Abstract: A ceramic electronic component includes a ceramic body including an internal electrode therein and at least two external electrodes provided on an outer surface of the ceramic body. The external electrode includes an underlying electrode layer provided on the outer surface of the ceramic body, a first Ni plated layer provided on an outer side of the underlying electrode layer, and a second Ni plated layer provided on an outer side of the first Ni plated layer. Ni oxide is present between the first Ni plated layer and the second Ni plated layer.

Abstract: A ceramic electronic component includes a ceramic body including an internal electrode therein and at least two external electrodes provided on an outer surface of the ceramic body. The external electrode includes an underlying electrode layer provided on the outer surface of the ceramic body, a first Ni plated layer provided on an outer side of the underlying electrode layer, and a second Ni plated layer provided on an outer side of the first Ni plated layer. Ni oxide is present between the first Ni plated layer and the second Ni plated layer.

Abstract: A mixture of electronic component chips 2 and media 3 is placed in a planar state on a transport surface 4 of a conveyor 5. Only the media 3 are collected onto a first circulating circumferential surface 18 by a magnetic force provided by a first collection member 12 and are thereafter collected by a media collecting box 22. Then, only electronic component chips 2 having a plating film of a proper thickness formed thereon are attracted onto a second circumferential surface 28 by a magnetic force provided by a second collection member 23 and are thereafter collected by a good product collecting box 31. Electronic component chips 2a having a plating film of an insufficient thickness formed thereon are collected by a defective product collecting box 32.