Abstract: Provided is a polishing composition for semiconductor wiring providing an excellent polishing rate and preventing occurrence of dishing. The polishing composition for semiconductor wiring according to the present invention contains a compound represented by Formula (1) below: R1O—(C3H6O2)n—H??(1) where R1 represents a hydrogen atom, a hydrocarbon group that has from 1 to 24 carbon atoms and may include a hydroxyl group, or a group represented by R2CO, where the R2 represents a hydrocarbon group having from 1 to 24 carbon atoms; and n represents an average degree of polymerization of glycerol units shown in the parentheses and is from 2 to 60.

Abstract: Provided is a substrate hydrophilizing agent that improves the wettability of a substrate surface with respect to a photoresist. A substrate hydrophilizing agent of the present invention is an agent for hydrophilizing a surface of a substrate on which a pattern is formed through photolithography, and contains at least the following Component (A) and Component (B). Component (A): a water-soluble oligomer having a weight average molecular weight from 100 to less than 10000. Component (B): water. The water-soluble oligomer of Component (A) is preferably a compound represented by the following Formula (a-1): Ra1O—(C3H6O2)n—H??(a-1) (where Ra1 represents a hydrogen atom, a hydrocarbon group which may have a hydroxyl group, or an acyl group; and n is an integer from 2 to 60.

Abstract: Provided are an emulsifiable preparation that has little influence on the environment or the human body, that is excellent in long-term storage stability, and that imparts a pleasant touch feeling to the skin, and an aqueous cosmetic that contains the emulsifiable preparation, a food or beverage that contains the emulsifiable preparation, and a pharmaceutical composition that contains the emulsifiable preparation. The emulsifiable preparation includes: one or more aqueous components selected from the group consisting of water and alcohol; an oily component; and microparticles of a polymer compound, in which the microparticles contain cellulose acetate as the polymer compound, and the microparticles has an average particle size of 2 to 10 ?m. The aqueous cosmetic contains the emulsifiable preparation. The food or beverage contains the emulsifiable preparation. The pharmaceutical composition contains the emulsifiable preparation.

Abstract: A detergent composition and a polishing composition are provided. The detergent composition facilitates sufficient removal of polishing agents, metal microparticles, and anticorrosives in cleaning of a semiconductor substrate and long-term maintenance of flatness of a metal wiring surface after cleaning and achieves excellent quality stability for a long period of time; and the polishing composition facilitates suppression of scratching on a polished object such as a semiconductor substrate, and reduction of filter clogging. A detergent composition containing an alkanol hydroxylamine compound represented by General Formula (1) and having a pH of 10 to 13, and a chemical-mechanical polishing composition containing the detergent composition and a polishing agent.

Abstract: Provided is a surface protectant that suppresses corrosion of a semiconductor wafer surface by a basic compound, and reduces defects in the semiconductor wafer. The semiconductor wafer surface protectant of the present invention includes a compound represented by Formula (1) below; R1O—(C3H6O2)n—H??(1) where R1 denotes a hydrogen atom, a hydrocarbon group that has from 1 to 24 carbon atoms and may have a hydroxyl group, or a group represented by R2CO, where the R2 denotes a hydrocarbon group having from 1 to 24 carbon atoms; and n indicates an average degree of polymerization of a glycerin unit shown in the parentheses, and is from 2 to 60.

Abstract: To provide a cleaning agent that can remove impurities such as metal polishing dust adhering to a semiconductor substrate without corroding metal and can prevent re-adhesion of the impurities. The semiconductor substrate cleaning agent of the present invention contains at least the following component (A) and component (B): Component (A): a water-soluble oligomer having a weight average molecular weight of not less than 100 and less than 10000; and Component (B): water. It is preferable that the water-soluble oligomer is at least one compound selected from compounds represented by the following formulas (a-1) to (a-3).

Abstract: Provided is a hydrophilization treatment liquid for a semiconductor wafer surface, the hydrophilization treatment liquid being capable of imparting hydrophilicity to the semiconductor wafer surface. A hydrophilization treatment liquid for a semiconductor wafer surface, the hydrophilization treatment liquid comprising water and a compound represented by Formula (1) below, and a total content of the water and the compound represented by Formula (1) below being 95 wt. % or greater. R1O—(C3H6O2)n—H??(1) where R1 denotes a hydrogen atom, a hydrocarbon group having from 1 to 24 carbon atoms and optionally having a hydroxyl group, or a group represented by R2CO, the R2 denoting a hydrocarbon group having from 1 to 24 carbon atoms; and n indicates an average degree of polymerization of a glycerin unit in the parentheses, and is from 2 to 60.

Abstract: Provided is a polishing composition for semiconductor wiring providing an excellent polishing rate and preventing occurrence of dishing. The polishing composition for semiconductor wiring according to the present invention contains a compound represented by Formula (1) below: R1O—(C3H6O2)n—H??(1) where R1 represents a hydrogen atom, a hydrocarbon group that has from 1 to 24 carbon atoms and may include a hydroxyl group, or a group represented by R2CO, where the R2 represents a hydrocarbon group having from 1 to 24 carbon atoms; and n represents an average degree of polymerization of glycerol units shown in the parentheses and is from 2 to 60.

Abstract: Provided is a thickening/stabilizing agent that thickens, gelatinizes, and/or stabilizes a fluid organic substance to a desired viscosity. The thickening/stabilizing agent according to the present invention contains a compound (1) represented by Formula (i) and a compound (2) represented by Formula (ii), in a mole ratio of the compound (1) to the compound (2) of 95:5 to 25:75. The four R1s in Formula (i) represent, identically in each occurrence, a C12-C18 aliphatic hydrocarbon group; and the four R2s in Formula (ii) represent, identically in each occurrence, an C4-C10 aliphatic hydrocarbon group.

Abstract: To provide a cleaning agent that can remove impurities such as metal polishing dust adhering to a semiconductor substrate without corroding metal and can prevent re-adhesion of the impurities. The semiconductor substrate cleaning agent of the present invention contains at least the following component (A) and component (B): Component (A): a water-soluble oligomer having a weight average molecular weight of not less than 100 and less than 10000; and Component (B): water. It is preferable that the water-soluble oligomer is at least one compound selected from compounds represented by the following formulas (a-1) to (a-3).

Abstract: A transparent cosmetic composition that provides an excellent feeling in use and excellent dissolution stability of ceramide is provided. The cosmetic composition of the present invention comprises (a) a ceramide, (b) a surfactant, and (c) water, wherein the cosmetic composition comprises (a) in an amount of 0.00001 to 5.0% by weight based on the total weight of the cosmetic composition, a polyglycerin aliphatic ether as (b) in an amount of 0.1 to 5.0% by weight based on the total weight of the cosmetic composition, and (c) in an amount of 50.0% by weight or more based on the total weight of the cosmetic composition. It is preferable that the polyglycerin aliphatic ether comprise a polyglycerin monoaliphatic ether in an amount of 75% by weight or more based on the total weight of the polyglycerin aliphatic ether and a polyglycerin dialiphatic ether in an amount of 5% by weight or less based on the total weight of the polyglycerin aliphatic ether.

Abstract: [Object] To provide a decorative aqueous composition that includes particles formed from opal-type colloidal crystals uniformly and stably dispersed in an aqueous dispersion medium, and exhibits a structural color due to interference of light, and to provide a method for producing the decorative aqueous composition. [Solution] The decorative aqueous composition of the present invention contains particles of opal-type colloidal crystals dispersed in an aqueous dispersion medium in which a polymer is dissolved. The particles of the opal-type colloidal crystals are made from hydrophilic colloidal particles having an average particle diameter ranging from 10 nm to 1000 nm with a variation coefficient of the particle diameter being within 20%. Therefore, the decorative aqueous composition of the present invention contains opal-type colloidal crystals uniformly and stably dispersed in an aqueous dispersion medium, and exhibits a structural color due to interference of light.

Abstract: Provided is a substrate hydrophilizing agent that improves the wettability of a substrate surface with respect to a photoresist. A substrate hydrophilizing agent of the present invention is an agent for hydrophilizing a surface of a substrate on which a pattern is formed through photolithography, and contains at least the following Component (A) and Component (B). Component (A): a water-soluble oligomer having a weight average molecular weight from 100 to less than 10000. Component (B): water. The water-soluble oligomer of Component (A) is preferably a compound represented by the following Formula (a-1): Ra1O—(C3H6O2)n—H??(a-1) (where Ra1 represents a hydrogen atom, a hydrocarbon group which may have a hydroxyl group, or an acyl group; and n is an integer from 2 to 60.

Abstract: A nonionic surfactant that is environmentally friendly, has excellent surface active power (emulsifying power and solubilizing power), and is capable of stably maintaining the excellent surface active power for a long time is provided. A nonionic surfactant of the present invention contains polyglycerol monoether represented by the formula (1), wherein a ring Z represents a condensed ring of an aromatic hydrocarbon ring having 6 to 14 carbon atoms and a 3 to 6-membered heterocycle containing an oxygen atom as a heteroatom; R1 is a substituent bonded to the ring Z and represents an aliphatic hydrocarbon group having 14 to 25 carbon atoms; the ring Z optionally has one or more substituents other than R1; and n is an average number of monomers of glycerol and represents 2 to 20.

Abstract: Problem to be Solved To provide a composition that can efficiently remove a photoresist adhering to an edge portion and a back surface of a substrate, in a process of producing a mask which is used when the substrate is subjected to etching treatment to have an element, a circuit etc., formed thereon using the photoresist. Solution The composition for removing a resist of the present invention is a composition comprising a surfactant and a solvent, wherein the composition contains, as the surfactant, at least the following component (A). Component (A): a polyglycerol derivative represented by the following formula (a): RaO—(C3H5O2Ra)n—Ra??(a) wherein n represents the number of the repeating units, and is an integer of 2 to 60; and Ra identically or differently represents a hydrogen atom, a C1-18 hydrocarbon group or a C2-24 acyl group, provided that at least two of the (n+2) number of Ra are C1-18 hydrocarbon groups and/or C2-24 acyl groups.

Abstract: Problem to be Solved To provide a composition that can efficiently remove a photoresist adhering to an edge portion and a back surface of a substrate, in a process of producing a mask which is used when the substrate is subjected to etching treatment to have an element, a circuit etc., formed thereon using the photoresist. Solution The composition for removing a resist of the present invention is a composition comprising a surfactant and a solvent, wherein the composition contains, as the surfactant, at least the following component (A). Component (A): a polyglycerol derivative represented by the following formula (a): RaO—(C3H5O2Ra)n—Ra??(a) wherein n represents the number of the repeating units, and is an integer of 2 to 60; and Ra identically or differently represents a hydrogen atom, a C1-18 hydrocarbon group or a C2-24 acyl group, provided that at least two of the (n+2) number of Ra are C1-18 hydrocarbon groups and/or C2-24 acyl groups.

Abstract: Provided is a surface protectant that suppresses corrosion of a semiconductor wafer surface by a basic compound, and reduces defects in the semiconductor wafer. The semiconductor wafer surface protectant of the present invention includes a compound represented by Formula (1) below; R1O—(C3H6O2)n—H??(1) where R1 denotes a hydrogen atom, a hydrocarbon group that has from 1 to 24 carbon atoms and may have a hydroxyl group, or a group represented by R2CO, where the R2 denotes a hydrocarbon group having from 1 to 24 carbon atoms; and n indicates an average degree of polymerization of a glycerin unit shown in the parentheses, and is from 2 to 60.

Abstract: Provided is a thickening/stabilizing agent that thickens, gelatinizes, and/or stabilizes a fluid organic substance to a desired viscosity. The thickening/stabilizing agent according to the present invention contains a compound (1) represented by Formula (i) and a compound (2) represented by Formula (ii), in a mole ratio of the compound (1) to the compound (2) of 95:5 to 25:75. The four R1s in Formula (i) represent, identically in each occurrence, a C12-C18 aliphatic hydrocarbon group; and the four R2s in Formula (ii) represent, identically in each occurrence, an C4-C10 aliphatic hydrocarbon group.

Abstract: The present invention provides a compound that thickens or gels a fluid organic substance to a desired viscosity, or uniformly stabilizes a composition containing a fluid organic substance. The compound of the present invention is a compound represented by Formula (1) below: wherein, R1 represents a monovalent aliphatic hydrocarbon group having 4 or more carbons; R2 represents a divalent aliphatic hydrocarbon group having from 1 to 12 carbons; R3 represents a monovalent aliphatic hydrocarbon group having from 1 to 12 carbons; m represents an integer from 0 to 10; and n represents an integer from 1 to 4; in a case where n is 1 or 2, (4?n) R1s may be the same or different; and in a case where n is from 2 to 4, n R2s, n R3s, and n m's each may be the same or different.

Abstract: The present invention provides a compound that thickens or gels a fluid organic substance to a desired viscosity, or uniformly stabilizes a composition containing a fluid organic substance. The compound of the present invention is a compound represented by Formula (1) below: wherein, R1 represents a monovalent aliphatic hydrocarbon group having 4 or more carbons; R2 represents a divalent aliphatic hydrocarbon group having from 1 to 12 carbons; R3 represents a monovalent aliphatic hydrocarbon group having from 1 to 12 carbons; m represents an integer from 0 to 10; and n represents an integer from 1 to 4; in a case where n is 1 or 2, (4?n) R1s may be the same or different; and in a case where n is from 2 to 4, n R2s, n R3s, and n m's each may be the same or different.