Abstract: A composite microwave circuit module includes a multilayer dielectric substrate, upper- and lower-surface grounds, an antenna pattern, a plurality of shield via holes, and a large number of first holes. The upper- and lower-surface grounds are formed on upper and lower surfaces of the multilayer dielectric substrate, respectively, and the upper-surface ground has an opening portion for waveguide coupling. The antenna pattern is formed on an interlayer of the multilayer dielectric substrate by a high-frequency signal line in correspondence with the opening portion. The plurality of shield via holes are formed around the antenna pattern and filled with a filler material to form a pseudo waveguide structure. The first holes have cavities formed in the multilayer dielectric substrate in correspondence with the pseudo waveguide structure between the antenna pattern and the opening portion of the upper-surface substrate. A method of manufacturing this circuit module is also disclosed.

Abstract: A high-frequency device package includes a base, a high-frequency device mounted on the base and having a power supply electrode, a signal electrode, and a ground electrode disposed on a surface thereof, a plurality of leads electrically connected respectively to the power supply electrode, the signal electrode, and the ground electrode using a tape carrier, and a resin body sealingly encasing the high-frequency device. The resin body is formed by dropping a molten resin mass onto the base in covering relation to the high-frequency device and thereafter solidifying the dropped resin mass to sealingly encase the high-frequency device.

Abstract: A composite microwave circuit module includes a multilayer dielectric substrate, upper- and lower-surface grounds, an antenna pattern, a plurality of shield via holes, and a large number of first holes. The upper- and lower-surface grounds are formed on upper and lower surfaces of the multilayer dielectric substrate, respectively, and the upper-surface ground has an opening portion for waveguide coupling. The antenna pattern is formed on an interlayer of the multilayer dielectric substrate by a high-frequency signal line in correspondence with the opening portion. The plurality of shield via holes are formed around the antenna pattern and filled with a filler material to form a pseudo waveguide structure. The first holes have cavities formed in the multilayer dielectric substrate in correspondence with the pseudo waveguide structure between the antenna pattern and the opening portion of the upper-surface substrate. A method of manufacturing this circuit module is also disclosed.

Abstract: A protecting device is for use in protecting a radio communication device (15) under high and low temperature. The protecting device comprises a cover member (31) of a heat insulator that defines a room therein. The radio communication device is located in the room. First and second opening portions (31a, 31b) are formed at the cover member. The first opening portion may be opposite to the second opening portion. Each of the first and the second opening portions has a predetermined opening area. The protecting device further comprises first and second damper members (32a, 32b) and has first and second driving sections (33a, 33b, 34a, 34b). The first driving section drives the first damper member in accordance with a room temperature to make the first damper member vary the predetermined opening area into a variable opening area in the first opening portion. The variable opening area is smaller than the predetermined opening area.

Abstract: A radio transceiver having an integrated transmitter and receiver for transmitting and receiving microwaves or higher frequency electromagnetic waves is one of a series of device products corresponding to different transmission output power capacities. In this invented series of device products, a radio transceiver which is of a minimum size to meet its transmission output power requirement without an amplifier is composed of entirely standardized basic components, a transmission module, a reception module, and a transmission and reception shared circuit which are housed in a heat radiating housing case irrespective of different transmission output power requirements. Corresponding to the transmission output power requirement, a power amplifier is added to the basic components.

Abstract: A packaging structure for a microwave circuit having excellent heat radiation and obviating an intricate and large-sized shielding case is provided, the packaging structure comprising a circuit module accommodating internally a semiconductor element and a mother substrate 10; the circuit module 1 having two grounding conductor layers, a center conductor layer inserted therebetween, center conductor electrodes connected to the center conductor, grounding conductor electrodes disposed in the vicinity thereof, on one of its surfaces, and a thermal spreading plate connected to the other surface; the mother substrate 10 having two grounding conductor layers, a center conductor layer inserted therebetween, center conductor electrodes, grounding electrodes disposed on one of its surfaces, wherein the circuit module and the mother substrate are bonded so as to have the mutual electrodes joined directly facing with each other; a heat conductive elastomer is inserted between the thermal spreading plate and a heat radia

Abstract: A composite microwave circuit module assembly has a dielectric substrate which is formed by a lower layer, an intermediate layer and an upper layer. The lower layer and the upper layer include a lower ground surface and an upper ground surface, respectively, and the intermediate layer includes a radio frequency signal circuit formed by an active circuit element and a passive circuit element. A number of via-holes filled with metal are arranged along the radio frequency signal circuit to short-circuit the upper ground surface and the lower ground surface so as to shield the radio frequency signal circuit. An element mounting cavity is disposed on the intermediate layer with a portion of dielectric above the intermediate layer being removed, and the active circuit element is mounted on an element mounting land in the cavity. The cavity is covered by a conductor plate member.

Abstract: Assembling and checking microwave circuit modules is accomplished by storing results of checks of active elements after the manufacture, determining a combination of active elements according to the stored results or data, calculating the characteristic value of the determined combination according to the results of checks of the active elements in the combination, computing, if the calculated characteristic value is out of a predetermined range, a content and an amount of adjustment to be made in a substrate so as to correct the characteristic value to be in the predetermined range, and adjusting the substrate according to the result of computation. By selecting an appropriate combination, the chips whose characteristic value falls outside of the predetermined range are saved from being discarded, so that a low cost microwave circuit module can be obtained at a high overall yield.

Abstract: A microwave circuit component (40) has terminals and is mounted on a principal surface (38) of a substrate (34) received in a cavity (45) of a housing (35) with a additional surface (39) brought into contact with a bottom surface (44) of the cavity. With a part projected outwardly of the cavity for connection to an external conductor, a contact pin (36) is movably received in an insulator support member (37) placed in the cavity and is urged to one of the terminals. It is possible to bring the principal surface into contact with the bottom surface. In this event, the contact pin may be urged to the additional surface with the terminal extended from the principal surface to the back surface.

Abstract: In a branching filter, a transmit filter (14) is divided into first and second transmit filter parts (17, 18). A waveguide branching filter (15) is divided into first and second branching filter parts (19, 20). A receive filter (16) is divided into first and second receive filter parts (21, 22). The first transmit filter part is assembled with the second branching filter part and the second receive filter part. The second branching filter part is assembled with the second receive filter part. The first branching filter part is assembled with the first receive filter part. Alternative assembly is possible. As a further alternative, an installation hole may be formed in the branching filter for removable installation of a cable and be covered with a cover with a packing interposed for hermetic seal and waterproofing.

Abstract: A dielectric resonator filter applicable to any desired frequency which is required with a microwave band or a millimeter wave band communication apparatus is disclosed. A single base plate made of metal carries therewith a single or a plurality of dielectric resonators, a pair of input/output coupling members, and a pair of input/output connectors all of which are arranged directly on the base plate in a planar configuration. This base plate subassembly is shielded by a cover having a recess in a sectional view which serves as a cutoff range waveguide.

Abstract: In a microwave connector assembly for electrical connection of adjacent ones of microwave circuit components, an internal conductor is accommodated in a cavity formed by an external conductor member and is supported by an insulator support member within the cavity. The internal conductor is operable as a leaf spring and elastically brought into contact with a pair of contacts fixed to radio frequency terminals of the adjacent microwave circuit components. The external conductor member may be formed either by a base plate for mounting the circuit components or by a conductive case which is covered with a conductive cap and which is located in an opening of the base plate. A print board may mechanically be attached to the base plate so as to supply a bias voltage to each circuit component through bias terminals thereof.

Abstract: A high frequency connector for interconnecting a microstrip circuit and an external circuit. That portion of a center conductor which is adjacent to the microstrip circuit is deviated from the axis of the connector and resiliently supported, thereby eliminating an intermediary element for interconnection to promote easy and positive interconnection. The connector is desirably applicable to TEM mode waves lying in the frequency band of 0.3-30 GHz.

Abstract: An ultrahigh frequency switch is disclosed which features a desirable frequency characteristic, significantly short switching time, and small-size construction. Impedance conversion members serving as input and output terminals are connected between a waveguide and an opening and closing switch section. An elongate and flat movable center conductor in a strip-line configuration is driven from the outside to in turn open and close the impedance conversion members, thereby opening and closing the circuit.

Abstract: A microwave switch with mechanical contacts which is applicable to a microwave band or a millimeter-wave band and shortens a switching time. An axial displacement of an electroexpansive element (36) caused by a voltage which is applied from the outside is magnified by two levers (38.sub.1, 38.sub.2). A pair of leaf springs (48.sub.1, 48.sub.2) are moved parallel to and in opposite directions to each other responsive to the magnified displacement of the electroexpansive element (36), so that a connecting member (50) which is connected to the leaf springs (48.sub.1, 48.sub.2) is driven in a rotational motion. In response to the rotational motion of the member (50), another leaf spring (52) connected to the member (50) moves two movable rods (31.sub.1, 32.sub.2 ) and, thereby, center conductors (30.sub.1, 30.sub.2) carried respectively by the rods (32.sub.1, 32.sub.2) in opposite directions to each other. This allows a stationary common contact (28.sub.