Patents by Inventor Yuju Endo

Yuju Endo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130122345
    Abstract: An electrode lead connection body includes a first member that includes a same material as the positive electrode lead and is configured to be connected the positive electrode lead, a second member that includes a same material as the negative electrode lead and is configured to be connected the negative electrode lead, the first and second members being joined to each other at a portion excluding a positive electrode joint as a portion to be joined to the positive electrode lead and a negative electrode joint as a portion to be joined to the negative electrode lead, and an insulating material at a position between the first and second members and near a joint portion to join the first and second members so as to prevent a contact between the first and second members.
    Type: Application
    Filed: September 12, 2012
    Publication date: May 16, 2013
    Applicant: Hitachi Cable, Ltd.
    Inventors: Takumi SATO, Yuju Endo, Kenichi Murakami, Hiroaki Komatsu
  • Publication number: 20120145433
    Abstract: A resin composition includes a polyolefin resin. A viscosity of the resin composition is within a range of not less than 500 Pa·s and not more than 2300 Pa·s under measurement conditions of a measurement temperature of 170° C. and a measurement frequency of 1 Hz. A strain hardening rate of the resin composition in uniaxial elongational viscosity measured under measurement conditions of a measurement temperature of 150° C. and a strain rate of 3.0 s?1 is not less than 800%. A foam insulated wire includes a conductor, and a foam insulation of the resin composition extruded on an outer periphery of thereof. A diameter of the conductor is 3.5 to 18 mm, and an outer diameter of the foam insulation is not less than 8 mm.
    Type: Application
    Filed: December 7, 2011
    Publication date: June 14, 2012
    Applicant: HITACHI CABLE, LTD.
    Inventors: Hideyuki SUZUKI, Yuju ENDO, Sohei KODAMA, Masahiro ABE, Akinari NAKAYAMA
  • Patent number: 8143525
    Abstract: A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto.
    Type: Grant
    Filed: December 16, 2008
    Date of Patent: March 27, 2012
    Assignees: Hitachi Cable, Ltd., Hitachi Cable Fine-Tech, Ltd.
    Inventors: Hajime Nishi, Yuju Endo, Hiroyuki Akutsu, Hiroshi Bando, Iku Higashidani, Katsunori Sawahata, Yukio Ito, Hiroshi Okikawa
  • Publication number: 20110220196
    Abstract: Disclosed is a lead wire for a solar cell having excellent bondability with a solar cell. The solar cell lead wire (10) has a band plate-shaped electroconductive material (12) that is formed with straight-angled cross-sectional shape and is covered by a molten solder plating layer (13), with the thickness of the oxide film on the surface of the molten solder plating layer (13) being 7 nm or less.
    Type: Application
    Filed: November 20, 2009
    Publication date: September 15, 2011
    Inventors: Hajime Nishi, Yuju Endo, Ken Takahashi, Hiromitsu Kuroda, Hiroyuki Akutsu, Katsunori Sawahata, Hiroshi Bando, Iku Higashidani, Hiroshi Okikawa
  • Publication number: 20090260689
    Abstract: A solar cell lead wire includes a conducting material, and a molten solder plated layer formed on the conducting material. The conducting material includes a concave-convex conducting material that includes a concavity on top and under surfaces thereof, respectively, and a convexity on a side surface thereof, and that is formed by die processing a strip-shaped conducting material, and the molten solder plated layer comprises a flat surface formed by supplying a molten solder to the concavity of the concave-convex conducting material.
    Type: Application
    Filed: April 7, 2009
    Publication date: October 22, 2009
    Applicants: Hitachi Cable, Ltd., Hitachi Cable Fine Tech, Ltd.
    Inventors: Hajime Nishi, Yuju Endo, Hiroyuki Akutsu, Hiroshi Okikawa
  • Publication number: 20090255710
    Abstract: A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto.
    Type: Application
    Filed: December 16, 2008
    Publication date: October 15, 2009
    Applicants: Hitachi Cable, Ltd., Hitachi Cable Fine-Tech, Ltd.
    Inventors: Hajime Nishi, Yuju Endo, Hiroyuki Akutsu, Hiroshi Bando, Iku Higashidani, Katsunori Sawahata, Yukio Ito, Hiroshi Okikawa
  • Patent number: 7568959
    Abstract: A metallic material is rolled to provide a conductor 3 having a rectangular cross section. A surface of the rectangular conductor 3 is plated with a plating layer 14. A thickness of the plating layer 14 at a surface facing to the Si cell is not more than 5 ?m to provide a connecting lead wire 12 for a solar battery. The connecting lead wire 12 for a solar battery has 0.2% proof stress of not more than 60 MPa. The connecting lead wire 12 for a solar battery is connected to a predetermined contact region of a Si cell 1 of a solar battery at a high temperature.
    Type: Grant
    Filed: September 12, 2007
    Date of Patent: August 4, 2009
    Assignees: Hitachi Cable, Ltd., Hitachi Cable Fine Tech, Ltd.
    Inventors: Hajime Nishi, Takayuki Tsuji, Yuju Endo, Hiroyuki Akutsu
  • Publication number: 20080283159
    Abstract: A method of fabricating soft copper alloy wire having flexure resistance and heat resistance, includes casting a molten alloy of a copper alloy including 10 mass ppm or less of oxygen, and 0.005 mass % to 0.6 mass % of indium, at a predetermined temperature, to provide a cast bar of the copper alloy having equiaxed crystal, rolling the cast bar of the copper alloy having equiaxed crystal to provide a rolled copper alloy, and conducting a cold drawing and annealing on the rolled copper alloy.
    Type: Application
    Filed: July 16, 2008
    Publication date: November 20, 2008
    Applicant: Hitachi Cable, Ltd.
    Inventors: Seigi Aoyama, Yuju Endo, Hiroyoshi Hiruta
  • Publication number: 20080076307
    Abstract: A metallic material is rolled to provide a conductor 3 having a rectangular cross section. A surface of the rectangular conductor 3 is plated with a plating layer 14. A thickness of the plating layer 14 at a surface facing to the Si cell is not more than 5 ?m to provide a connecting lead wire 12 for a solar battery. The connecting lead wire 12 for a solar battery has 0.2% proof stress of not more than 60 MPa. The connecting lead wire 12 for a solar battery is connected to a predetermined contact region of a Si cell 1 of a solar battery at a high temperature.
    Type: Application
    Filed: September 12, 2007
    Publication date: March 27, 2008
    Applicants: Hitachi Cable, Ltd., Hitachi Cable Fine Tech, Ltd.
    Inventors: Hajime Nishi, Takayuki Tsuji, Yuju Endo, Hiroyuki Akutsu
  • Patent number: 7173188
    Abstract: A straight angle conductor 10 is provided with a cladding material including a core-sheet metal 11 and conductor-sheet metals 12a, 12b that sandwich both surfaces of the core-sheet metal 11. The conductor-sheet metals 12a, 12b having a volume resistivity equal to or less than 5.0 (??·cm) wraps both sides of the core-sheet metal 11 having a thermal expansion coefficient equal to or less than 10 (×10?6/C. °) to prevent the core-sheet metal 11 from being exposed to an outside of the conductor-sheet metals 12a, 12b. As a result, it prevents occurrence of an electrical potential difference in a boundary side face between the core-sheet metal 11 and the conductor-sheet metals 12a, 12b to improve corrosion resistance. Especially even when the straight angle conductor 10 is used on a silicon crystal wafer for a solar cell, damage of the silicon crystal wafer caused by heat occurring in soldering process of the conductor 10 or a change in temperature on use thereof for a solar cell is avoided.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: February 6, 2007
    Assignee: Hitachi Cable, Ltd.
    Inventors: Yuju Endo, Hakaru Matsui, Seigi Aoyama, Takaaki Ichikawa
  • Publication number: 20070017570
    Abstract: A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor 1 having a volume resistivity equal to or less than 50 ??·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test is formed into a rectangular conductor 10 for a solar battery having a rectangular cross section, and a surface of the rectangular conductor 10 for a solar battery is coated with a solder plating film 13, to provide a lead wire 20 for a solar battery.
    Type: Application
    Filed: August 11, 2005
    Publication date: January 25, 2007
    Inventors: Yuju Endo, Takashi Nemoto, Hiromitsu Kuroda, Atsushi Ootake, Syuji Kawasaki, Hiroshi Bando
  • Publication number: 20060292029
    Abstract: A soft copper alloy contains 10 mass ppm or less of oxygen, and more than 0.005 mass % and less than 0.6 mass % of indium. A soft copper alloy wire or plate material is manufactured by processing the soft copper alloy, wherein an average crystal grain size after annealing is 2 to 20 um.
    Type: Application
    Filed: June 23, 2005
    Publication date: December 28, 2006
    Applicant: Hitachi Cable, Ltd.
    Inventors: Seigi Aoyama, Yuju Endo, Hiroyoshi Hiruta
  • Publication number: 20050039943
    Abstract: A straight angle conductor 10 is provided with a cladding material including a core-sheet metal 11 and conductor-sheet metals 12a, 12b that sandwich both surfaces of the core-sheet metal 11. The conductor-sheet metals 12a, 12b having a volume resistivity equal to or less than 5.0 (??·cm) wraps both sides of the core-sheet metal 11 having a thermal expansion coefficient equal to or less than 10 (×106/C°) to prevent the core-sheet metal 11 from being exposed to an outside of the conductor-sheet metals 12a, 12b. As a result, it prevents occurrence of an electrical potential difference in a boundary side face between the core-sheet metal 11 and the conductor-sheet metals 12a, 12b to improve corrosion resistance. Especially even when the straight angle conductor 10 is used on a silicon crystal wafer for a solar cell, damage of the silicon crystal wafer caused by heat occurring in soldering process of the conductor 10 or a change in temperature on use thereof for a solar cell is avoided.
    Type: Application
    Filed: July 15, 2004
    Publication date: February 24, 2005
    Inventors: Yuju Endo, Hakaru Matsui, Seigi Aoyama, Takaaki Ichikawa
  • Patent number: 5635009
    Abstract: A method for punching an insulating film is composed of using plural divided punches having a clearance between each two of the divided punches. The clearance absorbs thermal expansion of the divided punches caused by receiving a heat from a heater. A punched insulating film is stuck to a lead frame by being pressed between the divided punches and the heater.
    Type: Grant
    Filed: May 13, 1994
    Date of Patent: June 3, 1997
    Assignee: Hitachi Cable Ltd.
    Inventors: Toshio Kawamura, Takashi Suzumura, Makoto Aida, Hiroshi Sugimoto, Shigeharu Takahagi, Yuju Endo, Toshi Sasaki, Hiroyuki Takasaka
  • Patent number: RE37323
    Abstract: A method for punching an insulating film is composed of using plural divided punches having a clearance between each two of the divided punches. The clearance absorbs thermal expansion of the divided punches caused by receiving a heat from a heater. A punched insulating film is stuck to a lead frame by being pressed between the divided punches and the heater.
    Type: Grant
    Filed: June 3, 1999
    Date of Patent: August 14, 2001
    Assignee: Hitachi Cable Ltd.
    Inventors: Toshio Kawamura, Takashi Suzumura, Makoto Aida, Hiroshi Sugimoto, Shigeharu Takahagi, Yuju Endo, Toshi Sasaki, Hiroyuki Takasaka