Abstract: A tire inspection device includes a gas sensor disposed outside of a tire and facing an outer surface of the tire. The gas sensor detects a gas that fills the tire.

Abstract: There is provided a gas sensor fault detection device that detects a sensor fault in a gas leak inspection device. The gas sensor fault detection device includes: a gas blowing unit that blows a gas toward a detection area of a gas sensor of the gas leak inspection device; and a position fixing unit that fixes a position of the gas blowing unit with reference to a hypothetical gas leak position of an inspection target being inspected by the gas leak inspection device.

Abstract: A tire inspection device includes a gas sensor disposed outside of a tire and facing an outer surface of the tire. The gas sensor detects a gas that fills the tire.

Abstract: A tire inspection device includes a gas sensor disposed outside of a tire and facing an outer surface of the tire. The gas sensor detects a gas that fills the tire.

Abstract: A wheeled tire includes a tire, and a wheel disposed on the tire. A space between the tire and the wheel is filled with a filler gas. The filler gas includes nitrogen gas having a concentration equal to or greater than a concentration of nitrogen gas in air, and hydrogen gas having a concentration of 0.5% or more. A concentration of oxygen gas in the filler gas is less than a concentration of oxygen gas in air.

Abstract: A mixed gas supply device includes: a hydrogen gas generation unit that includes a hydrogen generator, the hydrogen generator generating hydrogen gas by decomposition of water and supplying the hydrogen gas; a nitrogen gas generation unit that includes a filter, the filter separating nitrogen gas from air and supplying the nitrogen gas; a gas mixing unit that mixes the supplied hydrogen gas and the supplied nitrogen gas and generates mix gas including the hydrogen gas and the nitrogen gas; and a single base on which the hydrogen gas generation unit, the nitrogen gas generation unit, and the gas mixing unit are mounted, the hydrogen gas generation unit, the nitrogen gas generation unit, and the gas mixing unit being integrated. The gas mixing unit supplies the generated mixed gas to outside.

Abstract: A wheeled tire includes a tire, and a wheel disposed on the tire. A space between the tire and the wheel is filled with a filler gas. The filler gas includes nitrogen gas having a concentration equal to or greater than a concentration of nitrogen gas in air, and hydrogen gas having a concentration of 0.5% or more. A concentration of oxygen gas in the filler gas is less than a concentration of oxygen gas in air.

Abstract: A tire inspection device includes a gas sensor disposed outside of a tire and facing an outer surface of the tire. The gas sensor detects a gas that fills the tire.

Abstract: There is provided a gas sensor fault detection device that detects a sensor fault in a gas leak inspection device. The gas sensor fault detection device includes: a gas blowing unit that blows a gas toward a detection area of a gas sensor of the gas leak inspection device; and a position fixing unit that fixes a position of the gas blowing unit with reference to a hypothetical gas leak position of an inspection target being inspected by the gas leak inspection device.

Abstract: A mixed gas supply device includes: a hydrogen gas generation unit that includes a hydrogen generator, the hydrogen generator generating hydrogen gas by decomposition of water and supplying the hydrogen gas; a nitrogen gas generation unit that includes a filter, the filter separating nitrogen gas from air and supplying the nitrogen gas; a gas mixing unit that mixes the supplied hydrogen gas and the supplied nitrogen gas and generates mix gas including the hydrogen gas and the nitrogen gas; and a single base on which the hydrogen gas generation unit, the nitrogen gas generation unit, and the gas mixing unit are mounted, the hydrogen gas generation unit, the nitrogen gas generation unit, and the gas mixing unit being integrated. The gas mixing unit supplies the generated mixed gas to outside.

Abstract: A substrate placing position adjusting method which acquires data on a substrate placing position where a substrate carrying unit is required to place a substrate on a substrate holding device capable of rotating about a vertical axis and included in a processing unit for processing a substrate substantially horizontally held by the substrate holding device, said substrate placing position adjusting method comprising the steps of: transferring a jig from the substrate carrying unit to the substrate holding device; measuring centrifugal acceleration imparted to a measuring position in the jig when the substrate holding device holding the jig is rotated at a fixed angular velocity; and calculating an eccentricity of the measuring position from a rotation center of the substrate holding device on the basis of a centrifugal acceleration.

Abstract: A substrate placing position adjusting method which acquires data on a substrate placing position where a substrate carrying unit is required to place a substrate on a substrate holding device capable of rotating about a vertical axis and included in a processing unit for processing a substrate substantially horizontally held by the substrate holding device, said substrate placing position adjusting method comprising the steps of: transferring a jig from the substrate carrying unit to the substrate holding device; measuring centrifugal acceleration imparted to a measuring position in the jig when the substrate holding device holding the jig is rotated at a fixed angular velocity; and calculating an eccentricity of the measuring position from a rotation center of the substrate holding device on the basis of a centrifugal acceleration.

Abstract: In a substrate processing system for processing a substrate, such as a wafer W, held by a substrate holding device rotatable about a vertical axis, such as a spin chuck, a jig is placed on the substrate holding device, and centrifugal acceleration imparted to a predetermined measuring position on the jig and an eccentricity of the measuring position from the rotation center of the spin chuck are determined. The position of the rotation center is determined on the basis of centrifugal accelerations imparted to the measuring position when the jig is placed at three different positions and eccentricities of the measuring position from the rotation center when the jig is placed at the three different positions. Data on a substrate placing position, the center of the substrate placed at which coincides with the rotation center, is stored as data of a substrate placing position at which a substrate is to be placed.

Abstract: In the present invention, a position detecting substrate having a capacitive sensor is supported on a transfer arm and transferred by the transfer arm and mounted on a mounting part. The capacitive sensor on the position detecting substrate then detects a position of a target object on the mounting part to detect a mounting position of the position detecting substrate on the mounting part. Based on the mounting position of the position detecting substrate, the moving position of the transfer arm when transferring a substrate is then adjusted.

Abstract: In the present invention, a position detecting substrate having a capacitive sensor is supported on a transfer arm and transferred by the transfer arm and mounted on a mounting part. The capacitive sensor on the position detecting substrate then detects a position of a target object on the mounting part to detect a mounting position of the position detecting substrate on the mounting part. Based on the mounting position of the position detecting substrate, the moving position of the transfer arm when transferring a substrate is then adjusted.

Abstract: A compact substrate processing system capable of accurately placing a substrate at a predetermined substrate placing position, a substrate placing position adjusting method, and a storage medium storing the substrate placing position adjusting method are provided. In a substrate processing system for processing a substrate, such as a wafer W, held by a substrate holding device rotatable about a vertical axis, such as a spin chuck 2, a jig 12 is placed on the substrate holding device, and centrifugal acceleration imparted to a predetermined measuring position on the jig 12 and an eccentricity of the measuring position from the rotation center of the spin chuck 2 are determined. The position of the rotation center is determined on the basis of centrifugal accelerations imparted to the measuring position when the jig 12 is placed at three different positions and eccentricities of the measuring position from the rotation center when the jig 12 is placed at the three different positions.