Patents by Inventor Yuji Ozaki

Yuji Ozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10121606
    Abstract: An electrode for an energy storage device including a Zn layer or Zn alloy layer, a Ni layer, and a Sn layer or Sn alloy layer formed by plating on a connecting terminal part of a positive electrode composed of Al so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop. Accordingly, this electrode can be soldered to a Cu negative electrode, which is composed of metal that is different species from Al, through a Sn layer or a Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced. The contacting area is increased in comparison with the conventional jointing by spot-welding or conventional fastening by a bolt so that the resistance value at the contacting point is reduced.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: November 6, 2018
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Katsuji Nakamura, Kaichi Tsuruta, Yuji Ozaki, Shigeaki Watarai, Hidenori Takagi, Yutaka Ohori
  • Publication number: 20160254103
    Abstract: An electrode for an energy storage device including a Zn layer or Zn alloy layer, a Ni layer, and a Sn layer or Sn alloy layer formed by plating on a connecting terminal part of a positive electrode composed of Al so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop. Accordingly, this electrode can be soldered to a Cu negative electrode, which is composed of metal that is different species from Al, through a Sn layer or a Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced. The contacting area is increased in comparison with the conventional jointing by spot-welding or conventional fastening by a bolt so that the resistance value at the contacting point is reduced.
    Type: Application
    Filed: May 10, 2016
    Publication date: September 1, 2016
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Katsuji Nakamura, Kaichi Tsuruta, Yuji Ozaki, Shigeaki Watarai, Hidenori Takagi, Yutaka Ohori
  • Patent number: 9368249
    Abstract: Zn layer 21 or Zn alloy layer, Ni layer 22, and Sn layer 23 or Sn alloy layer are formed on a connecting terminal part 10a of a positive electrode composed of Al by plating. Accordingly, this can solder Cu negative electrode, which is composed of metal that is different species from Al, through Sn layer 23 or Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced. Further, since the contacting area is increased in comparison with the conventional jointing by the spot-welding or the conventional fastening by a bolt so that the resistance value at the contacting point is reduced, the voltage drop of the energy storage device by contact resistance can be reduced.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: June 14, 2016
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Katsuji Nakamura, Kaichi Tsuruta, Yuji Ozaki, Shigeaki Watarai, Hidenori Takagi, Yutaka Ohori
  • Publication number: 20130133924
    Abstract: To increase a ground contact area in comparison with the conventional jointing by the spot-welding or the conventional fastening by a bolt so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop of the voltage. Zn layer 21 or Zn alloy layer, Ni layer 22, and Sn layer 23 or Sn alloy layer are formed on a connecting terminal part 10a of a positive electrode composed of Al by plating. Accordingly, this can solder Cu negative electrode, which is composed of metal that is different species from Al, through Sn layer 23 or Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced.
    Type: Application
    Filed: June 14, 2011
    Publication date: May 30, 2013
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Katsuji Nakamura, Kaichi Tsuruta, Yuji Ozaki, Shigeaki Watarai, Hidenori Takagi, Yutaka Ohori
  • Patent number: 5799261
    Abstract: An anti-skid control system for an automotive vehicle, comprises a plurality of actuators each associated with one of front-left, front-right, rear-left and rear-right road wheels, for adjusting braking forces applied to the road wheels independently of each other, sensors for detecting wheel speeds of the road wheels to generate wheel-speed indicative signals, and a controller for controlling the actuators in response to the wheel-speed indicative signals. The controller selects a lower value of the wheel-speed indicative signal values of a controlled rear wheel, subjected to a braking-force control, and its diagonal front wheel located on the vehicle diagonally to the controlled rear wheel, and controls the actuator associated with the controlled rear wheel in accordance with the lower value, during braking-force control for the controlled rear wheel.
    Type: Grant
    Filed: January 11, 1996
    Date of Patent: August 25, 1998
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Yuji Ozaki, Kenji Ogino