Abstract: A radiation imaging system includes a radiation imaging apparatus that can be in a start-up state where acquisition processing to acquire internal information is executed and in a standby state where the acquisition processing is not executed, and a control apparatus, wherein the control apparatus transmits a start-up signal to the radiation imaging apparatus, wherein the radiation imaging apparatus transitions from the standby state to the start-up state in response to receipt of the start-up signal, execute the acquisition processing, and transmit the internal information to the control apparatus, and wherein, in a case where the internal information received from the radiation imaging apparatus is internal information corresponding to a normal state of the radiation imaging apparatus, the control apparatus provides notification external to the radiation imaging system of information indicating that operation of the radiation imaging apparatus is normal.

Abstract: A radiation imaging apparatus for use in a radiation imaging system including a radiation source and a camera includes one or more controllers that acquire state information of the radiation imaging apparatus and perform, in response to acquisition of state information corresponding to an abnormality of the radiation imaging apparatus, communication to cause the camera to perform image capturing on a range including the radiation imaging apparatus.

Abstract: To provide an aluminum alloy in which natural aging is suppressed and a method for producing the same. This disclosure relates to an Al—Si-based aluminum alloy containing Si, Mg, Mn, Fe, and unavoidable impurities and Al—Si—Mg—Fe—Mn-based compounds, and further to a method for producing said Al—Si—based aluminum alloy by controlling the cooling process of a molten alloy during casting.

Abstract: A hydraulic damper includes: a cylinder having a cylinder tube; a piston slidingly movable within the cylinder tube; a piston rod integrally movable with the piston; a first chamber and a second chamber into or from which fluid flows by sliding movement of the piston relative to the cylinder tube; a piston port portion connecting the first chamber and the second chamber; a damping force generating device disposed downstream of the piston port portion through which the fluid flows; and a sub-valve disposed upstream and/or downstream of the damping force generating device. The sub-valve is provided with a sub-valve port portion that is connected to a flow path of the piston port portion. A total cross-sectional area of a flow path of the sub-valve port portion is smaller than a total cross-sectional area of the flow path of the piston port portion.

Abstract: In a friction pad assembly for a disc brake, a plurality of lining assemblies supported on a guide plate are pressed to a disc rotor. The lining assembly includes a friction material and a back plate portion. A plate fitting portion of the lining assembly is inserted and equipped to a guide hole portion, and braking torque is transmitted from the plate fitting portion to the guide plate. A plurality of link plates applying pressing force from a torque receiving plate to the lining assembly are provided between the torque receiving plate and the back plate portion adhered to the guide plate. A damping layer sandwiched between inner surfaces of the torque receiving plate is provided on back surface sides of the link plates.

Abstract: A friction pad assembly for a disc brake is provided. A lining assembly includes a friction material which is pressed against a disc rotor during braking and a back plate which is fixed to a back surface of the friction material, and the back plate includes a plate fitting part swingably fitted to a guide hole provided in a guide plate. The plate fitting part is fitted into the guide hole such that a braking torque acting when the friction material is pressed against the disc rotor is transmitted from the plate fitting part to the guide plate. A rotation regulator regulating a rotation of the lining assembly is integrally formed on a torque receiving plate fixed to the guide plate.

Abstract: In a friction pad assembly for a disc brake, a plurality of lining assemblies supported on a guide plate are pressed to a disc rotor. The lining assembly includes a friction material and a back plate portion. A plate fitting portion of the lining assembly is inserted and equipped to a guide hole portion, and braking torque is transmitted from the plate fitting portion to the guide plate. A plurality of link plates applying pressing force from a torque receiving plate to the lining assembly are provided between the torque receiving plate and the back plate portion adhered to the guide plate. A damping layer sandwiched between inner surfaces of the torque receiving plate is provided on back surface sides of the link plates.

Abstract: A disk brake includes a floating caliper, a pair of brake pads, a driving piston and a caliper return mechanism. The floating caliper includes a base portion which is slidably supported via a guide pin to a support and a pair of pressing arms which extend from the base portion to pinch a disk rotor. The brake pads are provided in tip portions of the pressing arms so as to face side surfaces of the disk rotor. The driving piston is provided on one of the pressing arms so as to drive one of the brake pads toward one of the side surfaces. The caliper return mechanism is arranged in at least one of both end portions of the guide pin on a side opposite to the driving piston side so as to elastically bias the base portion to the side opposite to the driving piston side.

Abstract: A disk brake includes a floating caliper, a pair of brake pads, a driving piston and a caliper return mechanism. The floating caliper includes a base portion which is slidably supported via a guide pin to a support and a pair of pressing arms which extend from the base portion to pinch a disk rotor. The brake pads are provided in tip portions of the pressing arms so as to face side surfaces of the disk rotor. The driving piston is provided on one of the pressing arms so as to drive one of the brake pads toward one of the side surfaces. The caliper return mechanism is arranged in at least one of both end portions of the guide pin on a side opposite to the driving piston side so as to elastically bias the base portion to the side opposite to the driving piston side.

Abstract: In a semiconductor device including a semiconductor element and a wiring substrate on which the semiconductor element is mounted. The wiring substrate includes an insulating substrate and conductive wiring formed in the insulating substrate and electrically connected to the semiconductor element. The conductive wiring includes an underlying layer formed on the insulating substrate, a main conductive layer formed on the underlying layer, and an electrode layer covering side surfaces of the underlying layer and side surfaces and an upper surface of the main conductive layer. The underlying layer includes an adhesion layer being formed in contact with the insulating substrate and containing an alloy of Ti.

Abstract: In a semiconductor device including a semiconductor element and a wiring substrate on which the semiconductor element is mounted. The wiring substrate includes an insulating substrate and conductive wiring formed in the insulating substrate and electrically connected to the semiconductor element. The conductive wiring includes an underlying layer formed on the insulating substrate, a main conductive layer formed on the underlying layer, and an electrode layer covering side surfaces of the underlying layer and side surfaces and an upper surface of the main conductive layer. The underlying layer includes an adhesion layer being formed in contact with the insulating substrate and containing an alloy of Ti.

Abstract: In a semiconductor device including a semiconductor element and a wiring substrate on which the semiconductor element is mounted. The wiring substrate includes an insulating substrate and conductive wiring formed in the insulating substrate and electrically connected to the semiconductor element. The conductive wiring includes an underlying layer formed on the insulating substrate, a main conductive layer formed on the underlying layer, and an electrode layer covering side surfaces of the underlying layer and side surfaces and an upper surface of the main conductive layer. The underlying layer includes an adhesion layer being formed in contact with the insulating substrate and containing an alloy of Ti.

Abstract: A semiconductor light emitting device, has a package constituted by the lamination of a first insulating layer having a pair of positive and negative conductive wires formed on its upper face, an inner-layer wire below the first insulating layer, and a second insulating layer below the inner-layer wire; a semiconductor light emitting element that has a pair of positive and negative electrodes on the same face side and that is disposed with these electrodes opposite the conductive wires; and a sealing member that covers the semiconductor light emitting element, wherein part of the conductive wires is formed extending in the outer edge direction of the sealing member from directly beneath the semiconductor light emitting element, on the upper face of the first insulating layer, and is connected to the inner-layer wire via a conductive wire disposed in the thickness direction of the package, and the inner-layer wire is disposed so as to be spaced apart from the outer periphery of the semiconductor light emitting

Abstract: In a semiconductor device including a semiconductor element and a wiring substrate on which the semiconductor element is mounted. The wiring substrate includes an insulating substrate and conductive wiring formed in the insulating substrate and electrically connected to the semiconductor element. The conductive wiring includes an underlying layer formed on the insulating substrate, a main conductive layer formed on the underlying layer, and an electrode layer covering side surfaces of the underlying layer and side surfaces and an upper surface of the main conductive layer. The underlying layer includes an adhesion layer being formed in contact with the insulating substrate and containing an alloy of Ti.

Abstract: A semiconductor light emitting device, has a package constituted by the lamination of a first insulating layer having a pair of positive and negative conductive wires formed on its upper face, an inner-layer wire below the first insulating layer, and a second insulating layer below the inner-layer wire; a semiconductor light emitting element that has a pair of positive and negative electrodes on the same face side and that is disposed with these electrodes opposite the conductive wires; and a sealing member that covers the semiconductor light emitting element, wherein part of the conductive wires is formed extending in the outer edge direction of the sealing member from directly beneath the semiconductor light emitting element, on the upper face of the first insulating layer, and is connected to the inner-layer wire via a conductive wire disposed in the thickness direction of the package, and the inner-layer wire is disposed so as to be spaced apart from the outer periphery of the semiconductor light emitting

Abstract: A damper of variable damping force adapted to be built into a vehicular suspension is disclosed. The damper has frictional force generating means for applying a frictional force to a rod. The frictional force generating means is disposed at one end of a cylinder and positioned externally of the latter.

Abstract: In a semiconductor device including a semiconductor element and a wiring substrate on which the semiconductor element is mounted. The wiring substrate includes an insulating substrate and conductive wiring formed in the insulating substrate and electrically connected to the semiconductor element. The conductive wiring includes an underlying layer formed on the insulating substrate, a main conductive layer formed on the underlying layer, and an electrode layer covering side surfaces of the underlying layer and side surfaces and an upper surface of the main conductive layer. The underlying layer includes an adhesion layer being formed in contact with the insulating substrate and containing an alloy of Ti.