Patents by Inventor Yuki NAKAMATSU

Yuki NAKAMATSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 10312178
    Abstract: In a semiconductor device, a thinly-molded portion covering a whole of a heat dissipating surface portion of a lead frame and a die pad space filled portion are integrally molded from a second mold resin, because of which adhesion between the thinly-molded portion and lead frame improves owing to the die pad space filled portion adhering to a side surface of the lead frame. Also, as the thinly-molded portion is partially thicker owing to the die pad space filled portion, strength of the thinly-molded portion increases, and a deficiency or cracking is unlikely to occur.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: June 4, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takanobu Kajihara, Katsuhiko Omae, Shunsuke Fushie, Muneaki Mukuda, Daisuke Nakashima, Masahiro Motooka, Hiroyuki Miyanishi, Yuki Nakamatsu, Junya Suzuki
  • Semiconductor device
    Patent number: 10262912
    Abstract: In a semiconductor device, a first skirt portion molded from a first mold resin and a second skirt portion molded from a second mold resin are provided on a heat dissipating surface of a lead frame. Also, a thinly-molded portion is molded integrally with the second skirt portion from the second mold resin. According to this kind of configuration, adhesion between the thinly-molded portion and lead frame is high, and the semiconductor device with excellent heat dissipation and insulation is obtained.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: April 16, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takanobu Kajihara, Katsuhiko Omae, Shunsuke Fushie, Muneaki Mukuda, Daisuke Nakashima, Masahiro Motooka, Hiroyuki Miyanishi, Yuki Nakamatsu, Junya Suzuki
  • SEMICONDUCTOR DEVICE
    Publication number: 20180005920
    Abstract: In a semiconductor device, a thinly-molded portion covering a whole of a heat dissipating surface portion of a lead frame and a die pad space filled portion are integrally molded from a second mold resin, because of which adhesion between the thinly-molded portion and lead frame improves owing to the die pad space filled portion adhering to a side surface of the lead frame. Also, as the thinly-molded portion is partially thicker owing to the die pad space filled portion, strength of the thinly-molded portion increases, and a deficiency or cracking is unlikely to occur.
    Type: Application
    Filed: April 15, 2015
    Publication date: January 4, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takanobu KAJIHARA, Katsuhiko OMAE, Shunsuke FUSHIE, Muneaki MUKUDA, Daisuke NAKASHIMA, Masahiro MOTOOKA, Hiroyuki MIYANISHI, Yuki NAKAMATSU, Junya SUZUKI
  • SEMICONDUCTOR DEVICE
    Publication number: 20170330809
    Abstract: In a semiconductor device, a first skirt portion molded from a first mold resin and a second skirt portion molded from a second mold resin are provided on a heat dissipating surface of a lead frame. Also, a thinly-molded portion is molded integrally with the second skirt portion from the second mold resin. According to this kind of configuration, adhesion between the thinly-molded portion and lead frame is high, and the semiconductor device with excellent heat dissipation and insulation is obtained.
    Type: Application
    Filed: April 15, 2015
    Publication date: November 16, 2017
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takanobu KAJIHARA, Katsuhiko OMAE, Shunsuke FUSHIE, Muneaki MUKUDA, Daisuke NAKASHIMA, Masahiro MOTOOKA, Hiroyuki MIYANISHI, Yuki NAKAMATSU, Junya SUZUKI