Abstract: A lighting device for a vehicle includes a lighting device body that has a light source part and a housing body that supports the light source part, and a ventilation part-adjacent to the lighting device body and through which outside wind passes. The light source part has a light source element part that emits light and a heat release member that releases heat that is generated in the light source element part. The light source element part is inside of the housing body and the heat release member is exposed inside of the ventilation part.

Abstract: A light source device includes a plurality of light emitting unit portions including a light emitting element, a flashing circuit configured to cause the light emitting element to flash, and a delay circuit configured to control a timing at which the flashing circuit causes the light emitting element to flash. The delay circuit includes a resistor and a capacitor. At least two light emitting unit portions are connected to each other in parallel. At least one of a resistance value of the resistor and a capacitance value of the capacitor differs among the at least two light emitting unit portions connected to each other in parallel.

Abstract: A lighting device for a vehicle includes a lighting device body that has a light source part and a housing body that supports the light source part, and a ventilation part-adjacent to the lighting device body and through which outside wind passes. The light source part has a light source element part that emits light and a heat release member that releases heat that is generated in the light source element part. The light source element part is inside of the housing body and the heat release member is exposed inside of the ventilation part.

Abstract: A wiring board that incorporates electric element such as capacitor. The wiring board includes a dielectric substrate having electronic components mounting surface on the surface thereof, an electric element that is embedded in the dielectric substrate, a first conductive layer and a second conductive layer formed inside of the dielectric substrate, and via hole conductors that connect the first terminal electrode and the second terminal electrode of the electric element to the first conductive layer and the second conductive layer, respectively, and extend the surface of the dielectric substrate from the first and second conductive layers. In case both the first and the second terminal electrodes are provided in plurality, all of the plurality of first terminal electrodes are connected to the first conductive layer through the via hole conductors and all of the plurality of second terminal electrodes are connected to the second conductive layer through the via hole conductors.

Abstract: A wiring board comprising an insulating substrate containing at least an organic resin, a plurality of electrically conducting wiring layers formed on the surface and/or inside of said insulting substrate, and via-hole conductors formed in said insulating substrate in order to electrically connect the plurality of electrically conducting wiring layers, wherein said via-hole conductors contain an organic binder as well as a Cu—Sn intermetallic compound as an electrically conducting component. The via-hole conductors formed in the wiring board exhibit a high electric conductivity and a large heat resistance, making it possible to very highly reliably connect the electrically conducting wiring layers together.

Abstract: A multilayer wiring board formed by laminating a plurality of circuit board units each including an insulating board containing at least a thermosetting resin, and a wiring circuit layer formed on the surface of said insulating board, wherein said insulating board is provided with via hole conducting passages so as to electrically connect the wiring circuit layers of the neighboring circuit board units, said via hole conducting passages are formed by filling via holes formed in the insulating board with a conducting paste, and said wiring circuit layer is buried in the surface of the insulating board in a manner that said insulating board possesses a flat surface. The multilayer wiring board has a satisfactory flatness required for mounting flip chips. Besides, the insulating board and the via hole conducting passages are not infiltrated by chemicals such as etching solution or plating solution.

Abstract: Disclosed is a process for the preparation of a composite metal oxide superconductor, in which a composite metal oxide composition comprising Bi, Pb, Sr, Ca and Cu and further containing an alkali metal at a specific ratio is used as the starting material, and this composite metal oxide composition is molded and fired. According to this process, precipitation of the 80 K phase and other impurities is controlled, and a superconductor containing a large quantity of the 110 K phase and a high critical temperature is obtained.