Abstract: A waste liquid scattering prevention device includes a box body having an upper wall being formed with an insertion hole into which a tip portion of a paint gun is inserted, and an air ejection port that ejects air along an inner wall of the box body. A waste liquid scattering prevention method includes an arrangement step of inserting the tip portion of a paint gun into an insertion hole, a cleaning step of cleaning the paint gun, and an air ejecting step of ejecting air from an air ejection port along the inner wall of the box body.

Abstract: A cleaning device includes a box body, a cleaning nozzle that ejects cleaning liquid toward a paint gun, an air nozzle hole that is configured to eject air toward the paint gun, and an eaves portion that protrudes more toward a central axis line of the insertion hole than the air nozzle hole. A method of cleaning the paint gun includes ejecting cleaning liquid from the cleaning nozzle toward the paint gun. In the ejecting, air is ejected toward the paint gun from the air nozzle hole.

Abstract: According to one embodiment, a distance estimation device comprises a first distance estimation unit based on a first estimation method, and a second distance estimation unit based on a second estimation method different from the first estimation method. The second distance estimation unit is configured to change a part of the second estimation method according to an output of the first distance estimation unit.

Abstract: According to one embodiment, a motion estimation device includes a first receiving circuit that receives a first input frame and a calculation circuit that performs motion estimation processing on the first input frame. The calculation circuit estimates a distance for each pixel of the first input frame and estimates a reliability of the distance for each pixel of the first input frame based on pixel information of the first input frame.

Abstract: A working vehicle includes an acquisition device that acquires operating state data, a client screen data generation unit that generates client screen data that a client display device of a client apparatus can display based on the operating state data, and a wireless communication device that transmits the client screen data to the client apparatus.

Abstract: A working vehicle includes an acquisition device that acquires operating state data, a client screen data generation unit that generates client screen data that a client display device of a client apparatus can display based on the operating state data, and a wireless communication device that transmits the client screen data to the client apparatus.

Abstract: A flush water supply device includes: a water supply unit including a water supply valve; a water compartment fittingly attached to the water supply unit; a float provided inside the water compartment; and a swingable member having one end connected to the float and the other end connected to the water supply valve, wherein the water compartment is formed in a flattened shape in which a maximum vertical length becomes less than a maximum horizontal length by a given value, and a ratio of a distance between the fulcrum adjacent to the water supply valve and an effort point defined by the swingable member and the float, to a distance between the fulcrum adjacent to the water supply valve and a load point defined by the swingable member and the water supply valve is set to a given value or more.

Abstract: A solder joint material includes a Zn-based metal material including mainly of Zn, an Al-based metal material including mainly of Al and provided on the Zn-based metal material, a Cu-based metal material including mainly of Cu and provided on the Al-based metal material, and a surface-treated layer provided on the Cu-based metal material and including an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper.

Abstract: The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (101), Al-based metallic layers (102a, 102b) on both sides thereof, and X-based metallic layers (103a, 103b) (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (102a, 102b), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.

Abstract: A joining material includes a composite material including a first metal material having a thermal expansion coefficient of not more than 5, and a second metal material formed on the first metal material, the second metal material having a thermal expansion coefficient higher than the first metal material, and a solder material formed on the composite material. The solder material includes a lead-free solder having a melting point of not less than 260 degrees C., and a laminated structure configured such that a Zn based metal material including Zn as a main component, a first Al based metal material including Al as a main component, and a first X based metal material including Cu, Au, Ag or Sn as a main component are laminated in the order starting from the composite material.

Abstract: A solder joint material includes a Zn-based metal material including mainly of Zn, an Al-based metal material including mainly of Al and provided on the Zn-based metal material, a Cu-based metal material including mainly of Cu and provided on the Al-based metal material, and a surface-treated layer provided on the Cu-based metal material and including an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper.

Abstract: According to one embodiment, an information processing device is provided with a memory, a plurality of processors, a router group, and an address protection unit. The plurality of the processors generate memory access packets each of which defines memory access requests for the memory, the memory access packet including an access destination address and an access type. The router group is provide with first routers which are connected to the memory and second routers which form transfer paths between the first router and the plurality of the processors, and transmits the memory access packets generated by the plurality of the processors to the memory. The address protection unit examines the memory access packets which pass through the first routers to detect a violated memory access.

Abstract: A flush water supply device includes: a water supply valve for switching between a water supplying state and a water stopping state with respect of an inside of the flush water tank; a refill water system on a downstream side of the water supply valve and adapted to allow flush water to be supplied to the flush water tank, and further supplied to a toilet main body as refill water, wherein the refill water system includes a common passage-forming portion which forms a common passage having: an inlet port for allowing inflow of the flush water therethrough; a tank-side outlet port for allowing the flush water to flow out toward the flush water tank therethrough; a main unit-side outlet port for allowing the flush water to flow out toward the toilet main body therethrough; and a vent port; and a vacuum break valve in the common passage-forming portion.

Abstract: To provide an inexpensive lead component which can be easily connected to a semiconductor chip and which has satisfactory connectability. There is provided a lead component including a base material having a connection part for connecting to a semiconductor chip, comprising: a solder part having a Zn layer made of a Zn-bonding material rolled and clad-bonded on the base material, and an Al layer made of an Al-bonding material rolled and clad-bonded on the Zn layer, in a prescribed region including the connection part on the base material; and the solder part further comprising a metal thin film composed of one kind or two kinds or more of Au, Ag, Cu, Ni, Pd, and Pt covering a surface of the Al layer.

Abstract: First tag addresses and data are stored in association with first index addresses in a memory cell unit provided in a cache memory. The first tag addresses and the first index addresses are configured based on address information respectively. Designation address information is provided to designate an address to read one of the stored data. The designation address information is converted to a second index address and second tag address by an address converter, in order to read the one of the stored data according to the designation address information. The memory cell unit is accessed according to the obtained second index address. When one of the first tag addresses matches the second tag address, the one of the data corresponding to the one of the first tag addresses is read. The designation address information and the one of the data are displayed in a cache memory display unit.

Abstract: The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (101), Al-based metallic layers (102a, 102b) on both sides thereof, and X-based metallic layers (103a, 103b) (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (102a, 102b), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.

Abstract: A flush water supply device includes: a water supply valve for switching between a water supplying state and a water stopping state with respect of an inside of the flush water tank; a refill water system on a downstream side of the water supply valve and adapted to allow flush water to be supplied to the flush water tank, and further supplied to a toilet main body as refill water, wherein the refill water system includes a common passage-forming portion which forms a common passage having: an inlet port for allowing inflow of the flush water therethrough; a tank-side outlet port for allowing the flush water to flow out toward the flush water tank therethrough; a main unit-side outlet port for allowing the flush water to flow out toward the toilet main body therethrough; and a vent port; and a vacuum break valve in the common passage-forming portion.

Abstract: According to one embodiment, an information processing device is provided with a memory, a plurality of processors, a router group, and an address protection unit. The plurality of the processors generate memory access packets each of which defines memory access requests for the memory, the memory access packet including an access destination address and an access type. The router group is provide with first routers which are connected to the memory and second routers which form transfer paths between the first router and the plurality of the processors, and transmits the memory access packets generated by the plurality of the processors to the memory. The address protection unit examines the memory access packets which pass through the first routers to detect a violated memory access.

Abstract: A debugging device configured to debug a program includes an analysis section configured to analyze information of a code that does not need to be debugged in which a predetermined processing instruction is described, the code being generated by optimization of a compiler for a source code of the program, and an output section configured to output processing content information, a start address, and an end address of the code that does not need to be debugged which are obtained by the analysis.

Abstract: To provide an inexpensive lead component which can be easily connected to a semiconductor chip and which has satisfactory connectability. There is provided a lead component including a base material having a connection part for connecting to a semiconductor chip, comprising: a solder part having a Zn layer made of a Zn-bonding material rolled and clad-bonded on the base material, and an Al layer made of an Al-bonding material rolled and clad-bonded on the Zn layer, in a prescribed region including the connection part on the base material; and the solder part further comprising a metal thin film composed of one kind or two kinds or more of Au, Ag, Cu, Ni, Pd, and Pt covering a surface of the Al layer.