Abstract: A photosensitive resin composition which comprises (A) an alkali-soluble resin, (B) a photopolymerization initiator and (C) an acrylate monomer and may further comprise (D) a methacrylate monomer, wherein the acrylate monomer (C) comprises (C1) an acrylate monomer having a double bond equivalent of not less than 250 and (C2) azo acrylate monomer having a double bond equivalent of not more than 150, the content of the methacrylate monomer (D) is 0 to 5 mass %, the content of the acrylate monomer having a double bond equivalent of not less than 250 (C1) is 40 to 60 mass %, and the content of the acrylate monomer having a double bond equivalent of not more than 150 (C2) is 40 to 60 mass % based on the acrylate monomer (C), and the content of the photopolymerization initiator (B) is 0.5 to 1.5 mass % based on the photosensitive resin composition, and an etching method and plating method using the above photosensitive resin composition.

Abstract: The present invention is a photosensitive resin composition to be used in an etching process in which an etching treatment is conducted with an etching solution containing hydrofluoric acid or ammonium fluoride. The photosensitive resin composition comprises at least (A) an acid-modified epoxy acrylate, (B) a photopolymerization initiator, (C) a blocked isocyanate compound, and (D) a filler. The etching process involves forming a photosensitive resin layer comprising said photosensitive resin composition, on at least one surface of a substrate; exposing and then developing the photosensitive resin layer; baking the photosensitive layer; and conducting an etching treatment with an etching solution containing hydrofluoric acid or ammonium fluoride.

Abstract: A photosensitive resin composition which comprises (A) an alkali-soluble resin, (B) a photopolymerization initiator and (C) an acrylate monomer and may further comprise (D) a methacrylate monomer, wherein the acrylate monomer (C) comprises (C1) an acrylate monomer having a double bond equivalent of not less than 250 and (C2) azo acrylate monomer having a double bond equivalent of not more than 150, the content of the methacrylate monomer (D) is 0 to 5 mass %, the content of the acrylate monomer having a double bond equivalent of not less than 250 (C1) is 40 to 60 mass %, and the content of the acrylate monomer having a double bond equivalent of not more than 150 (C2) is 40 to 60 mass % based on the acrylate monomer (C), and the content of the photopolymerization initiator (B) is 0.5 to 1.5 mass % based on the photosensitive resin composition, and an etching method and plating method using the above photosensitive resin composition.

Abstract: The present invention is a photosensitive resin composition to be used in an etching process in which an etching treatment is conducted with an etching solution containing hydrofluoric acid or ammonium fluoride. The photosensitive resin composition comprises at least (A) an acid-modified epoxy acrylate, (B) a photopolymerization initiator, (C) a blocked isocyanate compound, and (D) a filler. The etching process involves forming a photosensitive resin layer comprising said photosensitive resin composition, on at least one surface of a substrate; exposing and then developing the photosensitive resin layer; baking the photosensitive layer; and conducting an etching treatment with an etching solution containing hydrofluoric acid or ammonium fluoride.

Abstract: A method for forming a conductor pattern comprising the steps of (a) forming a photo-crosslinkable resin layer on a substrate provided with a conductive layer on its surface, (b) treating the photo-crosslinkable resin layer with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, the steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass % of an inorganic alkaline compound, or method for forming a conductor pattern comprising the steps of (a?) forming a photo-crosslinkable resin layer on a substrate provide with a conductive layer on its surface and inside a hole thereof, (i) curing the photo-crosslinkable resin layer on the hole alone or on the hole and a surrounding area thereof, (b?) treating the photo-crosslinkable resin layer in an uncured portion with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etc

Abstract: There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a resist pattern, comprising the steps of forming a resin layer and a mask layer on a first surface of a substrate having a through-hole(s), and removing the resin layer on the through-hole(s) and on a periphery of the through-hole(s) on the first surface by supplying a resin layer removing solution from a second surface opposite to the first surface of the substrate, and a method for producing a circuit board using the method for forming a resist pattern, and a circuit board.

Abstract: Etching is carried out with an etchant that reacts with a metal to be etched to form an insoluble compound. After the etching using the above etchant, etching is carried out using an etchant that does not form an insoluble compound through a reaction with the metal to be etched, whereby the form of an etched portion comes close to a rectangular form, and the side surface of a conductor pattern becomes smooth. Further, after the etching of one surface of a material to be etched is carried out using an etchant that reacts with a metal to be etched to form an insoluble compound nearly from below, the upper and lower sides of the material to be etched is reversed, and the etching of the opposite surface is carried out nearly from below, whereby fine conductor patterns can be formed on both of the surfaces.

Abstract: An etchant for copper or copper alloy, which contains water as a main component and comprises (1) 1 to 20 mass % of iron (III) chloride and (2) 5 to 100 mass %, based on the iron chloride, of oxalic acid, and an etching method using the above etchant are provided, and the etching method includes pretreatment to be carried out with an aqueous solution containing at least one component selected from a component that dissolves copper or copper alloy and an acid, whereby well yields can be materialized.

Abstract: A method for forming a conductor pattern comprising the steps of (a) forming a photo-crosslinkable resin layer on a substrate provided with a conductive layer on its surface, (b) treating the photo-crosslinkable resin layer with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, the steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass % of an inorganic alkaline compound, or method for forming a conductor pattern comprising the steps of (a?) forming a photo-crosslinkable resin layer on a substrate provide with a conductive layer on its surface and inside a hole thereof, (i) curing the photo-crosslinkable resin layer on the hole alone or on the hole and a surrounding area thereof, (b?) treating the photo-crosslinkable resin layer in an uncured portion with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etc

Abstract: There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a resist pattern, comprising the steps of forming a resin layer and a mask layer on a first surface of a substrate having a through-hole(s), and removing the resin layer on the through-hole(s) and on a periphery of the through-hole(s) on the first surface by supplying a resin layer removing solution from a second surface opposite to the first surface of the substrate, and a method for producing a circuit board using the method for forming a resist pattern, and a circuit board.

Abstract: The method for making a screen printing mask, provided by this invention is a method for making a resin-formed screen printing mask having a resin layer on one main surface of a screen printing mask having openings, a resin layer having openings nearly in the same locations as those of said openings of the screen printing mask, and comprises the step of coating the one main surface of said screen printing mask with the resin layer by laminating, and the step of removing those parts of said resin layer which are positioned nearly in the same locations as those of the openings of said screen printing mask by self-alignment, to form the openings through the resin layer.

Abstract: It is an object of the present invention to provide a powder coating composition, which can exhibit a sufficient hiding power, a corrosion resistance and an excellent appearance and can reduce a coating process and is particularly suitable for coating of an aluminum wheel because of its high low temperature curability and has excellent storage stability, and a coating method of an aluminum wheel using the same. A powder coating composition consisting of a powder coating composition particle, wherein said powder coating composition particle comprises at least a thermosetting resin powder formed by binding a metallic pigment with a binder and said thermosetting resin powder comprises a ?-hydroxyalkylamide curing agent expressed by the following general formula (1): wherein R1 represents a hydrogen atom, a methyl group or an ethyl group, R2 represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms or HOCH(R1)CH2—, and A represents a bivalent hydrocarbon group.

Abstract: A powder coating comprising a thermosetting resinous composition comprising a base resin having 2 or more oxirane groups in its molecule and a hardener for epoxy resin, which is characterized by further containing 0.5 to 10% by weight based on the base resin weight of a vinyl resin containing 1 to 10% by weight of at least one aliphatic dicarboxylic acid selected from thiomalic acid, maleic acid, fumaric acid and itaconic acid and having a number average molecular weight of 1000 to 8000 and a glass transition temperature of -40.degree. to 100.degree. C. The coating obtained is excellent in smoothness, gloss and image clarity.

Abstract: The object of the present invention is to provide a powder coating excellent in storage stability and in coat surface smoothness.The present invention relates to a powder coating comprising a binder resin and a curing agent, characterized in that said curing agent has particle size characteristics such that the average particle size is 0.3 to 7 .mu.m and particles having a particle size not smaller than 20 .mu.m account for not less than 10% by weight of all curing agent particles.

Abstract: Cathodic electrodeposition paints are rendered hardly susceptible to oil droplet-induced craters by incorporating an amine-modified acrylic copolymer of t-butyl (meth)acrylate with a hydroxyl group-containing monomer and an oxirane ring-containing monomer in the form of an aqueous emulsion. The amine-modified acrylic copolymer may be an adduct with a half blocked organic diisocyanate. The paint gives a cured film substantially free from oil droplet-induced craters and having a good adhesion to an overcoating and a good surface smoothness.

Abstract: A resinous composition for powder coating, comprising (A) an acrylic resin and (B) a hardener, the acrylic resin being composed of (a) t-butyl methacrylate and/or t-butyl acrylate, (b) an ethylenically unsaturated monomer having a reactive functional group and (c) other ethylenically unsaturated monomer(s) than the said (a) and (b) which is (are) non-reactive with the functional group of (b), the reactive functional group content being 0.0010-0.0046 mol/g of resin, the glass transition temperature being 30-110.degree. C. and the number average molecular weight being 1,000-20,000, and the hardener having in its molecule 2 or more functional groups which are reactive with the reactive functional group possessed by the acrylic resin.The powder coating based on the present resinous composition is useful for the coating of construction material, auto-mobile and the like and is excellent in low temperature curing properties, storage stability and can result an excellent film even when used a stored powder.

Abstract: A powder coating comprising, as main components. (A) a carboxyl group containing resin having a number average molecular weight of 1000-30000, an acid value of 5-200 KOH mg/g and a glass transition temp. of 20.degree.-120.degree. C., and (B) a polyglycidyl compound obtained by addition of a polyester oligomer having 2 or more carboxyl groups and a number average molecular weight of 200-1200, with an epoxy compound of the formula: ##STR1## , the ratio of carboxyl groups in (A) to glycidyl groups in (B) being, in terms of equivalent ratio, 0.5 to 2.0. This powder coating may result a coating with excellent processability, impact strength and the like and is excellent in storage stability, hardening properties either at high or low temperature and even when used a stored powder may result a coating with excellent processability.

Abstract: A powder coating which is specifically useful for the containing of electric appliance, office appliance and the like and is excellent, inter alia, stain resistance of the formed coating is provided, the powder coating comprising (a) a base resin having a reactive functional group, (b) a hardener having in its molecule 2 or more functional groups which are reactive with the functional group of the base resin and (c) an acrylic resin containing 40 100 % by weight of the total of the constituting monomers of t-butyl acrylate and/or t-butyl methacrylate.

Abstract: The invention concerns a coating powder composition comprising (A) a carboxyl group containing polyester resin having a number average molecular weight of 1,000.about.20,000, an acid value of 10.about.100, a glass transition temperature of 35.degree.-120.degree. C. and an SP value of 9.8.about.11.5, and (B) glycidyl trimellitate, wherein the equivalent weight ratio of carboxyl the groups of said (A) to the glycidyl groups of said (B) is 1:2 to 2:1. The coating powder composition is specifically suitable for a high-temperature-short time baking and capable of resulting in a coating having excellent film properties including bending and processability and which coating is highly-crosslinked.

Abstract: The invention concerns powder coatings comprising thermoplastic or thermosetting type resin powder particles, each particle carrying at least on the surface thereof, a number of microparticles having an average diameter of 0.001 to 10.mu. of such resin as having a glass transition temperature of 50.degree. to 150.degree. C. and a SP value of 9 to 15, said microparticle optionally containing UV absorber or antioxidant or hardening catalyst, the weight ratio of said microparticles to the total weight of the powder coatings being 0.05 to 30% by weight. The present powder coatings are excellent in blocking resistance and capable of forming a coating with excellent stain resistance, coating appearance and other desired properties.