Patents by Inventor Yuji Iizuka
Yuji Iizuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240157249Abstract: The present invention can provide a game system and the like that improves the interest of the game in playing a plurality of people by adjusting difficulty of a game with maintaining game enjoyment based on the timing of operation inputs, and providing the production for livening up a battle performed by a plurality of players. The game system S of the present embodiment performs an evaluation process of an evaluation for each player based on an operation input timing and a given relationship between a mark object for determining operation input timing and an operation timing object; moves, in a second direction that is a direction opposite to the first direction, the corresponding operating-system object formation area in accordance with the evaluation of the evaluation process; and set at least a part of the operating-system object formation area to the non-display range.Type: ApplicationFiled: March 28, 2022Publication date: May 16, 2024Inventors: Yuji IIZUKA, Takehito SASAOKA, Takeharu KIJIMA, Hiroumi ENDO
-
Patent number: 11979064Abstract: An example motor rotor includes a cylindrical magnet which is disposed around a rotation shaft, a protective layer which is disposed around the magnet, and a middle resin portion which is disposed between the magnet and the protective layer. The magnet has a cylindrical shape that extends continuously in a circumferential direction of the rotation shaft. A surface treatment portion is formed on at least one of an outer peripheral surface of the magnet or an inner peripheral surface of the protective layer, to impart adhesion with the middle resin portion.Type: GrantFiled: October 5, 2021Date of Patent: May 7, 2024Inventors: Hikaru Sugiura, Yuji Sasaki, Tatsumi Inomata, Kai Iijima, Tatsuya Fukui, Yoshihito Katsu, Kuniaki Iizuka, Ryosuke Yumoto
-
Publication number: 20230040019Abstract: A method of manufacturing a semiconductor device, the method including: preparing an insulated circuit substrate including a conductive plate; partially fixing a plate-like bonding member onto the conductive plate so as to make a positioning of the bonding member in a horizontal direction; mounting a semiconductor chip on the bonding member; and heating and melting the bonding member so as to form a bonding layer for bonding the insulated circuit substrate and the semiconductor chip each other.Type: ApplicationFiled: June 29, 2022Publication date: February 9, 2023Applicant: FUJI ELECTRIC CO., LTD.Inventor: Yuji IIZUKA
-
Patent number: 11014000Abstract: A simulation system includes a processor including hardware. The processor performs an information acquisition process of acquiring position information of a user wearing a head mounted display to cover his/her field of view; a virtual space setting process of setting a virtual space where a moving body corresponding to the user is arranged and set based on the acquired position information; a moving body process of moving the moving body in the virtual space based on the acquired position information; and a display process of generating a display image on the head mounted display. In the virtual space setting process, the processor sets the virtual space such that a first moving body group and a second moving body group are arranged and set in a common virtual field of the virtual space.Type: GrantFiled: May 17, 2019Date of Patent: May 25, 2021Assignee: BANDAI NAMCO ENTERTAINMENT INC.Inventors: Junichiro Koyama, Akio Onda, Takashi Aoki, Norihiro Nishimura, Toru Hisano, Yuji Iizuka, Hiroumi Endo, Kenichi Nagashima, Hiroki Yakata, Kentaro Tamura, Akinari Ushiguchi, Koji Inokuchi
-
Patent number: 10658343Abstract: A pressure contact-type semiconductor module includes a plurality of semiconductor units disposed side-by-side, each of the semiconductor units including: a semiconductor device substrate; a first electrode formed below the semiconductor device substrate, a second electrode formed above the semiconductor device substrate, an electrode plate electrically connected to the second electrode; and a pressure contact adjustment member screwed into the electrode plate, the pressure contact adjustment member having a top surface as a pressure contact-receiving surface to which a lead-out electrode plate that is common to the plurality of semiconductor units is to be pressure-contacted, levels of the respective top surfaces of the pressure contact adjustment members in the plurality of semiconductor units being adjustable to match a reference pressure contact plane so that contact pressures in the respective top surfaces applied by the lead-out electrode plate are substantially the same among the semiconductor units.Type: GrantFiled: November 3, 2017Date of Patent: May 19, 2020Assignee: FUJI ELECTRIC CO., LTD.Inventor: Yuji Iizuka
-
Publication number: 20190329136Abstract: A simulation system includes a processor including hardware. The processor performs an information acquisition process of acquiring position information of a user wearing a head mounted display to cover his/her field of view; a virtual space setting process of setting a virtual space where a moving body corresponding to the user is arranged and set based on the acquired position information; a moving body process of moving the moving body in the virtual space based on the acquired position information; and a display process of generating a display image on the head mounted display. In the virtual space setting process, the processor sets the virtual space such that a first moving body group and a second moving body group are arranged and set in a common virtual field of the virtual space.Type: ApplicationFiled: May 17, 2019Publication date: October 31, 2019Applicant: BANDAI NAMCO ENTERTAINMENT INC.Inventors: Junichiro KOYAMA, Akio ONDA, Takashi AOKI, Norihiro NISHIMURA, Toru HISANO, Yuji IIZUKA, Hiroumi ENDO, Kenichi NAGASHIMA, Hiroki YAKATA, Kentaro TAMURA, Akinari USHIGUCHI, Koji INOKUCHI
-
Publication number: 20180175007Abstract: A pressure contact-type semiconductor module includes a plurality of semiconductor units disposed side-by-side, each of the semiconductor units including: a semiconductor device substrate; a first electrode formed below the semiconductor device substrate, a second electrode formed above the semiconductor device substrate, an electrode plate electrically connected to the second electrode; and a pressure contact adjustment member screwed into the electrode plate, the pressure contact adjustment member having a top surface as a pressure contact-receiving surface to which a lead-out electrode plate that is common to the plurality of semiconductor units is to be pressure-contacted, levels of the respective top surfaces of the pressure contact adjustment members in the plurality of semiconductor units being adjustable to match a reference pressure contact plane so that contact pressures in the respective top surfaces applied by the lead-out electrode plate are substantially the same among the semiconductor units.Type: ApplicationFiled: November 3, 2017Publication date: June 21, 2018Applicant: Fuji Electric Co., Ltd.Inventor: Yuji IIZUKA
-
Patent number: 9842786Abstract: A semiconductor device includes a supporting plate including a first surface, a second surface opposite to the first surface, and a through hole extending from the first surface to the second surface; and a semiconductor unit fixed to the first surface. The semiconductor unit includes an insulating plate, a circuit plate fixed to a front surface of the insulating plate, a semiconductor chip fixed to the circuit plate, and a protruding metal block fixed to a rear surface of the insulating plate and penetrating through the through hole to extend to the second surface.Type: GrantFiled: September 11, 2015Date of Patent: December 12, 2017Assignee: FUJI ELECTRIC CO., LTD.Inventor: Yuji Iizuka
-
Patent number: 9478477Abstract: A semiconductor device includes a semiconductor element having a semiconductor chip and connection terminals, a cooling fin to which the semiconductor element is fixed, and an external cooling body having a passage for cooling medium, the cooling fin being fixed to the external cooling body. The semiconductor element has a protruding cooling block that is inserted and fixed to the cooling fin, which in turn is fixed to the external cooling body such that the cooling fin is in contact with the cooling medium.Type: GrantFiled: July 14, 2014Date of Patent: October 25, 2016Assignee: FUJI ELECTRIC CO., LTD.Inventor: Yuji Iizuka
-
Patent number: 9379083Abstract: A semiconductor device is a composite module in which three power semiconductor modules are arranged at a predetermined interval in the same plane and pin-shaped conductors that are drawn from the power semiconductor modules to the outside are connected to three main terminal plates such that they are integrated with each other. When the entire composite module is accommodated in a protective case and a radiation fin is provided, bolts are inserted into through holes to fix the protective case to the radiation fin. In this way, it is possible to accommodate the composite module in the protective case while reliably bringing the bottom of an insulating substrate into close contact with the radiation fin.Type: GrantFiled: August 8, 2014Date of Patent: June 28, 2016Assignee: FUJI ELECTRIC CO., LTD.Inventors: Yuji Iizuka, Masafumi Horio, Hideyo Nakamura
-
Publication number: 20150061109Abstract: A semiconductor device includes a semiconductor element having a semiconductor chip and connection terminals, a cooling fin to which the semiconductor element is fixed, and an external cooling body having a passage for cooling medium, the cooling fin being fixed to the external cooling body. The semiconductor element has a protruding cooling block that is inserted and fixed to the cooling fin, which in turn is fixed to the external cooling body such that the cooling fin is in contact with the cooling medium.Type: ApplicationFiled: July 14, 2014Publication date: March 5, 2015Inventor: Yuji IIZUKA
-
Publication number: 20140367736Abstract: A semiconductor device is a composite module in which three power semiconductor modules are arranged at a predetermined interval in the same plane and pin-shaped conductors that are drawn from the power semiconductor modules to the outside are connected to three main terminal plates such that they are integrated with each other. When the entire composite module is accommodated in a protective case and a radiation fin is provided, bolts are inserted into through holes to fix the protective case to the radiation fin. In this way, it is possible to accommodate the composite module in the protective case while reliably bringing the bottom of an insulating substrate into close contact with the radiation fin.Type: ApplicationFiled: August 8, 2014Publication date: December 18, 2014Inventors: Yuji IIZUKA, Masafumi HORIO, Hideyo NAKAMURA
-
Publication number: 20120074563Abstract: A semiconductor apparatus includes a semiconductor chip, a post electrode positioned on the front surface electrode, and a metal particle layer having metal particles bonded actively to each other. The front surface electrode and the post electrode are bonded with each other through the metal particle layer. A method of manufacturing a semiconductor apparatus includes the steps of coating metal particles protected with organic coating films to at least one of the front surface electrode of a semiconductor chip or the post electrode; pressing and heating the metal particles between the front surface electrode of the semiconductor chip and post electrode for breaking the organic coating films and for exposing the metal particles; and actively bonding the exposed metal particles to each other for bonding the front surface electrode and post electrode.Type: ApplicationFiled: September 23, 2011Publication date: March 29, 2012Applicant: Fuji Electric Co., Ltd.Inventor: Yuji Iizuka
-
Patent number: 6425826Abstract: A game machine having a plurality of play patterns for a game, the play patterns being different from each other in the numbers of moving-body objects entering the game, for providing images of a highest quality for each play pattern in real time, and an information storage medium suitable for use in such a game machine. The game machine can be used to play a game having a plurality of play patterns which are different from each other in the number of moving-body objects entering the game. In order to generate a more accurate images of moving-body objects for a play pattern having a reduced number of moving-body objects entering the game, the game machine comprises an accuracy setting section for setting the accuracy of moving-body objects for each play pattern and an image generation section for generating images of the moving-body objects based on the accuracy.Type: GrantFiled: April 11, 2000Date of Patent: July 30, 2002Assignee: Namco, Ltd.Inventors: Kensuke Nakanishi, Yuji Iizuka