Abstract: The present disclosure provides a method of adjusting a dimension of a molded product. The method includes generating a plurality of adjusted molding conditions comprising an adjusted velocity profile and an adjusted packing pressure profile; conducting, via an injection-molding apparatus, an actual molding to produce a molded product using the adjusted molding conditions if the adjusted molding condition is qualified; determining whether a dimension of the molded product needs to be adjusted; and updating at least one of the adjusted molding conditions if the dimension of the molded product needs to be adjusted.

Abstract: The present disclosure provides a method of producing a molded product. The method comprises steps of performing, via computer-assisted engineering simulation software, a first simulation process to generate a plurality of molding conditions comprising a default injection velocity profile and a default packing pressure profile; conducting, via an injection-molding apparatus, a trial molding to inject a molding material into a mold using the default molding conditions and sensing a plurality of in-mold pressures at different sites in a mold cavity of the mold; and conducting, via an injection-molding apparatus, an actual molding to produce the molded product using the default molding conditions if a deviation of the in-mold pressures at an endpoint of a packing stage is less than a target value.

Abstract: The present disclosure provides a method of producing a molded product. The method comprises steps of performing, via computer-assisted engineering simulation software, a first simulation process to generate a plurality of molding conditions comprising a default injection velocity profile and a default packing pressure profile; conducting, via an injection-molding apparatus, a trial molding to inject a molding material into a mold using the default molding conditions and sensing a plurality of in-mold pressures at different sites in a mold cavity of the mold; and conducting, via an injection-molding apparatus, an actual molding to produce the molded product using the default molding conditions if a deviation of the in-mold pressures at an endpoint of a packing stage is less than a target value.

Abstract: The present disclosure provides a clamping assembly in operative connection with a mold of an injection-molding apparatus. The clamping assembly includes a fixed plate, a rear plate, a plurality of tie bars, a movable plate, a driving module, and a temperature adjuster. The rear plate is spaced apart from the fixed plate. The tie bars are interlinked with the fixed plate and the rear plate and provided with a plurality of channels. The movable plate, between the fixed plate and the rear plate, is capable of moving with respect to the fixed plate along the tie bars. The driving module interlinks the rear plate and the movable plate. The temperature adjuster is employed to supply a fluid into the channels to remove heat from the tie bars, thereby preventing non-uniform thermal expansion of the tie bars, and hence preventing the structural wear and flash issues.

Abstract: The present disclosure provides a clamping assembly in operative connection with a mold of an injection-molding apparatus. The clamping assembly includes a fixed plate, a rear plate, a plurality of tie bars, a movable plate, a driving module, and a temperature adjuster. The rear plate is spaced apart from the fixed plate. The tie bars are interlinked with the fixed plate and the rear plate and provided with a plurality of channels. The movable plate, between the fixed plate and the rear plate, is capable of moving with respect to the fixed plate along the tie bars. The driving module interlinks the rear plate and the movable plate. The temperature adjuster is employed to supply a fluid into the channels to remove heat from the tie bars, thereby preventing non-uniform thermal expansion of the tie bars, and hence preventing the structural wear and flash issues.

Abstract: The present disclosure provides a method for operating a molding system. The molding system includes a molding machine and a mold disposed on the molding machine, wherein the mold has a mold cavity for being filled with a molding material from the molding machine. The method comprises a step of obtaining a predetermined state waveform expressing a predetermined volumetric variation of the molding material. Next, the method further comprises obtaining a measured pressure and a measured temperature of the molding material in the mold cavity while performing a molding process for filling the molding material into the mold cavity. Next, the method includes obtaining a detected volumetric property of the molding material corresponding to the measured pressure and the measured temperature. Subsequently, the method comprises displaying the detected volumetric property of the molding material with the predetermined state waveform.

Abstract: The present disclosure provides a measuring apparatus including a testing module. The testing module includes: a temperature-controlling cylinder having a top opening and a bottom opening; an upper piston and a lower piston respectively seal the top opening and the bottom opening of the temperature-controlling cylinder so that a testing chamber is formed inside the temperature-controlling cylinder, wherein the testing chamber has a longitudinal length; and a pipe surrounding the testing chamber along the longitudinal length in such a way that when a wire is provided along and in the pipe with a number of turns, a density of the turns has at least two different values over the longitudinal length.

Abstract: A measuring apparatus includes a base and a testing module. The testing module is received in the base and includes a temperature-controlling bucket, a testing cylinder, and upper and lower pistons. The temperature-controlling bucket extends in a vertical direction and has a bucket wall having a bucket inner surface and a bucket outer surface opposite to the bucket inner surface. The testing cylinder extends in the vertical direction, is received in the temperature-controlling bucket, and has a cylinder wall having a cylinder inner surface and a cylinder outer surface opposite to the cylinder inner surface. The upper and lower pistons plug top and bottom ends of the testing cylinder, respectively. The upper piston has a receiving room located inside the upper piston, and has a piston temperature sensor and a piston heating wire received in the receiving room.

Abstract: The present disclosure provides a method for setting up a molding system, wherein the molding system includes a molding machine and a mold disposed on the molding machine, and the mold has a mold cavity to be filled with a molding resin from the molding machine. The method includes generating first and second state waveforms using a predetermined packing pressure profile; obtaining an updated packing pressure profile based on the first and the second state waveforms; and setting up the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.

Abstract: The present disclosure provides a method for operating a molding system. The molding system includes a molding machine and a mold disposed on the molding machine, wherein the mold has a mold cavity for being filled with a molding material from the molding machine. The method comprises a step of obtaining a predetermined state waveform expressing a predetermined volumetric variation of the molding material. Next, the method further comprises obtaining a measured pressure and a measured temperature of the molding material in the mold cavity while performing a molding process for filling the molding material into the mold cavity. Next, the method includes obtaining a detected volumetric property of the molding material corresponding to the measured pressure and the measured temperature. Subsequently, the method comprises displaying the detected volumetric property of the molding material with the predetermined state waveform.

Abstract: The present disclosure provides a method for setting up a molding system, wherein the molding system includes a molding machine and a mold disposed on the molding machine, and the mold has a mold cavity to be filled with a molding resin from the molding machine. The method includes generating first and second state waveforms using a predetermined packing pressure profile; obtaining an updated packing pressure profile based on the first and the second state waveforms; and setting up the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.

Abstract: A measuring apparatus includes a base and a testing module. The testing module is received in the base and includes a temperature-controlling bucket, a testing cylinder, and upper and lower pistons. The temperature-controlling bucket extends in a vertical direction and has a bucket wall having a bucket inner surface and a bucket outer surface opposite to the bucket inner surface. The testing cylinder extends in the vertical direction, is received in the temperature-controlling bucket, and has a cylinder wall having a cylinder inner surface and a cylinder outer surface opposite to the cylinder inner surface. The upper and lower pistons plug top and bottom ends of the testing cylinder, respectively. The upper piston has a receiving room located inside the upper piston, and has a piston temperature sensor and a piston heating wire received in the receiving room.

Abstract: A molding system includes a molding machine, a mold disposed on the molding machine and having a mold cavity to be filled with a molding resin from the molding machine, and a computing apparatus connected to the molding machine. The computing apparatus is configured to perform operations for setting the molding machine to prepare a molding product, wherein the operations comprise: generating a first and a second state waveforms using a setting packing pressure profile; obtaining an updated packing pressure profile based on the first and the second state waveforms; and setting the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.

Abstract: A method for operating a molding machine includes specifying a simulating domain corresponding to a genuine domain in a mold disposed on the molding machine. The method proceeds to perform a virtual molding by using a setting packing pressure profile to generate a simulated state waveform, generating a designed state waveform including an isobaric phase and an isochoric phase while taking into consideration the simulated state waveform, and obtaining an updated packing pressure profile for applying a molding pressure to a portion of the genuine domain while taking into consideration a difference between the simulated state waveform and the designed state waveform. Subsequently, the method proceeds to set the molding machine while taking into consideration the updated packing pressure profile to perform an actual molding by applying an actual molding pressure to the at least a portion of the genuine domain to prepare the molding product.

Abstract: A method for operating a molding machine includes steps of specifying a simulating domain corresponding to a genuine domain in a mold disposed on the molding machine; performing a virtual molding by using an initial packing pressure profile to generate an initial state waveform expressing a relationship between an in-mold pressure and an in-mold temperature of the molding resin; obtaining an updated packing pressure profile for applying a molding pressure to at least a portion of the genuine domain while taking into consideration the initial state waveform; repeating the virtual molding while taking into consideration the updated packing pressure profile to generate an updated state waveform of the molding resin; and setting the molding machine taking into consideration the updated packing pressure profile to perform an actual molding by applying an actual molding pressure to the at least a portion of the genuine domain to prepare the molding product.

Abstract: A method for operating a molding machine includes specifying a simulating domain corresponding to a genuine domain in a mold disposed on the molding machine. The method proceeds to perform a virtual molding by using a setting packing pressure profile to generate a simulated state waveform, generating a designed state waveform including an isobaric phase and an isochoric phase while taking into consideration the simulated state waveform, and obtaining an updated packing pressure profile for applying a molding pressure to a portion of the genuine domain while taking into consideration a difference between the simulated state waveform and the designed state waveform. Subsequently, the method proceeds to set the molding machine while taking into consideration the updated packing pressure profile to perform an actual molding by applying an actual molding pressure to the at least a portion of the genuine domain to prepare the molding product.