Abstract: The objective of the invention is to provide technology allowing data taking a plurality of values to be transmitted and received using one set of coils when sending data through TCI technology using magnetic field coupling. This layered semiconductor device has at least a first semiconductor chip and a second semiconductor chip layered therein, the first semiconductor chip transmitting data in a contactless manner, and the second semiconductor chip receiving, in a contactless manner, the data that has been transmitted. The first semiconductor chip contains: a transmission unit outputting a transmission signal that may acquire, on the basis of the value of the data to be sent, at least 3 types of states representing the value of the data; and a transmission coil converting the transmission signal into a magnetic field signal.

Abstract: The objective of the invention is to provide technology allowing data taking a plurality of values to be transmitted and received using one set of coils when sending data through TCI technology using magnetic field coupling. This layered semiconductor device has at least a first semiconductor chip and a second semiconductor chip layered therein, the first semiconductor chip transmitting data in a contactless manner, and the second semiconductor chip receiving, in a contactless manner, the data that has been transmitted. The first semiconductor chip contains: a transmission unit outputting a transmission signal that may acquire, on the basis of the value of the data to be sent, at least 3 types of states representing the value of the data; and a transmission coil converting the transmission signal into a magnetic field signal.

Abstract: A control interface system for a driver of a vehicle comprises a touchscreen, a control module, and a display. The touchscreen is located proximate to the driver of the vehicle and upon driver interaction therewith is operable to generate a sensor signal. The control module is adapted to receive the sensor signal from the touchscreen and is operable to initiate control of a vehicle function and to generate a haptic feedback signal in response thereto. The touchscreen is adapted to receive the haptic feedback signal from the control module and is operable to provide haptic feedback to the driver of the vehicle in response thereto. The display is embedded in an instrument panel of the vehicle and provides an indicia of the vehicle function controlled by the touchscreen and of driver interaction therewith.

Abstract: A control interface system for a driver of a vehicle comprises a touchscreen, a control module, and a display. The touchscreen is located proximate to the driver of the vehicle and upon driver interaction therewith is operable to generate a sensor signal. The control module is adapted to receive the sensor signal from the touchscreen and is operable to initiate control of a vehicle function and to generate a haptic feedback signal in response thereto. The touchscreen is adapted to receive the haptic feedback signal from the control module and is operable to provide haptic feedback to the driver of the vehicle in response thereto. The display is embedded in an instrument panel of the vehicle and provides an indicia of the vehicle function controlled by the touchscreen and of driver interaction therewith.

Abstract: In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.

Abstract: In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.

Abstract: In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.

Abstract: In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.

Abstract: In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.