Abstract: Provided is an automatic driving device capable of suppressing a decrease in accuracy of object detection by a radar device. A vehicle controller controls driving of a vehicle based on information received from a radar device. Driving modes of the vehicle to be used by the controller include a separation mode. The controller has a control target monitoring area set therefor. The area is an area on a front side in a traveling direction of the vehicle. The controller controls the driving of the vehicle in the separation mode so that an object assumed to be present in the area and a detected object that is different from the object are separately detected by the radar device. The detected object is at least one of a structure outside the vehicle or an indirect wave from the object via the structure.

Abstract: A vehicle front body structure is provided for reliably transferring a collision load to a crash can and a front frame by preventing a bumper beam from buckling during a small overlap collision. Bending rigidity of the bumper beam in a vehicle width direction is such that 1) a bending moment generated on the bumper beam when a collision load in a direction toward a vehicle rear side is applied to an extending section, which extends outward in the vehicle width direction from a crash can fixed section, is the highest in a vehicle width direction inner end portion of the crash can fixed section on a side where the collision load is applied, and 2) the bending moment is continuously reduced as a distance from the vehicle width direction inner end portion in the vehicle width direction increases.

Abstract: A front vehicle-body structure controls inward breakage of an apron reinforcement in the event of a small overlap collision, without increasing weight. Embodiments include a pair of right and left apron reinforcements extending in a vehicle front-rear direction; and a pair of right and left hinge pillars respectively connected to rear ends of the pair of apron reinforcements. A reinforcement outer member of the apron reinforcement includes a linear portion extending in the vehicle front-rear direction from a rear end of the apron reinforcement connected to the hinge pillar to an intermediate portion of the apron reinforcement. A horizontal bead, provided as a deformation facilitating portion to facilitate deformation toward an inside of a vehicle body, is disposed on an outer surface portion positioned on a vehicle-width-direction outer side of the linear portion, the horizontal bead having a reduced longitudinal rigidity toward a front side in the vehicle front-rear direction.

Abstract: A side body structure of a vehicle can include: a hinge pillar; a front pillar that is coupled to an upper end portion of this hinge pillar via a bent section, extends upward to the rear, and is coupled to a front end portion of a roof side rail via a connected section; and an apron rein that extends forward from a position below the bent section in the hinge pillar, where the bent section can include an energy absorption section that is subjected to out-of-plane deformation in a longitudinal orthogonal direction of the front pillar and thereby can absorb collision energy when the collision energy, which can be directed rearward, is applied to the apron rein. The energy absorption section can be configured to include an outer bead section and an inner bead section respectively provided in an outer member and a lower inner member.

Abstract: A vehicle lower body structure can include: a side sill that forms a first closed cross section extending in a body front-rear direction; and a reinforcing member provided in the first closed cross section to reinforce a front end portion of the side sill. The reinforcing member can have: a front-end reinforcing section that supports a collision load applied to the front end portion of the side sill and directed rearward in a vehicle body; a deformation permission section that permits deformation of the side sill directed inward in a vehicle width direction and rearward at the time when the collision load directed inward in the vehicle width direction and rearward is applied to the front end portion of the side sill; and a deformation suppression section suppressing deformation of the side sill after the deformation of the side sill directed inward in the vehicle width direction and rearward.

Abstract: A front vehicle-body structure comprises a crash can fixed to a front end of a front frame. The crash can comprises an upper face portion, a lower face portion, a pair of side face portions, corner portions respectively positioned between the side face portion and the upper face portion and between the side face portion and the lower face portion, a first fragile portion provided at each of the corner portions, and a second fragile portion provided at each of the side face portions. The first fragile portion is configured to be deformed before the second fragile portion when a collision load applied toward a vehicle rearward side is inputted to an extension portion of a bumper beam. The second fragile portion is configured to be deformed before the front frame when the collision load applied toward the vehicle rearward side is inputted to the extension portion.

Abstract: A side body structure of a vehicle can include: a hinge pillar; a front pillar that is coupled to an upper end portion of this hinge pillar via a bent section, extends upward to the rear, and is coupled to a front end portion of a roof side rail via a connected section; and an apron rein that extends forward from a position below the bent section in the hinge pillar, where the bent section can include an energy absorption section that is subjected to out-of-plane deformation in a longitudinal orthogonal direction of the front pillar and thereby can absorb collision energy when the collision energy, which can be directed rearward, is applied to the apron rein. The energy absorption section can be configured to include an outer bead section and an inner bead section respectively provided in an outer member and a lower inner member.

Abstract: A vehicle lower body structure can include: a side sill that forms a first closed cross section extending in a body front-rear direction; and a reinforcing member provided in the first closed cross section to reinforce a front end portion of the side sill. The reinforcing member can have: a front-end reinforcing section that supports a collision load applied to the front end portion of the side sill and directed rearward in a vehicle body; a deformation permission section that permits deformation of the side sill directed inward in a vehicle width direction and rearward at the time when the collision load directed inward in the vehicle width direction and rearward is applied to the front end portion of the side sill; and a deformation suppression section suppressing deformation of the side sill after the deformation of the side sill directed inward in the vehicle width direction and rearward.

Abstract: A front vehicle-body structure controls inward breakage of an apron reinforcement in the event of a small overlap collision, without increasing weight. Embodiments include a pair of right and left apron reinforcements extending in a vehicle front-rear direction; and a pair of right and left hinge pillars respectively connected to rear ends of the pair of apron reinforcements. A reinforcement outer member of the apron reinforcement includes a linear portion extending in the vehicle front-rear direction from a rear end of the apron reinforcement connected to the hinge pillar to an intermediate portion of the apron reinforcement. A horizontal bead, provided as a deformation facilitating portion to facilitate deformation toward an inside of a vehicle body, is disposed on an outer surface portion positioned on a vehicle-width-direction outer side of the linear portion, the horizontal bead having a reduced longitudinal rigidity toward a front side in the vehicle front-rear direction.

Abstract: A vehicle front body structure is provided for reliably transferring a collision load to a crash can and a front frame by preventing a bumper beam from buckling during a small overlap collision. Bending rigidity of the bumper beam in a vehicle width direction is such that 1) a bending moment generated on the bumper beam when a collision load in a direction toward a vehicle rear side is applied to an extending section, which extends outward in the vehicle width direction from a crash can fixed section, is the highest in a vehicle width direction inner end portion of the crash can fixed section on a side where the collision load is applied, and 2) the bending moment is continuously reduced as a distance from the vehicle width direction inner end portion in the vehicle width direction increases.

Abstract: A front vehicle-body structure comprises a crash can fixed to a front end of a front frame. The crash can comprises an upper face portion, a lower face portion, a pair of side face portions, corner portions respectively positioned between the side face portion and the upper face portion and between the side face portion and the lower face portion, a first fragile portion provided at each of the corner portions, and a second fragile portion provided at each of the side face portions. The first fragile portion is configured to be deformed before the second fragile portion when a collision load applied toward a vehicle rearward side is inputted to an extension portion of a bumper beam. The second fragile portion is configured to be deformed before the front frame when the collision load applied toward the vehicle rearward side is inputted to the extension portion.

Abstract: An object of the invention is to provide a smaller semiconductor device of which the manufacturing process is simplified and the manufacturing cost is reduced and a method of manufacturing the same. Furthermore, an object of the invention is to provide a semiconductor device having a cavity. A first supporting body 5 having a penetration hole 6 penetrating it from the front surface to the back surface is attached to a front surface of a semiconductor substrate 2 with an adhesive layer 4 being interposed therebetween. A device element 1 and wiring layers 3 are formed on the front surface of the semiconductor substrate 2. A second supporting body 7 is attached to the first supporting body 5 with an adhesive layer 8 being interposed therebetween so as to cover the penetration hole 6. The device element 1 is sealed in a cavity 9 surrounded by the semiconductor substrate 2, the first supporting body 5 and the second supporting body 7.

Abstract: A packaged semiconductor device is manufactured by a simplified manufacturing process, and is reduced in cost, in thickness and in size. A device component and a pad electrode connected with the device component are formed on a semiconductor substrate. A supporter is bonded to a top surface of the semiconductor substrate through an adhesive layer. Then, there is formed a protection layer that has an opening at a location corresponding to the pad electrode and covers a side surface and a back surface of the semiconductor substrate. A conductive terminal is formed on the pad electrode at the location corresponding to the opening formed in the protection layer. No wiring layer or conductive terminal is formed on the back surface of the semiconductor substrate. A conductive terminal is formed on a periphery of the supporter outside of and next to the side surface of the semiconductor substrate.

Abstract: This invention is directed to offer a package type semiconductor device that can realize a smaller size device and its manufacturing method as well as a small stacked layer type semiconductor device and its manufacturing method. A device component 1 and a pad electrode 4 electrically connected with the device component 1 are formed on a semiconductor substrate 2. A supporting member 7 is bonded to a surface of the semiconductor substrate 2 through an adhesive layer 6. There is formed a through-hole 15 in the supporting member 7 penetrating from its top surface to a back surface. Electrical connection with another device is made possible through the through-hole 15. A depressed portion 12 is formed in a partial region of the top surface of the supporting member 7. Therefore, all or a portion of another device or a component can be disposed utilizing a space in the depressed portion 12.

Abstract: The invention is directed to prevent corrosion of a semiconductor device. In the semiconductor device manufacturing method of the invention, a semiconductor substrate is etched from its back surface in a position corresponding to a first wiring formed on the semiconductor substrate with a first insulation film therebetween, to form a first opening exposing the first insulation film. Next, the insulation film exposed in the first opening is etched to form a second opening exposing the first wiring, and then the semiconductor substrate is etched to increase a diameter of the first opening and form a first opening having the larger diameter. Then, a second insulation film is formed on the back surface of the semiconductor substrate including on the first wiring through the first and second openings, and then the second insulation film covering the first wiring is etched.

Abstract: The invention provides a semiconductor device that solves a problem of reflection of a pattern of a wiring formed on a back surface of a semiconductor substrate on an output image. A reflection layer is formed between a light receiving element and a wiring layer, that reflects an infrared ray toward a light receiving element the without transmitting it to the wiring layer, the infrared ray entering from a light transparent substrate toward the wiring layer through a semiconductor substrate. The reflection layer is formed at least in a region under the light receiving element uniformly or only under the light receiving element. Alternatively, an anti-reflection layer having a function of absorbing the entering infrared ray to prevent transmission thereof may be formed instead of the reflection layer.

Abstract: This invention is directed to offer a technology that makes it possible to form desired bump electrodes easily when the bump electrodes are to be formed at locations lowered by a step. There is formed an isolation layer 12 to isolate each of bump electrode forming regions 11. The isolation layer 12 is a resist layer, for example, and is formed by exposure and development processes, for example. Each of the bump electrode forming regions 11 is surrounded by the isolation layer 12 and a protection layer 10 that covers a side surface of a semiconductor substrate 2. Then, a printing mask 16 that has openings 15 at locations corresponding to the bump electrode forming regions 11 is placed above the semiconductor substrate 2. Next, solder 17 in paste form is applied to the printing mask 16. Then the solder 17 is applied to a metal layer 9 by moving a squeeze 18 at a constant speed. Bump electrodes 19 are obtained by heating, melting and re-crystallizing the solder 17 after removing the printing mask 16.

Abstract: This invention is directed to offer a package type semiconductor device that can realize a smaller size device and its manufacturing method as well as a small stacked layer type semiconductor device and its manufacturing method. A device component 1 and a pad electrode 4 electrically connected with the device component 1 are formed on a semiconductor substrate 2. A supporting member 7 is bonded to a surface of the semiconductor substrate 2 through an adhesive layer 6. There is formed a through-hole 15 in the supporting member 7 penetrating from its top surface to a back surface. Electrical connection with another device is made possible through the through-hole 15. A depressed portion 12 is formed in a partial region of the top surface of the supporting member 7. Therefore, all or a portion of another device or a component can be disposed utilizing a space in the depressed portion 12.

Abstract: This invention is directed to offer a technology that makes it possible to form desired bump electrodes easily when the bump electrodes are to be formed at locations lowered by a step. There is formed an isolation layer 12 to isolate each of bump electrode forming regions 11. The isolation layer 12 is a resist layer, for example, and is formed by exposure and development processes, for example. Each of the bump electrode forming regions 11 is surrounded by the isolation layer 12 and a protection layer 10 that covers a side surface of a semiconductor substrate 2. Then, a printing mask 16 that has openings 15 at locations corresponding to the bump electrode forming regions 11 is placed above the semiconductor substrate 2. Next, solder 17 in paste form is applied to the printing mask 16. Then the solder 17 is applied to a metal layer 9 by moving a squeeze 18 at a constant speed. Bump electrodes 19 are obtained by heating, melting and re-crystallizing the solder 17 after removing the printing mask 16.

Abstract: This invention provides a semiconductor device that solves a problem that a pattern of a wiring formed on a back surface of a semiconductor substrate is reflected on an output image. A light receiving element (e.g. a CCD, an infrared ray sensor, a CMOS sensor, or an illumination sensor) is formed on a front surface of a semiconductor substrate, and a plurality of ball-shaped conductive terminals is disposed on a back surface of the semiconductor substrate. Each of the conductive terminals is electrically connected to a pad electrode on the front surface of the semiconductor substrate through a wiring layer. The wiring layer and the conductive terminal are formed on the back surface of the semiconductor substrate except in a region overlapping the light receiving element in a vertical direction, and are not disposed in a region overlapping the light receiving element.