Abstract: A resin composition that is transparent and excellent in weather resistance and heat resistance, and a molded article thereof are provided. According to the present invention, a transparent and highly heat-resistant resin composition, comprising: an aromatic vinyl-(meth) acrylic acid ester-unsaturated dicarboxylic acid anhydride copolymer (A); and an ultraviolet absorbing agent (B); wherein an amount of a residual unsaturated dicarboxylic acid anhydride monomer contained in the copolymer (A) is 100 ppm or less, and a content of the ultraviolet absorbing agent (B) with respect to a total amount of (A) and (B) is 0.03 to 1.0 mass %, is provided. The composition may further comprise a methacrylic resin (C) in addition to (A) and (B).

Abstract: Provided is a copolymer that has a heat resistance improvement effect, with respect to a methacrylic resin, superior to that of the prior art, while not deteriorating compatibility with the methacrylic resin. According to the present invention, provided is a copolymer comprising 45 to 75% by mass of an aromatic vinyl monomer unit, 5 to 35% by mass of a (meth)acrylic acid ester monomer unit, and 20 to 25% by mass of an unsaturated dicarboxylic anhydride monomer unit, and having a haze of 5% or less measured along an optical path length of 10 mm through a 12% by mass chloroform solution of the copolymer in accordance with JIS K-7136.

Abstract: A copolymer for optical compensation film showing a negative orientation birefringence, having excellent transparency, heat resistance, film strength, and optical properties, and is capable of obtaining a beautiful film suitable for an optical compensation film is provided. A copolymer for optical compensation film, containing: 45 to 80 mass % of an aromatic vinyl monomer unit; 5 to 45 mass % of a (meth)acrylic acid ester monomer unit; and 5 to 20 mass % of an unsaturated dicarboxylic acid anhydride monomer unit; wherein the copolymer has an average number molecular weight (Mn) of 5.5×104 to 9×104 and a weight average molecular weight (Mw) of 14×104 to 20×104; and the copolymer has a haze of 1% or less, the haze being measured with a 2 mm thick sample in accordance with ASTM D1003, is provided.

Abstract: A copolymer for optical compensation film showing a negative orientation birefringence, having excellent transparency, heat resistance, film strength, and optical properties, and is capable of obtaining a beautiful film suitable for an optical compensation film is provided. A copolymer for optical compensation film, containing: 45 to 80 mass % of an aromatic vinyl monomer unit; 5 to 45 mass % of a (meth)acrylic acid ester monomer unit; and 5 to 20 mass % of an unsaturated dicarboxylic acid anhydride monomer unit; wherein the copolymer has an average number molecular weight (Mn) of 5.5×104 to 9×104 and a weight average molecular weight (Mw) of 14×104 to 20×104; and the copolymer has a haze of 1% or less, the haze being measured with a 2 mm thick sample in accordance with ASTM D1003, is provided.

Abstract: Provided is a novel heat-dissipating resin composition used for an LED light housing, the composition having excellent heat dissipation, fire retardancy, insulation properties, and molding processability as well as low specific gravity and improved whiteness. Also provided is a heat-dissipating housing for LED lighting, the housing being molded using the heat-dissipating resin composition. Disclosed is a heat-dissipating resin composition used for an LED light housing, comprising: 100 parts by mass of a thermoplastic resin composition (X) comprising 40 to 65% by mass of a polyamide resin (A), 33.5 to 59.8% by mass of a metal-hydroxide-based fire retardant (B), and 0.2 to 1.5% by mass of a polytetrafluoroethylene resin (C); and 5 to 200 parts by mass of an inorganic filler (Y) comprising 5 to 100% by mass of boron nitride (D) and 0 to 95% by mass of an inorganic oxide filler (E), wherein thermal conductivity is equal to or greater than 1.0 W/m·K.

Abstract: Provided is a novel heat-dissipating resin composition used for an LED light housing, the composition having excellent heat dissipation, fire retardancy, insulation properties, and molding processability as well as low specific gravity and improved whiteness. Also provided is a heat-dissipating housing for LED lighting, the housing being molded using the heat-dissipating resin composition. Disclosed is a heat-dissipating resin composition used for an LED light housing, comprising: 100 parts by mass of a thermoplastic resin composition (X) comprising 40 to 65% by mass of a polyamide resin (A), 33.5 to 59.8% by mass of a metal-hydroxide-based fire retardant (B), and 0.2 to 1.5% by mass of a polytetrafluoroethylene resin (C); and 5 to 200 parts by mass of an inorganic filler (Y) comprising 5 to 100% by mass of boron nitride (D) and 0 to 95% by mass of an inorganic oxide filler (E), wherein thermal conductivity is equal to or greater than 1.0 W/m·K.