Patents by Inventor Yujiao FANG

Yujiao FANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240158480
    Abstract: Disclosed in the present invention is an anti-Nipah virus monoclonal antibody having neutralization activity. The antibody consists of a monkey-derived variable region and a human constant region, and both light and heavy chains of the monkey-derived variable region have unique CDR regions. The antibody provided by the present invention has an excellent antigen binding capability, and has good binding activity with Bangladesh Nipah virus and Malaysia Nipah virus glycoprotein G. The antibody can effectively neutralize the Nipahpseudovirus. Moreover, the neutralization activity of the antibody is enhanced as the concentration of the antibody increases, and nearly 100% neutralization of the Nipahpseudovirus can be achieved at a concentration of 1 ?g/mL. Also disclosed in the present invention is an application of the monoclonal antibody against the Nipah virus glycoprotein G in preparation of a Nipah virus treatment drug.
    Type: Application
    Filed: June 26, 2021
    Publication date: May 16, 2024
    Applicant: ACADEMY OF MILITARY MEDICAL SCIENCE, PLA
    Inventors: Wei Chen, Changming Yu, Yujiao Liu, Pengfei Fan, Guanying Zhang, Yaohui Li, Jianmin Li, Xiangyang Chi, Meng Hao, Ting Fang, Yunzhu Dong, Xiaohong Song, Yi Chen, Shuling Liu
  • Publication number: 20230178581
    Abstract: The present application relates to a BSI image sensor and a method of forming same. The method of forming a BSI image sensor including providing a pixel substrate having a front side and an opposing backside; depositing a titanium nitride layer over the backside of the pixel substrate using a PVD process; depositing a tungsten film on a surface of the titanium nitride layer using a CVD process; and etching the tungsten film and the titanium nitride layer to form a tungsten grid on the backside of the pixel substrate. The method of present application enables to grow a tungsten film having a good uniformity, a superior flatness and an reduced risk of tungsten loss.
    Type: Application
    Filed: December 30, 2021
    Publication date: June 8, 2023
    Inventors: Zhenya LI, Peng WANG, Yujiao FANG, Lu ZHOU