Abstract: A windshield mounting structure includes A-pillars for mounting a windshield and cracking inducers provided at the A-pillars. The cracking inducers cause cracking in the windshield when an external force greater than a given force acts on the windshield from the vehicle outside. The cracking in the windshield allows the windshield to move in its entirety or in part toward a passenger compartment, absorbing impact in collision.

Abstract: A semiconductor chip of rewiring layer-integral type capable of preventing a maloperation by noise and a deterioration of communication characteristics and a semiconductor device with excellent communication characteristics; the semiconductor chip, wherein a rewiring layer (3) is formed on a circuit formed surface (1a) through an insulating layer (2) so as to form an antenna coil (4) with the rewiring layer (3), the antenna coil (4) is formed around the periphery of an analog circuit (21) on the circuit formed surface (1a) by avoiding forming on the analog circuit (21), the analog circuit (21) may be formed by collecting analog circuits to be formed in the semiconductor chip (1A) therein, may be one of the particularly noise-susceptible analog circuits such as a power circuit, a calculation amplifier, a comparison amplifier, an RF receiving part, an RF transmitting part, an RF synthesizer part, and a voltage build-up circuit and an amplifying circuit forming a part of a memory part, or may be a coil provided

Abstract: An edge detecting circuit detects whether a particular pixel belongs to an edge by determining whether the differential value of the pixel from the neighboring pixel is equal to or greater than a threshold. Based on the detection result, an emphasis converter stops OS drive when the image of a pixel area is regarded as an edge image in accordance with the detected result of the edge detecting circuit and implements OS drive when the image of a pixel area is not regarded as an edge image. In this way, the edge detecting circuit detects edge portions of the input video, whereby OS drive in the emphasis converter can be controlled so as to be turned on and off.

Abstract: A windshield of a laminated glass curved to protrude toward the vehicle outside. An interlayer of the laminated glass is tensioned so that the windshield has a force acting to cause the entire laminated glass to flex toward a passenger compartment. The windshield is configured in its entirety to be flexible toward the inside of the passenger compartment, so that the impact of an object colliding with the windshield from the vehicle outside can be absorbed and impact received by the colliding object can be mitigated.

Abstract: An emphasis converter 52 compares the image data of the current vertical period with the image data of the previous vertical period and controls the input image data to a liquid crystal display panel 4 based on the emphasis conversion parameters stored in tables of ROMs 3a to 3c so as to achieve accelerated drive. A microcomputer 38 is able to realize stable control of selecting emphasis conversion parameters by adding hysteresis to the detected temperature from a thermistor 37 even when the detected temperature fluctuates up and down crossing the temperature threshold.

Abstract: A windshield mounting structure includes A-pillars for mounting a windshield and frangible members provided at the A-pillars for supporting the windshield. When an object collides with the windshield from the vehicle outside, the frangible members deform or break, thereby causing the windshield to move in its entirety or in part inward into a passenger compartment, absorbing the impact in collision.

Abstract: A semiconductor device has peripheral electrode pads formed on the periphery of a semiconductor chip, land pads comprising the first land pads and the second land pads formed on the semiconductor chip, and circuits formed in the semiconductor chip. The peripheral electrode pads are connected to internal circuits by internal lines. The first land pads are connected to the peripheral electrode pads by rewired lines. The second electrode pads, on the other hand, are connected to the internal circuits by internal electrode pads and internal lines, not by the peripheral electrode pads.

Abstract: An automobile heel stopper shock-absorbing structure is formed from a receiving plate that on the outside has a heel receiving surface and on the inside faces a dash panel with a space therebetween, a front support plate connected integrally to a front end part of the receiving plate and having its extremity joined to the dash panel, and a rear support plate connected integrally to a rear end part of the receiving plate and having its extremity joined to at least one of the dash panel and a floor panel. The rear support plate is made weaker than the receiving plate and the front support plate so that the rear support plate will buckle when a pushing-in load acting on the receiving plate is equal to or greater than a predetermined value.

Abstract: For producing a semiconductor module, an electrically insulating layer and an electrically conductive layer are formed on a Nickel-base metal film over a metallic surface, the electrically conductive layer is connected electrically to an electric element through an electrically conductive joint arranged between the electric element and the electrically conductive layer, at least a part of the electric element and at least a part of the electrically conductive joint are covered with a molding resin, and subsequently, the Nickel-base metal film is removed from the metallic surface so that a combination of the Nickel-base metal film, the electrically insulating layer, the electrically conductive layer, the electrically conductive joint and the molding resin is separated from the metallic surface.

Abstract: An airbag device has a bag housing case, an airbag housed in the bag housing case, a plate member provided within the airbag, and a bag pressure release mechanism. When the internal pressure of the airbag reaches a predetermined pressure, the bag pressure release mechanism opens the airbag to prevent an increase in the internal pressure of the airbag. The plate member covers the bag pressure release mechanism when the airbag is in a deflated state. When the airbag is inflated, the plate member is released from coverage of the bag pressure release mechanism by an inflating force.

Abstract: The present invention provides an airbag device for, upon collision of a vehicle carrying the airbag device with an obstacle, mitigating the impact of collision of the obstacle with an inflated airbag. The airbag device includes a bag housing case and a cover. A main airbag and a cover opening bag are housed in deflated, folded states within the bag housing case. First, the cover opening bag inflates by the inflow of gas, opening the cover. Gas also flows into the main airbag through the cover opening bag, thereby inflating the main airbag. If an obstacle collides with the inflated main airbag, a bag pressure release mechanism provided at the bottom of the bag housing case opens the main airbag, releasing gas within the main airbag and mitigating the impact on the obstacle.

Abstract: A windshield of a laminated glass curved to protrude toward the vehicle outside. An interlayer of the laminated glass is tensioned so that the windshield has a force acting to cause the entire laminated glass to flex toward a passenger compartment. The windshield is configured in its entirety to be flexible toward the inside of the passenger compartment, so that the impact of an object colliding with the windshield from the vehicle outside can be absorbed and impact received by the colliding object can be mitigated.

Abstract: A windshield mounting structure includes A-pillars for mounting a windshield and frangible members provided at the A-pillars for supporting the windshield. When an object collides with the windshield from the vehicle outside, the frangible members deform or break, thereby causing the windshield to move in its entirety or in part inward into a passenger compartment, absorbing the impact in collision.

Abstract: A windshield mounting structure includes A-pillars for mounting a windshield and cracking inducers provided at the A-pillars. The cracking inducers cause cracking in the windshield when an external force greater than a given force acts on the windshield from the vehicle outside. The cracking in the windshield allows the windshield to move in its entirety or in part toward a passenger compartment, absorbing impact in collision.

Abstract: An automobile heel stopper shock-absorbing structure is formed from a receiving plate that on the outside has a heel receiving surface and on the inside faces a dash panel with a space therebetween, a front support plate connected integrally to a front end part of the receiving plate and having its extremity joined to the dash panel, and a rear support plate connected integrally to a rear end part of the receiving plate and having its extremity joined to at least one of the dash panel and a floor panel. The rear support plate is made weaker than the receiving plate and the front support plate so that the rear support plate will buckle when a pushing-in load acting on the receiving plate is equal to or greater than a predetermined value.

Abstract: In a data transfer apparatus 10, first, second, third data transmitters 141, 142, 143 are located in a data transmission device 11. Data which must not be influenced by delay of transmission timing of the other data are stored in first, second, third data transmitters 141, 142, 143. The data selector 16 selects these at a predetermined order or frequency to be transmitted to a data reception device 12. As a result, when an uncorrectable trouble is detected by a trouble detecting section 27, a re-issue instruction 21 is issued at a predetermined timing based on information stored in an information round robin section 36. The corresponding data from the corresponding data transmitter 141, 142, or 143 is selected by the data selector 16 and then re-sent.

Abstract: An automotive outboard air bag system (30) is provided in which an elongate tubular air bag (33) is inflated to deploy upwardly from the vicinity of a front pillar lower end portion (18a), the air bag so inflated to deploy is made to extend along an outer surface (18b) of a front pillar (18), and a strap (35) which is shorter than the overall length (L2) of the air bag (33) is allowed to extend from an upper end (33b) to a lower end (33a) of the air bag (33) so as to face the outer surface (18b) of the front pillar (18).

Abstract: An automotive outboard air bag system (30) is provided in which a belt-like strap (34) is provided at substantially a center within an air bag (33) to extend from an upper end portion (33a) to a lower end portion (33b) of the air bag (33) with sides of the strap (34) being made to extend in a longitudinal direction of a vehicle body, front and rear side edges (34a, 34b) of the strap (34) are connected to an inner circumference (33c) of the air bag (33) to thereby form front and rear constricted portions (35) on front and rear central portions of the air bag (33) , and left and right convexly curved portions (36) which can come into contact with an outer surface (12b) of a windshield (12) and a garnish (18b) of a front pillar (18) , respectively, are provided on both sides of the rear constricted portion (35).

Abstract: For producing a semiconductor module, an electrically insulating layer and an electrically conductive layer are formed on a Nickel-base metal film over a metallic surface, the electrically conductive layer is connected electrically to an electric element through an electrically conductive joint arranged between the electric element and the electrically conductive layer, at least a part of the electric element and at least a part of the electrically conductive joint are covered with a molding resin, and subsequently, the Nickel-base metal film is removed from the metallic surface so that a combination of the Nickel-base metal film, the electrically insulating layer, the electrically conductive layer, the electrically conductive joint and the molding resin is separated from the metallic surface.

Abstract: For producing a semiconductor module, an electrically insulating layer and an electrically conductive layer are formed on a Nickel-base metal film over a metallic surface, the electrically conductive layer is connected electrically to an electric element through an electrically conductive joint arranged between the electric element and the electrically conductive layer, at least a part of the electric element and at least a part of the electrically conductive joint are covered with a molding resin, and subsequently, the Nickel-base metal film is removed from the metallic surface so that a combination of the Nickel-base metal film, the electrically insulating layer, the electrically conductive layer, the electrically conductive joint and the molding resin is separated from the metallic surface.