Patents by Inventor Yuichi Homma

Yuichi Homma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing composition
    Patent number: 8110013
    Abstract: A polishing composition includes a copolymer and an abrasive. The copolymer has a constitutional unit expressed as the following formula (I) and at least one of constitutional units expressed as the following formulas (II) to (IV). Methoxypolyethylene glycol methacrylate etc. are used as monomers for forming the constitutional unit of the formula (I), stearyl methacrylate etc. are used as monomers for forming the constitutional unit of the formula (II), polypropylene glycol methacrylate etc. are used as monomers for forming the constitutional unit of the formula (III), and styrene etc. are used as monomers for forming the constitutional unit of the formula (IV).
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: February 7, 2012
    Assignee: Kao Corporation
    Inventors: Masahiko Suzuki, Yuichi Homma, Yukiko Yamawaki
  • Polishing composition
    Patent number: 8012224
    Abstract: A polishing composition includes a copolymer and an abrasive. The copolymer has a constitutional unit expressed as the following formula (I) and at least one of constitutional units expressed as the following formulae (II) to (IV). Methoxypolyethylene glycol methacrylate etc. are used as monomers for forming the constitutional unit of the formula (I), stearyl methacrylate etc. are used as monomers for forming the constitutional unit of the formula (II), polypropylene glycol methacrylate etc. are used as monomers for forming the constitutional unit of the formula (III), and styrene etc. are used as monomers for forming the constitutional unit of the formula (IV).
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: September 6, 2011
    Assignee: Kao Corporation
    Inventors: Masahiko Suzuki, Yuichi Homma, Yukiko Yamawaki
  • POLISHING COMPOSITION
    Publication number: 20110059683
    Abstract: A polishing composition includes a copolymer and an abrasive. The copolymer has a constitutional unit expressed as the following formula (I) and at least one of constitutional units expressed as the following formulae (II) to (IV). Methoxypolyethylene glycol methacrylate etc. are used as monomers for forming the constitutional unit of the formula (I), stearyl methacrylate etc. are used as monomers for forming the constitutional unit of the formula (II), polypropylene glycol methacrylate etc. are used as monomers for forming the constitutional unit of the formula (III), and styrene etc. are used as monomers for forming the constitutional unit of the formula (IV).
    Type: Application
    Filed: November 17, 2010
    Publication date: March 10, 2011
    Inventors: Masahiko SUZUKI, Yuichi Homma, Yukiko Yamawaki
  • Polishing composition
    Publication number: 20080115422
    Abstract: A polishing composition includes a copolymer and an abrasive. The copolymer has a constitutional unit expressed as the following formula (I) and at least one of constitutional units expressed as the following formulas (II) to (IV). Methoxypolyethylene glycol methacrylate etc. are used as monomers for forming the constitutional unit of the formula (I), stearyl methacrylate etc. are used as monomers for forming the constitutional unit of the formula (II), polypropylene glycol methacrylate etc. are used as monomers for forming the constitutional unit of the formula (III), and styrene etc. are used as monomers for forming the constitutional unit of the formula (IV).
    Type: Application
    Filed: August 31, 2007
    Publication date: May 22, 2008
    Applicant: Kao Corporation
    Inventors: Masahiko Suzuki, Yuichi Homma, Yukiko Yamawaki
  • POLISHING COMPOSITION
    Publication number: 20070167116
    Abstract: The present invention relates to a polishing composition containing an aqueous medium and silica particles, wherein the silica particles in the polishing composition has a zeta potential of from ?15 to 40 mV; a method for manufacturing a substrate including the step of polishing a substrate to be polished with a polishing composition containing an aqueous medium and silica particles, wherein the silica particles in the polishing composition has a zeta potential of from ?15 to 40 mV; and a method for reducing scratches on a substrate to be polished with a polishing composition containing an aqueous medium and silica particles, including the step of adjusting a zeta potential of silica particles in the polishing composition to ?15 to 40 mV.
    Type: Application
    Filed: March 28, 2007
    Publication date: July 19, 2007
    Inventors: Hiroyuki YOSHIDA, Yuichi Homma, Shigeaki Takashima, Toshiya Hagihara