Sun, Niwen Zheng, Yanjingjing Gao
  • Publication number: 20230336901
    Abstract: This application discloses a wind noise suppression device including a first woven mesh (101), a second woven mesh (102), a device housing (103), and a structural component (104). The device housing (103) is provided with a sound pickup hole (1031). The first woven mesh (101) covers the sound pickup hole (1031). The structural component (104) is disposed at the sound pickup hole (1031). The structural component (104) is connected to the device housing (103) to form a cavity. The structural component (104) is provided with a sound transmission hole (1041). The second woven mesh (102) covers the sound transmission hole (1041). A microphone is disposed at the sound transmission hole (1041). Because structural characteristics of all the components the device, wind noise included in an audio signal received by the microphone through the sound transmission hole (1041) is effectively reduced.
    Type: Application
    Filed: June 23, 2023
    Publication date: October 19, 2023
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yuhao SUN, Yulong LI, Fan FAN, Xiaowei YU, Xiaohong YANG, Yangshan OU
  • Publication number: 20230139831
    Abstract: To extract necessary information, documents are received, converted to text, and stored in a database. A request for information is then received, and relevant documents and/or document passages are selected from the stored documents. The needed information is then extracted from the relevant documents. The various processes use one or more artificial intelligence (AI), image processing, and/or natural language processing (NLP) techniques.
    Type: Application
    Filed: September 30, 2021
    Publication date: May 4, 2023
    Inventors: Wensu Wang, Kuikui Gao, Yuhao Sun, Hao Peng
  • Publication number: 20230096586
    Abstract: A region division includes: determining a plurality of merchants in a target region, and constructing a merchant relationship network of the target region according to merchant information of the plurality of merchants, the merchant information including geographic information of the merchants, and the merchant relationship network being used for identifying an association relationship among the plurality of merchants; determining business districts corresponding to the plurality of merchants based on the merchant relationship network; and determining a business district boundary of each business district according to the geographic information of the merchants included in each business district.
    Type: Application
    Filed: December 6, 2022
    Publication date: March 30, 2023
    Inventors: Jixuan CAI, Hong LIU, Yuhao SUN, Lingying ZENG
  • Publication number: 20230080298
    Abstract: Active noise cancellation method is provided, including: when the headset is in an ANC working mode, obtaining a first group of filtering parameters, and performing noise cancellation by using the first group of filtering parameters. The first group of filtering parameters is one of N1 groups of filtering parameters prestored in the headset. The N1 groups of filtering parameters are respectively used to perform noise cancellation on ambient sound in N1 leakage states. The N1 leakage states are formed by the headset and N1 different ear canal environments. In a current wearing state of the headset, for same ambient noise, noise cancellation effect obtained when the first group of filtering parameters is applied to the headset is better than noise cancellation effect obtained when another filtering parameter in the N1 groups of filtering parameters is applied to the headset. N1 is a positive integer greater than or equal to 2.
    Type: Application
    Filed: November 14, 2022
    Publication date: March 16, 2023
    Inventors: Xiaowei Yu, Yulong Li, Fan Fan, JingFan Qin, Xiaohong Yang, Yangshan Ou, Yuhao Sun
  • Publication number: 20220301072
    Abstract: Methods, systems, and apparatuses, including computer programs encoded on computer storage media, are provided for processing claims using both unstructured and structured policy documents, claim data, and customer and policy data, in conjunction with automatic requests for human intervention. Policy rules, benefit calculation formulae, necessary data points, and benefit requirements are extracted from policy documents using NLP and AI techniques. Unstructured claim data is converted to a structured form using natural language processing, information extraction, and AI techniques to identify and extract relevant information, including values for the data points and benefit conditions, then the combined structured data and converted unstructured data is processed to get all values for the data points and applicable benefit conditions.
    Type: Application
    Filed: June 9, 2022
    Publication date: September 22, 2022
    Inventors: Wensu Wang, Yuhao Sun
  • Patent number: 11313010
    Abstract: A method of forming a part from sheet metal and a part formed by said method. The method comprising the steps of: (a) heating a metal sheet to a temperature T; and (b) forming the sheet into the part between dies while applying cooling means to the sheet, where in step a) the metal sheet is heated at a rate of at least 50° C.·s?1, and temperature T is above a critical forming temperature and does not exceed a critical microstructure change temperature of said metal sheet.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: April 26, 2022
    Assignee: IMPERIAL COLLEGE INNOVATIONS LIMITED
    Inventors: Li-Liang Wang, Omer Elfakir, Yuhao Sun, Kang Ji, Zhaoheng Cai, Xi Luan, Xiaochuan Liu
  • Publication number: 20200208236
    Abstract: A method of forming a part from sheet metal and a part formed by said method. The method comprising the steps of: (a) heating a metal sheet to a temperature T; and (b) forming the sheet into the part between dies while applying cooling means to the sheet, where in step a) the metal sheet is heated at a rate of at least 50° C.s?1, and temperature T is above a critical forming temperature and does not exceed a critical microstructure change temperature of said metal sheet.
    Type: Application
    Filed: August 23, 2018
    Publication date: July 2, 2020
    Applicant: IMPERIAL COLLEGE INNOVATIONS LIMITED
    Inventors: Li-Liang WANG, Omer ELFAKIR, Yuhao SUN, Kang JI, Zhaoheng CAI, Xi LUAN, Xiaochuan LIU
  • Publication number: 20170004901
    Abstract: Structures and manufacturing processes of an ACF array and more particularly a non-random particles are transferred to the array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles surface-treated with a block copolymer composition onto a substrate or carrier web comprising a predetermined array of microcavities. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film.
    Type: Application
    Filed: July 15, 2016
    Publication date: January 5, 2017
    Applicant: Trillion Science, Inc.
    Inventors: Rong-Chang Liang, Yuhao Sun, Zhiyao An
  • Patent number: 9102851
    Abstract: A method for fabricating an electronic device or component such as an anisotropic conductive film comprising: distributing a plurality of conductive particles into an array of microcavities formed on a surface of a continuous carrier belt, rotating the belt carrying the conductive particles while conveying a surface of an adhesive layer into contact with the surface of the rotating belt, transferring the conductive particles from the microcavities on the belt to the adhesive layer in predefined locations in the adhesive layer corresponding to the array of microcavities on the belt, and separating the adhesive layer from the surface of the belt. In one embodiment, the position of the microcavities is varied in a controlled manner.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: August 11, 2015
    Assignee: Trillion Science, Inc.
    Inventors: Jiannrong Lee, Yuhao Sun, Maung Kyaw Aung, Chin-Jen Tseng, Chiapu Chang, Shuji Rokutanda, Rong-Chang Liang
  • Publication number: 20150072109
    Abstract: Structures and manufacturing processes of an ACF array and more particularly a non-random particles are transferred to the array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles surface-treated with a block copolymer composition onto a substrate or carrier web comprising a predetermined array of microcavities. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film.
    Type: Application
    Filed: September 10, 2013
    Publication date: March 12, 2015
    Applicant: TRILLION SCIENCE, INC.
    Inventors: Rong-Chang Liang, Yuhao Sun, Zhiyao An
  • Publication number: 20140312501
    Abstract: Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, of selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution.
    Type: Application
    Filed: May 20, 2014
    Publication date: October 23, 2014
    Applicant: TRILLION SCIENCE INC.
    Inventors: Rong-Chang Liang, Hsiao-Ken Chuang, Jerry Chung, Chin-Jen Tseng, Shuji Rokutanda, Yuhao Sun
  • Patent number: 8802214
    Abstract: Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, or selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution.
    Type: Grant
    Filed: October 29, 2009
    Date of Patent: August 12, 2014
    Assignee: Trillion Science, Inc.
    Inventors: Rong-Chang Liang, Jerry Chung, Chinjen Tseng, Shuji Rokutanda, Yuhao Sun, Hsiao-Ken Chuang
  • Publication number: 20140141195
    Abstract: An anisotropic conductive film (ACF) comprising: (a) an adhesive layer having a substantially uniform thickness; and (b) a plurality of conductive particles individually adhered to the adhesive layer, wherein the conductive particles include a first non-random array of particle sites partially embedded at a first depth within the adhesive layer and a second fixed non-random array or dispersion of conductive particles partially embedded at a second depth or a dispersion of conductive particles fully embedded within the adhesive layer, wherein the first depth and the second depth are distinctly different. The ACF may be supplied as a sheet, a continuous film or as a roll and the multi-tier morphology may be present throughout the length of the product or in select areas.
    Type: Application
    Filed: November 16, 2012
    Publication date: May 22, 2014
    Inventors: Rong-Chang Liang, Maung Kyaw Aung, Yuhao Sun, An-Yu Ma
  • Publication number: 20130146816
    Abstract: An adhesive composition comprising a phenoxy resin, a latent hardener, an acrylic block co-polymer dispersant and a weak solvent wherein the dispersant enables the phenoxy resin to be dispersed in a weak solvent that does not attack the latent hardener thereby providing a composition with good shelf life. The compositions are useful in making anisotropic conductive films.
    Type: Application
    Filed: February 7, 2013
    Publication date: June 13, 2013
    Applicant: Trillion Science Inc.
    Inventors: Rong-Chang Liang, Yuhao Sun, Chin-Jen Tseng
  • Publication number: 20130071636
    Abstract: A method for fabricating an electronic device or component such as an anisotropic conductive film comprising: distributing a plurality of conductive particles into an array of microcavities formed on a surface of a continuous carrier belt, rotating the belt carrying the conductive particles while conveying a surface of an adhesive layer into contact with the surface of the rotating belt, transferring the conductive particles from the microcavities on the belt to the adhesive layer in predefined locations in the adhesive layer corresponding to the array of microcavities on the belt, and separating the adhesive layer from the surface of the belt. In one embodiment, the position of the microcavities is varied in a controlled manner.
    Type: Application
    Filed: September 15, 2011
    Publication date: March 21, 2013
    Applicant: TRILLION SCIENCE, INC.
    Inventors: Jiannrong Lee, Yuhao Sun, Maung Kyaw Aung, Chin-Jen Tseng, Chiapu Chang, Shuji Rokutanda, Rong-Chang Liang
  • Publication number: 20110253943
    Abstract: An adhesive composition comprising: (i) a one part curable epoxy adhesive and (ii) a low profile additive (LPA), the low profile additive being a polymer that is compatible with the epoxy adhesive such that it forms a single phase when admixed with the adhesive composition and that separates from the adhesive to form a network of stress-absorbing nodules therein when the adhesive is cured, the low profile additive being present in an amount sufficient to prevent or reduce shrinkage and/or the formation of voids or cracks when the adhesive is cured. In one embodiment the LPA is a block copolymer including at least one flexible block and at least one rigid block that makes the low profile additive compatible with the epoxy adhesive such that a mixture of the uncured epoxy resin and the low profile additive forms a homogenous solution and as the epoxy resin is cured, the low profile additive forms a stress absorbing network of nodules in the cured epoxy resin matrix.
    Type: Application
    Filed: April 19, 2010
    Publication date: October 20, 2011
    Applicant: TRILLION SCIENCE, INC.
    Inventors: Rong-Chang Liang, Yuhao Sun, Hua Song, Chin-Jen Tseng, Hsiao Ken Chuang
  • Publication number: 20100101700
    Abstract: Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, or selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution.
    Type: Application
    Filed: October 29, 2009
    Publication date: April 29, 2010
    Applicant: Trillion Science Inc.
    Inventors: Rong-Chang Liang, Jerry Chung, Chinjen Tseng, Shuji Rokutanda, Yuhao Sun, Hsiao-Ken Chuang