Patents by Inventor Yuji Irisawa

Yuji Irisawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLYMERIZABLE COMPOSITION, VEHICLE, CURED MATERIAL, AND METHOD OF MANUFACTURING CURED MATERIAL
    Publication number: 20240117081
    Abstract: A polymerizable composition includes a water-soluble monofunctional acrylamide compound, a water-soluble photoradical initiator, a water-soluble photosensitizer, and an aqueous solvent.
    Type: Application
    Filed: November 10, 2020
    Publication date: April 11, 2024
    Applicant: ADEKA CORPORATION
    Inventors: Kenji HARA, Kazuteru NAGASAKA, Masatomi IRISAWA, Yuji ODA
  • Method for Regenerating Adhesive Surface of Component Holding Jig
    Publication number: 20200306801
    Abstract: A method for regenerating an adhesive surface by removing a foreign matter adhering to the adhesive surface of a component holding jig. The method includes: disposing, on the adhesive surface, a mask member having: a surface which is in contact with the adhesive surface and has an arithmetic mean roughness of 1.0 ?m or less; and an opening through which the adhesive surface is exposed; disposing a curable resin composition on the adhesive surface and on the mask member and curing the curable resin composition; and simultaneously peeling off the mask member and a cured product of the curable resin composition.
    Type: Application
    Filed: February 24, 2020
    Publication date: October 1, 2020
    Inventors: Yuji Irisawa, Toshiaki Hatsumi
  • Adhesive substrate and method for separating an object from an adhesive substrate
    Patent number: 10772213
    Abstract: An adhesive substrate is disclosed, which includes a base substrate and a heat-resistant elastomer layer formed on the base substrate, wherein the base substrate is flexible and has a thickness of 0.2 mm or more and 2 mm or less, wherein the adhesive substrate is used as part of a method for physically separating an object that has been held immovable in such a manner that the object has been adhered to by the heat-resistant elastomer layer and the object is anchored from the upper side, and wherein by starting to physically separate the end portion of the adhesive substrate downward the object is able to be separated.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: September 8, 2020
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Yuji Irisawa, Toshiaki Hatsumi
  • Adhesive Substrate and Method for Separating an Object from an Adhesive Substrate
    Publication number: 20190327838
    Abstract: An adhesive substrate is disclosed, which includes a base substrate and a heat-resistant elastomer layer formed on the base substrate, wherein the base substrate is flexible and has a thickness of 0.2 mm or more and 2 mm or less, wherein the adhesive substrate is used as part of a method for physically separating an object that has been held immovable in such a manner that the object has been adhered to by the heat-resistant elastomer layer and the object is anchored from the upper side, and wherein by starting to physically separate the end portion of the adhesive substrate downward the object is able to be separated.
    Type: Application
    Filed: September 5, 2018
    Publication date: October 24, 2019
    Inventors: Yuji Irisawa, Toshiaki Hatsumi