Abstract: In order to provide an organic EL panel, and a method for producing same, that makes it possible to have excellent moisture resistance and ensure sealing substrate-side transparency, provided is an organic EL panel comprising an element formation substrate (1) on which an organic EL element (2) is formed, a sealing substrate (3), and a sealing layer interposed with no gaps between the element formation substrate (1) and the sealing substrate (3), wherein: the sealing layer is constituted of an inner hygroscopic agent (4) covering the organic EL element (2), an outer peripheral hygroscopic agent (5) provided along an outer peripheral edge of the inner hygroscopic agent (4), and a marginal adhesive (6) provided along an outer peripheral edge of the outer peripheral hygroscopic agent (5); the inner hygroscopic agent (4) is constituted of an ultraviolet curable or thermosetting gel-like resin and a desiccant added at a weight ratio of 0.

Abstract: In order to provide an organic EL panel, and a method for producing same, that makes it possible to have excellent moisture resistance and ensure sealing substrate-side transparency, provided is an organic EL panel comprising an element formation substrate (1) on which an organic EL element (2) is formed, a sealing substrate (3), and a sealing layer interposed with no gaps between the element formation substrate (1) and the sealing substrate (3), wherein: the sealing layer is constituted of an inner hygroscopic agent (4) covering the organic EL element (2), an outer peripheral hygroscopic agent (5) provided along an outer peripheral edge of the inner hygroscopic agent (4), and a marginal adhesive (6) provided along an outer peripheral edge of the outer peripheral hygroscopic agent (5); the inner hygroscopic agent (4) is constituted of an ultraviolet curable or thermosetting gel-like resin and a desiccant added at a weight ratio of 0.

Abstract: In a vacuum vapor deposition method which is carried out at a vacuum vapor deposition apparatus including a plurality of linear-shaped vaporization sources, an equal-thickness surface is calculated with respect to each of a polarity of release holes. The equal-thickness surface indicates a surface where a deposition amount of vapor of a vaporization material released from the corresponding release hole is the same per unit time. Then, the vaporization containers are placed in such a manner that contact points of the equal-thickness surfaces all coincide with each other on a deposition surface of a substrate, each of the contact points being where the corresponding equal-thickness surface comes in contact with the surface of the substrate.

Abstract: A vacuum vapor deposition apparatus includes a vaporization container which has a plurality of equally-diametered release holes arranged linearly and in which the release holes are arranged densely on both end portion sides of the vaporization container. The vaporization container includes therein a current plate having a plurality of equally-diametered passage holes through which vapor of a vaporization material passes. The passage holes are arranged densely on both end portion sides in such a manner that, as conductance per unit length in the arrangement direction of the release holes, conductance by the passage holes is proportional to conductance by the release holes.

Abstract: A method for producing an organic EL panel includes an application step of applying a filler, a desiccant, a sealant and a fixing agent to positions on a encapsulation substrate opposing the position of an element, a positioning step of positioning an element substrate and the encapsulation substrate, a heating step of heating the encapsulation substrate, a defoaming step of removing gases incorporated within the filler and the like, a sticking substrates step of sticking the element substrate and the encapsulation substrate using a pair of surface plates, a gas introduction step of returning the periphery around the pressure welded element substrate and encapsulation substrate to an atmospheric pressure environment, a provisional fixing step of irradiating ultraviolet rays onto the fixing agent, and a seal curing step of irradiating ultraviolet rays onto the sealant, thereby curing the sealant.

Abstract: In a vacuum vapor deposition apparatus including a plurality of linear-shaped vaporization sources, equal-thickness surfaces are calculated for vaporization containers, respectively. Each of the equal-thickness surfaces indicates where a deposition amount of vapor of a vaporization material released from release holes in the corresponding vaporization container is the same per unit time. Then, the vaporization containers are placed in such a manner that contact points of the respective equal-thickness surfaces all coincide with each other on a deposition surface of a substrate, each of the contact points being where the corresponding equal-thickness surfaces come in contact with the surface of the substrate.

Abstract: A method for producing an organic EL panel includes an application step of applying a filler, a desiccant, a sealant and a fixing agent to positions on a encapsulation substrate opposing the position of an element, a positioning step of positioning an element substrate and the encapsulation substrate, a heating step of heating the encapsulation substrate, a defoaming step of removing gases incorporated within the filler and the like, a sticking substrates step of sticking the element substrate and the encapsulation substrate using a pair of surface plates, a gas introduction step of returning the periphery around the pressure welded element substrate and encapsulation substrate to an atmospheric pressure environment, a provisional fixing step of irradiating ultraviolet rays onto the fixing agent, and a seal curing step of irradiating ultraviolet rays onto the sealant, thereby curing the sealant.

Abstract: There is provided a method of vacuum evaporation comprising causing evaporated material (5) from vacuum evaporation source (20) furnished with container (1) with its one side open accommodating organic material (2) to form a film on opposed substrate (7), wherein the vacuum evaporation source has heating element (3) not fixed to the container, and being in contact with the surface of organic material held in the container, and wherein the organic material is evaporated by heating of the heating element only, the evaporated material released through at least one hole (6) or at least one slit made in the heating element.

Abstract: Provided is a vacuum vapor deposition apparatus in which a crucible as a container for vaporizing a vapor deposition material is placed inside a vacuum chamber and a film is formed on a substrate by use of the vapor deposition material vaporized in the crucible. The apparatus includes measuring means for measuring a bulk of the vapor deposition material in the crucible from an outside of the vacuum chamber.

Abstract: In a vacuum vapor deposition apparatus including a plurality of linear-shaped vaporization sources, equal-thickness surfaces are calculated for vaporization containers, respectively. Each of the equal-thickness surfaces indicates where a deposition amount of vapor of a vaporization material released from release holes in the corresponding vaporization container is the same per unit time. Then, the vaporization containers are placed in such a manner that contact points of the respective equal-thickness surfaces all coincide with each other on a deposition surface of a substrate, each of the contact points being where the corresponding equal-thickness surfaces come in contact with the surface of the substrate.

Abstract: A vacuum vapor deposition apparatus includes a vaporization container which has a plurality of equally-diametered release holes arranged linearly and in which the release holes are arranged densely on both end portion sides of the vaporization container. The vaporization container includes therein a current plate having a plurality of equally-diametered passage holes through which vapor of a vaporization material passes. The passage holes are arranged densely on both end portion sides in such a manner that, as conductance per unit length in the arrangement direction of the release holes, conductance by the passage holes is proportional to conductance by the release holes.

Abstract: There is provided a method of vacuum evaporation comprising causing evaporated material (5) from vacuum evaporation source (20) furnished with container (1) with its one side open accommodating organic material (2) to form a film on opposed substrate (7), wherein the vacuum evaporation source has heating element (3) not fixed to the container, sealing the opening of the container and being in contact with the surface of organic material held in the container, and wherein the organic material is evaporated by heating of the heating element only, the evaporated material released through at least one hole (6) or at least one slit made in the heating element.

Abstract: A magnetically recorded data reproduction apparatus that reproduces magnetically recorded data using a magnetoresistive head and method thereof. The recorded data are reproduced by a magnetoresistive head and supplied to a reproduction amplifier. A signal from an AGC amplifier is supplied to an A/D converter and a digital PLL circuit. A digitized signal is then supplied to, for example, a Viterbi decoder 13 and the decoded signal is obtained at an output terminal 14. Thus, the effect of noise due to the so-called thermal asperity (TA noise) is removed, thereby preventing increases in the error rate of the reproduction signals due to the effect of TA noise and the occurrence of problems in equipment.

Abstract: There are provided a magnetic reproducing apparatus and a magnetic reproducing method, which are suitable for use in reproducing a magnetic tape by using, for example, a magnetoresistive element.

Abstract: The present invention relates to a magnetically recorded data reproduction apparatus which reproduces magnetically recorded data using a magnetoresistive head and method thereof. In this invention the recorded data are reproduced by a magnetoresistive head 2 and supplied to a reproduction amplifier 4. The signal from the reproduction amplifier 4 is then supplied to a high-pass filter 5 and a frequency component of, for example, 1 MHz or lower, is cut off. The signal from the HPF 5 is supplied to an integrating equalizer 6, a phase equalizer 7 and an analog cosine equalizer 8. The signal from the equalizer 8 is supplied to an AGC amplifier 10 through a low-frequency component correction circuit 9. The signal from the AGC amplifier 10 is supplied to an A/D converter 11. Further, the signal from the AGC amplifier 10 is supplied to the digital PLL circuit 12 and the extracted clock signal is supplied to the A/D converter 11.