Patents by Inventor Yuichiro YAMANAKA

Yuichiro YAMANAKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BORONIC ACID COMPOUND AND METHOD FOR PRODUCING SAME
    Publication number: 20240124496
    Abstract: The invention provides a method for producing radiolabeled tyrosine derivatives with good purity and stability, by a safe method suitable for industrial production of pharmaceuticals. The invention relates to a method for producing Compound (5) and Radiolabeled Compound (6) as follows: wherein each symbol is as defined in the description.
    Type: Application
    Filed: March 24, 2022
    Publication date: April 18, 2024
    Applicant: OSAKA UNIVERSITY
    Inventors: Yoshifumi SHIRAKAMI, Kazuko KANEDA, Yuichiro KADONAGA, Tadashi WATABE, Atsushi TOYOSHIMA, Koichi FUKASE, Atsushi SHINOHARA, Toshio YAMANAKA, Yutaka KONDOH
  • Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
    Patent number: 11375615
    Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film and a metal layer disposed on at least one of surfaces of the base film. In the substrate for a printed circuit board, an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a N1s spectrum in XPS analysis of a surface of the base film exposed after removal of the metal layer by etching with an acidic solution, is 1 atomic % or more and 10 atomic % or less.
    Type: Grant
    Filed: August 6, 2016
    Date of Patent: June 28, 2022
    Assignees: Sumitomo Electric Industries, Ltd., Sumitomo Electric Printed Circuits, Inc., Sumitomo Electric Fine Polymer, Inc.
    Inventors: Yuichiro Yamanaka, Yoshio Oka, Satoshi Kiya, Yoshifumi Uchita, Makoto Nakabayashi
  • JOINED BODY AND SURFACE ACOUSTIC WAVE DEVICE
    Publication number: 20220077839
    Abstract: Provided is a joined body including a piezoelectric substrate and a polycrystalline spinel substrate provided on one main surface of the piezoelectric substrate, wherein a ratio T1/T2 between T1 and T2 is 0.1 or less, where the T1 represents an average thickness of the piezoelectric substrate and the T2 represents an average thickness of the polycrystalline spinel substrate, and the polycrystalline spinel substrate has a TTV of 1.5 ?m or less in a main surface which contacts the piezoelectric substrate.
    Type: Application
    Filed: January 18, 2019
    Publication date: March 10, 2022
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Masato HASEGAWA, Yuichiro YAMANAKA, Yoshihiro IMAGAWA, Hirohisa SAITO
  • JOINED BODY AND SURFACE ACOUSTIC WAVE DEVICE
    Publication number: 20220069802
    Abstract: Provided is a joined body including a piezoelectric substrate and a polycrystalline spinel substrate provided on one main surface of the piezoelectric substrate, wherein the polycrystalline spinel substrate has a porosity of 0.005% or more and 0.6% or less.
    Type: Application
    Filed: January 18, 2019
    Publication date: March 3, 2022
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Hirohisa SAITO, Shigeru NAKAYAMA, Yoshihiro IMAGAWA, Keiichiro GESHI, Yuichiro YAMANAKA
  • SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR PRODUCING SUBSTRATE FOR PRINTED CIRCUIT BOARD
    Publication number: 20180242450
    Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film and a metal layer disposed on at least one of surfaces of the base film. In the substrate for a printed circuit board, an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a N1s spectrum in XPS analysis of a surface of the base film exposed after removal of the metal layer by etching with an acidic solution, is 1 atomic % or more and 10 atomic % or less.
    Type: Application
    Filed: August 6, 2016
    Publication date: August 23, 2018
    Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., SUMITOMO ELECTRIC FINE POLYMER, INC.
    Inventors: Yuichiro YAMANAKA, Yoshio OKA, Satoshi KIYA, Yoshifumi UCHITA, Makoto NAKABAYASHI