Abstract: A transistor and method of fabrication thereof includes a screening layer formed at least in part in the semiconductor substrate beneath a channel layer and a gate stack, the gate stack including spacer structures on either side of the gate stack. The transistor includes a shallow lightly doped drain region in the channel layer and a deeply lightly doped drain region at the depth relative to the bottom of the screening layer for reducing junction leakage current. A compensation layer may also be included to prevent loss of back gate control.

Abstract: A semiconductor transistor structure fabricated on a silicon substrate effective to set a threshold voltage, control short channel effects, and control against excessive junction leakage may include a transistor gate having a source and drain structure. A highly doped screening region lies is embedded a vertical distance down from the surface of the substrate. The highly doped screening region is separated from the surface of the substrate by way of a substantially undoped channel layer which may be epitaxially formed. The source/drain structure may include a source/drain extension region which may be raised above the surface of the substrate. The screening region is preferably positioned to be located at or just below the interface between the source/drain region and source/drain extension portion. The transistor gate may be formed below a surface level of the silicon substrate and either above or below the heavily doped portion of the source/drain structure.

Abstract: A transistor and method of fabrication thereof includes a screening layer formed at least in part in the semiconductor substrate beneath a channel layer and a gate stack, the gate stack including spacer structures on either side of the gate stack. The transistor includes a shallow lightly doped drain region in the channel layer and a deeply lightly doped drain region at the depth relative to the bottom of the screening layer for reducing junction leakage current. A compensation layer may also be included to prevent loss of back gate control.

Abstract: A transistor and method of fabrication thereof includes a screening layer formed at least in part in the semiconductor substrate beneath a channel layer and a gate stack, the gate stack including spacer structures on either side of the gate stack. The transistor includes a shallow lightly doped drain region in the channel layer and a deeply lightly doped drain region at the depth relative to the bottom of the screening layer for reducing junction leakage current. A compensation layer may also be included to prevent loss of back gate control.

Abstract: Transactional reader-writer locks may leverage available hardware transactional memory (HTM) to simplify the procedures of the reader-writer lock algorithm and to eliminate a requirement for type stable memory An HTM-based reader-writer lock may include an ordered list of client-provided nodes, each of which represents a thread that holds (or desires to acquire) the lock, and a tail pointer. The locking and unlocking procedures invoked by readers and writers may access the tail pointer or particular ones of the nodes in the list using various combinations of transactions and non-transactional accesses to insert nodes into the list or to remove nodes from the list. A reader or writer that owns a node at the head of the list (or a reader whose node is preceded in the list only by other readers' nodes) may access a critical section of code or shared resource.

Abstract: A semiconductor transistor structure fabricated on a silicon substrate effective to set a threshold voltage, control short channel effects, and control against excessive junction leakage may include a transistor gate having a source and drain structure. A highly doped screening region lies is embedded a vertical distance down from the surface of the substrate. The highly doped screening region is separated from the surface of the substrate by way of a substantially undoped channel layer which may be epitaxially formed. The source/drain structure may include a source/drain extension region which may be raised above the surface of the substrate. The screening region is preferably positioned to be located at or just below the interface between the source/drain region and source/drain extension portion. The transistor gate may be formed below a surface level of the silicon substrate and either above or below the heavily doped portion of the source/drain structure.

Abstract: Junction field effect transistors (JFET) formed in substrates containing germanium. JFETs having polycrystalline semiconductor surface contacts with self-aligned silicide formed thereon and self-aligned source, drain and gate regions formed by thermal drive-in of impurities from surface contacts into the substrate, and implanted link regions. Others have a polycrystalline semiconductor gate surface contact and metal back gate, source and drain contacts and a metal surface contact to the gate surface contact with implanted source and drains and a self-aligned gate region. JFETs having a polycrystalline semiconductor gate surface contact and metal back gate, source and drain contacts and a metal surface contact to the gate surface contact with implanted source and drains and a self-aligned gate region and silicide formed on the top of the source, drain and back gate contacts and on top of the gate polycrystalline semiconductor gate contact to which the metal surface contacts make electrical contact.