Abstract: A method for manufacturing MAl2O4:Eu,RE type long-lasting phosphor ceramics that is capable of producing the ceramics at a reduced raw material cost. In addition, a sintered product of a long-lasting phosphor having no yellow body color. More specifically, the method for manufacturing MAl2O4:Eu,RE type long-lasting phosphor ceramics in which M is an alkaline earth element and RE is a rare earth element other than europium, involving mixing a BAM (alkaline earth aluminate) phosphor, an alkaline earth compound, an aluminum compound and a rare earth compound to form a mixture, and then firing the mixture; and a white MAl2O4:Eu,RE type long-lasting phosphor resulting from the method.

Abstract: A method for manufacturing MAl2O4:Eu,RE type long-lasting phosphor ceramics that is capable of producing the ceramics at a reduced raw material cost. In addition, a sintered product of a long-lasting phosphor having no yellow body color. More specifically, the method for manufacturing MAl2O4:Eu,RE type long-lasting phosphor ceramics in which M is an alkaline earth element and RE is a rare earth element other than europium, involving mixing a BAM (alkaline earth aluminate) phosphor, an alkaline earth compound, an aluminum compound and a rare earth compound to form a mixture, and then firing the mixture; and a white MAl2O4:Eu,RE type long-lasting phosphor resulting from the method.

Abstract: In order to set automatically related software in a facility management system and to start quickly and easily a state monitoring when various measuring instruments are attached to or removed from a facility to be monitored, secured, and maintained, when a sensor which is the measuring instrument is connected, a measuring-instrument reading device which is a lower level device transmits a type of the measuring instrument and a purpose of connecting the measuring instrument to a directory server, the directory server generates an instance by referring to class information and generates and registers a relation instance by referring to an inter-class relationship, the directory server transmits the generated instance to a related devices on the basis of an inter-instance relationship, and the directory server exchanges facility management data between instances on the basis of the inter-instance relationship.

Abstract: A thermionic generator for converting thermal energy to electric energy includes: an emitter electrode for emitting thermal electrons from a thermal electron emitting surface when heat is applied to the emitter electrode; a collector electrode facing the emitter electrode spaced apart from the emitter electrode by a predetermined distance, and receiving the thermal electrons from the emitter electrode via a facing surface of the collector electrode; and a substrate having one surface. The emitter electrode and the collector electrode are disposed on the one surface of the substrate, and are electrically insulated from each other. The thermal electron emitting surface and the facing surface are perpendicular to the one surface.

Abstract: A thermionic power generator includes an emitter generating thermions and a collector collecting the thermions. The emitter includes an emitter substrate having an electric conductivity, a low resistance layer stacked to the emitter substrate and made of an n-type diamond semiconductor that includes phosphorus as a donor, and an electron emission layer stacked to the low resistance layer and made of an n-type diamond semiconductor that includes nitrogen as a donor. The collector includes a collector substrate having an electric conductivity and is disposed opposite to the emitter via a clearance. The electron emission layer has a thickness equal to or less than 40 nm.

Abstract: A thermionic converter for converting thermal energy to electrical energy includes an emitter and a collector. The emitter emits thermionic electrons upon receipt of heat from a heat source. The emitter is made of a first semiconductor material to which a first semiconductor impurity is doped with a first concentration. The collector is spaced and opposite to the emitter to receive the thermionic electrons emitted from the emitter so that the thermal energy is converted to electrical energy. The collector is made of a second semiconductor material to which a second semiconductor impurity is doped with a second concentration less than the first concentration.

Abstract: To provide a protection element evens the amount of flux on a fusible conductor and improves variations in fusing characteristics. A protection element is provided with: an insulated substrate; a heating body; an insulating member; two electrodes; a heating body internal electrode; a fusible conductor which is stacked over the two electrodes from the heating body internal electrode and fuses a current path between the two electrodes by heating; a flux coated on the fusible conductor so as to superimpose on the heating body; and a cover member attached to the insulated substrate covering at least the fusible conductor. The cover member has a cylindrical protrusion formed on an inner surface of the cover member so as to contact the flux, and a communication hole communicating with the inner surface side of the cover member from the protrusion is opened on a side wall surface of the cover member.

Abstract: To realize a protection member that makes a flux amount applied on a fusible conductor uniform, and improves variation of fusing characteristics. The protection member includes an insulating substrate, a heating body, an insulating member, two electrodes, a heating body internal electrode, a fusible conductor layered from the heating body internal electrode to the two electrodes, and configured to fuse a current path between the two electrodes by heating, flux applied on the fusible conductor to superimpose with the heating body, and a cover member covering at least the fusible conductor and attached to the insulating substrate. The cover member further includes a plurality of cylindrical projection portions facing the heating body and formed on an inner surface of the cover member to be in contact with the flux.

Abstract: An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, the first and second sealing frames being composed of a Ni film. A bonding section constituted by a Ni—Bi alloy is formed between the first and second sealing frames. For example, a Bi layer is formed on the first sealing frame, and then the first sealing frame and the second sealing frame are heated at a temperature of 300° C. for at least 10 seconds while applying pressure in the direction in which the first sealing frame and the second sealing frame are in close contact with each other, and thus the bonding section, which bonds the first sealing frame to the second sealing frame, is formed.

Abstract: A protection element is provided which is capable of stably retaining a flux on a soluble conductor at a predetermined position, enabling a speedy and precise blowout of the soluble conductor in the event of an abnormality. This protection element includes: a soluble conductor 13 which is disposed on an insulation baseboard 11 and is connected to a power supply path of a device targeted to be protected, to cause a blowout by means of a predetermined abnormal electric power; a flux 19 which is coated onto a surface of the soluble conductor 13; and an insulation cover 14 which is mounted on the baseboard 11 with the soluble conductor 13 being covered therewith. In addition, the protection element is provided with a protrusive stripe portion 20 which is formed on an interior face of the insulation cover 14 in opposite to the soluble conductor 13 and in which a stepped portion 20a for retaining the flux 19 is formed at a predetermined position while in contact with the flux 19.

Abstract: In a method for producing an electronic component device, a heat bonding step is performed in a state in which low melting point metal layers including low melting point metals including, for example, Sn as the main component, are arranged to sandwich, in the thickness direction, a high melting point metal layer including a high melting point metal including, for example, Cu as the main component, which is the same or substantially the same as high melting point metals defining first and second conductor films to be bonded. In order to generate an intermetallic compound of the high melting point metal and the low melting point metal, the distance in which the high melting point metal is to be diffused in each of the low melting point metal layers is reduced. Thus, the time required for the diffusion is reduced, and the time required for the bonding is reduced.

Abstract: In a method of manufacturing an electrode of a thermionic converter, a carbide layer is formed on a base material by a vapor synthesis, an N-type diamond layer doped with a donor impurity is formed on the carbide layer by a vapor synthesis, and a surface of the N-type diamond layer is terminated with hydrogen. The base material is made of a metal, and the carbide layer is made of a metal carbide.

Abstract: An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, both of which are composed of a Ni film. A bonding section bonds the first sealing frame to the second sealing frame. For example, a Bi layer is formed on the first sealing frame and an Au layer is formed on the second sealing frame, and then the first sealing frame and the second sealing frame are heated at a temperature of 300° C. for 10 seconds while applying pressure in the direction in which the first sealing frame and the second sealing frame are close contact with each other to form the bonding section. The bonding section is constituted by a mixed layer predominantly composed of a mixed alloy of a Ni—Bi—Au ternary alloy and Au2Bi.

Abstract: A protection element is provided which is capable of stably retaining a flux on a soluble conductor at a predetermined position and is capable of checking a retention state of the flux, enabling a speedy blowout of the soluble conductor in the event of an abnormality. This protection element includes: a soluble conductor 13 which is disposed on an insulation baseboard 11 and is connected to an electric power supply path of a device targeted to be protected, to cause a blowout by means of a predetermined abnormal electric power; a flux 19 which is coated onto a surface of the soluble conductor 13; and an insulation cover 14 which is mounted on the baseboard 11 with the soluble conductor 13 being covered therewith. The insulation cover 14 is provided with an opening porting 20 made of a through hole which is opposite to the soluble conductor 13. The flux 19 comes into contact with a peripheral edge part of the opening portion 20, retaining the flux 19 at a predetermined position on the soluble conductor 13.

Abstract: An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, the first and second sealing frames being composed of a Ni film. A bonding section constituted by a Ni—Bi alloy is formed between the first and second sealing frames. For example, a Bi layer is formed on the first sealing frame, and then the first sealing frame and the second sealing frame are heated at a temperature of 300° C. for at least 10 seconds while applying pressure in the direction in which the first sealing frame and the second sealing frame are in close contact with each other, and thus the bonding section, which bonds the first sealing frame to the second sealing frame, is formed.

Abstract: An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, the first and second sealing frames being composed of a Ni film. A bonding section constituted by a Ni—Bi alloy is formed between the first and second sealing frames. For example, a Bi layer is formed on the first sealing frame, and then the first sealing frame and the second sealing frame are heated at a temperature of 300° C. for at least 10 seconds while applying pressure in the direction in which the first sealing frame and the second sealing frame are in close contact with each other, and thus the bonding section, which bonds the first sealing frame to the second sealing frame, is formed.

Abstract: A protection element and a secondary battery device employing the protection element are provided for stably retaining a flux on a soluble conductor at a predetermined position, so as to enable appropriate blowout of the soluble conductor in the event of an abnormality. The protection element has a soluble conductor which is disposed on an insulation baseboard, and which is connected to a power supply path of a device targeted to be protected, and which causes a blowout when a predetermined abnormal electric power amount is supplied. A flux is coated on a surface of the soluble conductor, and an insulation cover member is mounted on the baseboard and covers the soluble conductor. The protection element also includes a stepped portion for retaining the flux at a predetermined position in contact with the flux, and the stepped portion is formed opposite to the soluble conductor on an interior face of the insulation cover member.

Abstract: The present invention provides a production process for the production of an MAl2O4:Eu type long-lasting phosphor (M representing an alkaline earth metal). The process includes the steps of mixing a BAM (alkaline earth aluminate) phosphor with an alkaline earth compound and calcinating the resulting mixture.

Abstract: A triaxial acceleration sensor which has a structure including a cover joined to a substrate including a mechanically operable functional unit to be sealed, is adapted in such a way that the joined state can be reliably obtained so as to not interfere with a displacement of the functional unit. A sealing frame is made of a heated polyimide on a periphery of an upper main surface of a substrate provided with a functional unit, and a sealing layer made of a polyimide is formed over an entire lower main surface of a cover. For integrating the substrate and the cover so as to seal the functional unit, the sealing frame and the sealing layer are joined to each other by heating and pressurizing the sealing frame and the sealing layer at a temperature that is about 50° C. to about 150° C. higher than a glass transition temperature of the polyimide while bringing the sealing frame and the sealing layer into contact with each other.

Abstract: A thermionic generator for converting thermal energy to electric energy includes: an emitter electrode for emitting thermal electrons from a thermal electron emitting surface when heat is applied to the emitter electrode; a collector electrode facing the emitter electrode spaced apart from the emitter electrode by a predetermined distance, and receiving the thermal electrons from the emitter electrode via a facing surface of the collector electrode; and a substrate having one surface. The emitter electrode and the collector electrode are disposed on the one surface of the substrate, and are electrically insulated from each other. The thermal electron emitting surface and the facing surface are perpendicular to the one surface.