Abstract: A lithography system is provided with: a measurement device measuring position information of marks on a substrate held in a first stage; and an exposure apparatus on a second stage, the substrate for which the position information measurement for the marks has been completed, performs alignment measurement to measure position information for part of marks selected from among the marks on the substrate, and performs exposure. The measurement device measures position information of marks on the substrate to obtain higher-degree components of correction amounts of an arrangement of divided areas, and the exposure apparatus measures position information of a small number of marks on the substrate to obtain lower-degree components of the correction amounts of the arrangement of the divided areas and exposes the plurality of divided areas while controlling the position of the substrate by using the obtained lower-degree components and the higher-degree components obtained by the measurement device.

Abstract: A processing apparatus has: a light irradiation apparatus that irradiates a surface of an object with a processing light; and a measurement apparatus that measures a position of an irradiation area, which is formed on the surface of the object by the light irradiation apparatus, relative to the object.

Abstract: A supporting member on which a wafer table is mounted is substantially kinematically supported, via six rod members placed on a slider. Further, coupling members are placed facing in a non-contact manner via a predetermined gap, thin plate-shaped edges provided at both ends in the Y-axis direction of the supporting member. By this arrangement, vibration-damping is performed by the coupling members (squeeze dampers) facing the edges, on vibration of the supporting member mounted on the wafer table. Further, because the supporting member is kinematically supported via the plurality of rod members, it becomes possible to reduce deformation of the wafer table that accompanies deformation of the slider.

Abstract: A lithography system is provided with: a measurement device measuring position information of marks on a substrate held in a first stage; and an exposure apparatus on a second stage, the substrate for which the position information measurement for the marks has been completed, performs alignment measurement to measure position information for part of marks selected from among the marks on the substrate, and performs exposure. The measurement device measures position information of many marks on the substrate to obtain higher-degree components of correction amounts of an arrangement of divided areas, and the exposure apparatus measures position information of a small number of marks on the substrate to obtain lower-degree components of the correction amounts of the arrangement of the divided areas and exposes the plurality of divided areas while controlling the position of the substrate by using the obtained lower-degree components and the higher-degree components obtained by the measurement device.

Abstract: A measurement device has: a slider which holds a substrate and is movable parallel to the XY plane; a drive system that drives the slider; a position measurement system which emits beams from a head section to a measurement surface in which grating section are provided on the slider, which receives respective return beams of the beams from the measurement surface, and which is capable of measuring position information in at least directions of three degrees of freedom including the absolute position coordinates of the slider; a mark detection system that detects a mark on the substrate; and a controller which detects the marks on the substrate using the mark detection system while controlling the drive of the slider, and which obtains the absolute position coordinates of each mark based on the detection result of each mark and measurement information by the position measurement system at the time of detection.

Abstract: A measurement device is equipped with a surface plate, a slider which holds a substrate and which is movable relative to the surface plate, a drive system that moves the slider, a first position measurement system which measures the slider's first position information relative to the surface plate, a measurement unit having a mark detection system that detects a mark on a substrate, a second position measurement system which measures a relative second position information between the mark detection system and substrate, and a controller which obtains the first position information from the first position measurement system and second position information from the second position measurement system while controlling the slider's movement by the drive system, and obtains position information of a plurality of marks based on detection signals of the mark detection system having detected marks on the substrate, the first position information, and the second position information.

Abstract: A beam irradiation device that irradiates a plurality of electron beams includes a multibeam optical system that emits the plurality of beams to be irradiated on a target; and a controller that controls an irradiation state of each of the plurality of beams in accordance with change in a relative position between the target and the multibeam optical system, and based on the irradiation state of a first beam of the plurality of beams, controls the irradiation state of a second beam of the plurality of beams.

Abstract: A measurement device has: a slider which holds a substrate and is movable parallel to the XY plane; a drive system that drives the slider; a position measurement system which emits beams from a head section to a measurement surface in which grating section are provided on the slider, which receives respective return beams of the beams from the measurement surface, and which is capable of measuring position information in at least directions of three degrees of freedom including the absolute position coordinates of the slider; a mark detection system that detects a mark on the substrate; and a controller which detects the marks on the substrate using the mark detection system while controlling the drive of the slider, and which obtains the absolute position coordinates of each mark based on the detection result of each mark and measurement information by the position measurement system at the time of detection.

Abstract: A measurement device is equipped with a surface plate, a slider which holds a substrate and which is movable relative to the surface plate, a drive system that moves the slider, a first position measurement system which measures the slider's first position information relative to the surface plate, a measurement unit having a mark detection system that detects a mark on a substrate, a second position measurement system which measures a relative second position information between the mark detection system and substrate, and a controller which obtains the first position information from the first position measurement system and second position information from the second position measurement system while controlling the slider's movement by the drive system, and obtains position information of a plurality of marks based on detection signals of the mark detection system having detected marks on the substrate, the first position information, and the second position information.

Abstract: On a substrate conforming to a layout method for a plurality of marks for detection using a plurality of mark detection systems of which the detection centers are arranged at a predetermined spacing along an X-axis direction, a plurality of shot areas are formed in both an X-axis direction and a Y-axis direction orthogonal thereto in an XY plane, and sets including at least two marks separated in the X-axis direction are repeatedly arranged along the X-axis direction at spacing of a length in the X-axis-direction of each shot area, and the marks belonging to each set are separated from each other in the X-axis direction by a spacing determined based arrangement in the X-axis direction of the plurality of mark detection systems and the length. It is thereby possible to reliably detect a plurality of marks on a substrate using a plurality of mark detection systems.

Abstract: A processing apparatus is equipped with: a first stage system that has a table on which a workpiece is placed and moves the workpiece held by the table; a beam irradiation system that includes a condensing optical system to emit beams; and a controller to control the first stage system and the beam irradiation system, and processing is performed to a target portion of the workpiece while the table and the beams from the condensing optical system are relatively moved, and at least one of an intensity distribution of the beams at a first plane on an exit surface side of the condensing optical system and an intensity distribution of the beams at a second plane whose position in a direction of an optical axis of the condensing optical system is different from the first plane can be changed.

Abstract: An exposure apparatus scans a substrate in a Y-axis direction and also adjusts irradiation position of a plurality of beams, based on correction information obtained from the same number of distortion tables as the beams, the distortion tables including information concerning change of irradiation position of the plurality of beams of a multibeam optical system. Especially, the irradiation position of the plurality of beams in the Y-axis direction is adjusted by individually controlling irradiation timing of the plurality of beams irradiated on the substrate from the multibeam optical system.

Abstract: A shaping system forms a three-dimensional shaped object on a target surface using a beam and has: a beam irradiation section emitting beams passing through tilted optical paths; a material supplying section having a material supplying port and supplies along the axis a powdered material irradiated with the beams from the beam irradiation section; a cover member having an inner surface that gradually converges from a side at one end to a side at the other end and has an outlet formed at the other end through which the beams from the beam irradiation section pass; and a gas supply apparatus supplying inert gas via a gas supplying port into a space inside the cover member, and the inert gas flows outside the space via the outlet of the cover member, and the shaping material is supplied outside the space via the outlet of the cover member.

Abstract: The processing system is provided with: a liquid supply device which can supply a liquid; a liquid processing device which processes a liquid supplied from the liquid supply device such that a non-liquid-immersion state is generated locally in a partial area including a target portion on a predetermined surface; a beam irradiation section which emits beams toward the target portion; and a moving apparatus which moves the predetermined surface. The beams are irradiated on the target portion to apply a predetermined processing to the target portion, in a state in which the target portion is in the non-liquid-immersion state.

Abstract: Correction information is acquired for compensating for a measurement error of a second encoder system that occurs due to a displacement between four sections of a scale member of the second encoder system, based on measurement information of the second encoder system obtained in a fifth area in which four heads of the second encoder system that are provided on a second stage, which holds a substrate, respectively face the four sections of the scale member.

Abstract: An electron beam irradiation apparatus which exposes a wafer coated with an electron beam resist with an electron beam is equipped with: a stage that can be moved holding the wafer; an electron beam optical system that irradiates the wafer with an electron beam; and, an opening member, placed facing the wafer via a predetermined gap on the wafer side in the optical arrangement direction of the electron beam optical system, and having an opening through which the electron beam from the electron beam optical system passes.

Abstract: Correction information is acquired for compensating for a measurement error of a second encoder system that occurs due to a displacement between four sections of a scale member of the second encoder system, based on measurement information of the second encoder system obtained in a fifth area in which four heads of the second encoder system that are provided on a second stage, which holds a substrate, respectively face the four sections of the scale member.

Abstract: Within area where of four heads installed on a wafer stage, heads included in the first head group and the second head group to which three heads each belong that include one head different from each other face the corresponding areas on a scale plate, the wafer stage is driven based on positional information which is obtained using the first head group, as well as obtain the displacement (displacement of position, rotation, and scaling) between the first and second reference coordinate systems corresponding to the first and second head groups using the positional information obtained using the first and second head groups. By using the results and correcting measurement results obtained using the second head group, the displacement between the first and second reference coordinate systems is calibrated, which allows the measurement errors that come with the displacement between areas on scale plates where each of the four heads face.

Abstract: Within area where of four heads installed on a wafer stage, heads included in the first head group and the second head group to which three heads each belong that include one head different from each other face the corresponding areas on a scale plate, the wafer stage is driven based on positional information which is obtained using the first head group, as well as obtain the displacement (displacement of position, rotation, and scaling) between the first and second reference coordinate systems corresponding to the first and second head groups using the positional information obtained using the first and second head groups. By using the results and correcting measurement results obtained using the second head group, the displacement between the first and second reference coordinate systems is calibrated, which allows the measurement errors that come with the displacement between areas on scale plates where each of the four heads face.

Abstract: A liquid immersion exposure apparatus includes a liquid immersion member which forms a liquid immersion space under an emitting surface of an optical member. The liquid immersion member includes a first member disposed in a periphery of the optical member, and a second member which is movable relative to the first member and includes a liquid recovery port that recovers at least a portion of liquid in the liquid immersion space. The second member is moved in a direction perpendicular to an optical axis of the optical member so that a relative speed between the second member and an object below the liquid immersion member is smaller than a relative speed between the first member and the object. The second member has an outer surface facing radially outward relative to the optical axis of the optical member, the outer surface does not face toward any surface of the first member.