Abstract: Provided is a fine mold for molding a fuel cell separator by press-molding a metal thin plate for a fuel cell separator to produce the fuel cell separator, comprising: a molding surface in which a concavity and convexity are adjacent to each other with a prescribed period, and (i) an arc-like minute concave surface on an upper surface of the concavity and convexity, and (ii) an arc-like minute convex surface on a lower surface of the concavity and convexity.

Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.

Abstract: The invention provides a method and apparatus for easily and efficiently manufacturing a cable bead, which features excellent wire winding performance. In this method, an annular core is held by a core rotating means. Then a reel wound with a wire is revolved in one direction through the inside and the outside of the core by a reel revolving means by holding the reel wound with a wire alternately on one side and on the other side of the core. And a wire is wound helically around the core as the core is rotated in a circumferential direction in association with the revolving motion of the reel.

Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.

Abstract: In one embodiment, after a new filter unit (3) is installed in a treatment liquid supply apparatus, there is performed, before a solvent-containing treatment liquid is passed through the filter unit, a step of soaking the filter unit with a solvent for pretreatment and then discharging therefrom the solvent. The solubility of a material, constituting a filter part (31) of the filter unit, to the solvent is greater than the solubility of the material to the treatment liquid. This step makes it possible to remove a component, which may elute from the filter part into the treatment liquid to produce foreign matters (particles), before treatment liquid is passed through the filter unit.

Abstract: To provide a substrate holding apparatus which can prevent a liquid from entering into a rear surface side of a substrate. A substrate holding apparatus is provided with a base material, a first holding portion formed on the base material for holding the substrate, and a second holding portion formed on the base material for holding a plate member by surrounding the circumference of a processing substrate held by the first holding portion. The second holding portion holds the plate member so as to form a second space on the side of the rear surface of the plate member. On the rear surface of the plate member, an absorbing member is arranged for absorbing the liquid entered from a gap between the substrate held by the first holding portion and the plate member held by the second holding portion.

Abstract: A liquid treatment method includes: supplying a first organic solvent to a substrate with the substrate being held horizontally by a substrate holder; and thereafter supplying a second organic solvent to a substrate held by the substrate holder, the second solvent having a higher cleanliness than the first solvent.

Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.

Abstract: To provide a substrate holding apparatus which can prevent a liquid from entering into a rear surface side of a substrate. A substrate holding apparatus is provided with a base material, a first holding portion formed on the base material for holding the substrate, and a second holding portion formed on the base material for holding a plate member by surrounding the circumference of a processing substrate held by the first holding portion. The second holding portion holds the plate member so as to form a second space on the side of the rear surface of the plate member. On the rear surface of the plate member, an absorbing member is arranged for absorbing the liquid entered from a gap between the substrate held by the first holding portion and the plate member held by the second holding portion.

Abstract: A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.

Abstract: The liquid crystal display device (100) of the present invention includes a liquid crystal panel (10) having a plurality of pixels (P), and a backlight (20) having at least one light source (22) that emits light to the liquid crystal panel (10). Each of the plurality of pixels (P) includes four or more sub-pixels (R, G, B, Ye), and the light source unit (22) includes a red light source (22R), a green light source (22G), and a blue light source (22B). According to the present invention, a liquid crystal display device which can perform display of wide color reproduction range with low power consumption is provided.

Abstract: The viewing angle characteristics of a multiprimary liquid crystal display device in which a plurality of red subpixels are provided in each pixel are improved. A multiprimary liquid crystal display device according to the present invention includes a pixel defined by a plurality of subpixels, and performs multicolor display by using four or more primary colors to be displayed by the plurality of subpixels. The plurality of subpixels of the multiprimary liquid crystal display device according to the present invention include first and second red subpixels R1 and R2 for displaying red, a green subpixel G for displaying green, a blue subpixel B for displaying blue, and a cyan subpixel C for displaying cyan. When a color having a hue which is within a predetermined first range is displayed by the pixel, the gray scale level of the first red subpixel R1 and the gray scale level of the second red subpixel R2 differ from each other.

Abstract: A vehicle display device is configured to be mounted on a vehicle to provide information to a person on the vehicle by displaying images on a liquid crystal display. The vehicle display device includes a storage unit in which image data including a line drawing is stored, and a display control unit configured to display a plurality of mask images on the liquid crystal display such that the mask images are set with respect to the image data stored in the storage unit to mask a plurality of regions into which the line drawing in the image data is divided, and to execute a stepwise unmasking processing to remove the mask images sequentially along a drawing direction of the line drawing.

Abstract: A liquid treatment method includes: supplying a first organic solvent to a substrate with the substrate being held horizontally by a substrate holder; and thereafter supplying a second organic solvent to a substrate held by the substrate holder, the second solvent having a higher cleanliness than the first solvent.

Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.

Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.

Abstract: A semiconductor device includes a lead frame, an oscillator, an integrated circuit and first bonding wires. The oscillator includes plural terminals separated from each other by a predetermined distance, and that is mounted to an oscillator mounting region formed on a first face of the lead frame. The oscillator mounting region has a narrower width than the distance between the plural terminals. The integrated circuit is mounted to a second face of the lead frame, which is on an opposite side to the first face. The first bonding wires connect the plural terminals of the oscillator to terminals of the integrated circuit.

Abstract: Disclosed are an apparatus and a method for reducing a processing liquid consumed for removing bubbles from a new filter unit, and shortening a start-up time when the filter unit is attached in a processing liquid supply passage. The method includes: filling the processing liquid into a new filter unit, decompressing inside of the filter unit into a first pressure atmosphere in order to remove bubbles from the filter unit, boosting a pressure of the inside of the filter unit, flowing the processing liquid into the filter unit from a primary side of the filter unit, and supplying the processing liquid flowing from the filter unit to an object to be processed through a nozzle thereby performing a liquid processing and quickly removing the bubbles.

Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.

Abstract: A display device is disclosed, along with a display method capable of displaying an input image having a resolution higher than the resolution of a display panel without degradation in display quality. The display device is a display device for displaying an image with each frame divided into two sub-frames. In the display device, a bright sub-pixel and a dark sub-pixel in each pixel are interchanged every sub-frame, and an input signal has a vertical resolution twice that of a display panel. The display device displays an image corresponding to the input signal by making the sub-frames different from each other in a voltage supplied to each pixel.