Abstract: The present invention is characterized by a resin composition for a thermal conductive material including a polymer (I), a liquid-state plasticizer (II) and a thermal conductive filler (III) having a thermal conductivity of 20 W/m·K or more, wherein the liquid-state plasticizer (II) is in a liquid state at 25° C., and has a mass loss rate of 2 mass % or less when kept at 130° C. for 24 hours. By using this resin composition for a thermal conductive material, it becomes possible to obtain a thermal conductive material having superior thermal conductivity and flexibility.

Abstract: The present invention provides a (meth)acrylic molding material comprising (A) a (meth)acrylic polymer obtained by polymerization of monomer components essentially containing a monomer having (a) carboxyl group(s) and an alkyl (meth)acrylate monomer, and (B) one or more kinds of monomers containing a vinyl group, wherein 30-600 parts by weight of aluminum hydroxide and 0.01-10 parts by weight of a succinic acid derivative are added for 100 parts by weight of the total of said polymer (A) and monomer (B). The (meth)acrylic molding material is thickened by aluminum hydroxide and the thickening behavior is controlled by the succinic acid derivative to prevent the viscosity from increasing with time, accordingly, the (meth)acrylic molding material shows good workability.