Patents by Inventor Yuji Hashidate

Yuji Hashidate has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040200067
    Abstract: A method of machining a glass substrate using a laser, in which a low-permittivity, low-dielectric-loss glass substrate, capable of coping with mass production, is made applicable as the substrate of a high-frequency circuit intended in particular for microwave and millimeter-wave bands. For that purpose, a glass substrate is provided in which the amount of air bubbles in glass is arbitrarily controlled to improve the workability of the substrate. Then, the glass substrate is machined by being irradiated with a pulsed laser a plurality of times, thereby improving the machining shape of the glass substrate. Since glass substrates which are typically difficult to machine can be easily applied to the fabrication of high-frequency circuits, it becomes possible to supply high-performance circuits and apparatuses widely to the public.
    Type: Application
    Filed: May 4, 2004
    Publication date: October 14, 2004
    Applicant: Masushita Electric Industrial Co., Ltd.
    Inventors: Hiroshi Ogura, Yuji Hashidate, Hiroyoshi Yajima, Yoshikazu Yoshida
  • Patent number: 6772514
    Abstract: A method of machining a glass substrate by using a laser, in which a low-permittivity, low-dielectric-loss glass substrate capable of coping with mass production processes is made applicable as the substrate of a high-frequency circuit intended for microwave and millimeter-wave bands in particular. For that purpose, a glass substrate is provided in which the amount of air bubbles in glass is arbitrarily controlled to improve the workability of the substrate itself. Then, the glass substrate is machined while being irradiated with a pulsed laser for a plurality of times, thereby improving the machining shape of the glass substrate. Since glass substrates which are typically difficult to machine can be easily applied to the fabrication of high-frequency circuits, it becomes possible to supply high-performance circuits and apparatuses widely to the public.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: August 10, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroshi Ogura, Yuji Hashidate, Hiroyoshi Yajima, Yoshikazu Yoshida
  • Publication number: 20040104846
    Abstract: A method of machining a glass substrate by using a laser, in which a low-permittivity, low-dielectric-loss glass substrate capable of coping with mass production processes is made applicable as the substrate of a high-frequency circuit intended for microwave and millimeter-wave bands in particular. For that purpose, a glass substrate is provided in which the amount of air bubbles in glass is arbitrarily controlled to improve the workability of the substrate itself. Then, the glass substrate is machined while being irradiated with a pulsed laser for a plurality of times, thereby improving the machining shape of the glass substrate. Since glass substrates which are typically difficult to machine can be easily applied to the fabrication of high-frequency circuits, it becomes possible to supply high-performance circuits and apparatuses widely to the public.
    Type: Application
    Filed: November 17, 2003
    Publication date: June 3, 2004
    Applicant: MATSUSHITA ELECTRICAL INDUSTRIAL CO., LTD.
    Inventors: Hiroshi Ogura, Yuji Hashidate, Hiroyoshi Yajima, Yoshikazu Yoshida
  • Publication number: 20020005805
    Abstract: A method of machining a glass substrate by using a laser, in which a low-permittivity, low-dielectric-loss glass substrate capable of coping with mass production processes is made applicable as the substrate of a high-frequency circuit intended for microwave and millimeter-wave bands in particular. For that purpose, a glass substrate is provided in which the amount of air bubbles in glass is arbitrary controlled to improve the workability of the substrate itself. Then, the glass substrate is machined while being irradiated with a pulsed laser for a plurality of times, thereby improving the machining shape to the glass substrate. Since glass substrates which are typically difficult to machine can be easily applied to the fabrication of high-frequency circuits, it becomes possible to supply high-performance circuits and apparatuses widely to the public.
    Type: Application
    Filed: June 12, 2001
    Publication date: January 17, 2002
    Inventors: Hiroshi Ogura, Yuji Hashidate, Hiroyoshi Yajima, Yoshikazu Yoshida
  • Patent number: 5066101
    Abstract: A color separation optical system includes a set of prisms which separate incident light into components having different wavelengths. Image pickup devices may be exposed to the separated light components. An arrangement prevents or reduces the influence of a temperature variation upon color separation characteristics. The color separation optical system may be manufactured in a new way.
    Type: Grant
    Filed: October 17, 1989
    Date of Patent: November 19, 1991
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shinichiro Aoki, Koichi Kawata, Yasuyuki Morita, Akitoshi Mori, Yuji Hashidate, Tatsuki Tsukada, Hiroshi Nakamura
  • Patent number: 4890899
    Abstract: A color separation optical system includes a set of prisms which separate incident light into components having different wavelengths. Image pickup devices may be exposed to the separated light components. An arrangement prevents or reduces the influence of a temperature variation upon color separation characteristics. The color separation optical system maybe manufactured in a new way.
    Type: Grant
    Filed: May 13, 1988
    Date of Patent: January 2, 1990
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shinichiro Aoki, Koichi Kawata, Yasuyuki Morita, Akitoshi Mori, Yuji Hashidate, Tatsuki Tsukada, Hiroshi Nakamura