Abstract: A detection device includes an acquirer that acquires a video of each of a plurality of bearings of a structure including the plurality of bearings, an extractor that extracts a dynamic feature corresponding to a plurality of degrees of freedom of each of the plurality of bearings based on the video, and an identifier that identifies, among the plurality of bearings, a bearing whose dynamic feature fails to match a dynamic feature of one or more other bearings of the plurality of bearings.

Abstract: [Problem] To provide a laminate having a polar resin layer, which is excellent in transparency and mechanical strength (in particular impact resistance), and a polar resin composition for forming the polar resin layer of the laminate having such properties. [Solution] A polar resin composition including 5 to 30% by mass of an ethylenic polymer (A), 40 to 85% by mass of a polar resin component (B), and 10 to 40% by mass of a modified ethylene/?-olefin copolymer (C) obtained by modifying an ethylene/?-olefin copolymer (CO) with an unsaturated carboxylic acid or a derivative thereof and having a melt flow rate (190° C., 2.16 kg load) of 0.1 to 50 g/10 minutes, provided that the sum of proportions of the (A), (B), and (C) is 100% by mass.

Abstract: An image recording apparatus includes a feed tray, a feed mechanism feeding a sheet-shaped medium accommodated in the feed tray, and a recording device recording an image on the sheet-shaped medium fed by the feed mechanism. The feed tray includes a first accommodation portion accommodating a roll, in which the sheet-shaped medium is rolled, a pair of side walls interposing the sheet-shaped medium unrolled from the roll in a first direction parallel to an axis of the roll, and a side guide disposed inside the pair of side walls and having an inner-side surface contactable with an edge in the first direction of the first sheet-shaped medium unrolled from the roll. The side guide has a metal portion made of metal, the metal portion forming at least part of the inner-side surface.

Abstract: A conversion parameter calculation method includes: obtaining, from an image capturing device, image data obtained by the image capturing device capturing an image of an object having attached thereto a marker with which specific coordinates are detectable; obtaining displacement direction information indicating a direction of a displacement of the object, the direction crossing an image capturing surface of the image capturing device; detecting specific coordinates, based on the marker included in the image data; estimating a position of the image capturing device, based on a result of the detection; calculating distance data indicating a distance from the image capturing device to the object, based on the position of the image capturing device; and calculating, using the distance data and the displacement direction information, a conversion parameter for converting a pixel displacement amount of the object into an actual displacement amount.

Abstract: A prediction device for predicting the growth direction of a crack that occurs in a subject includes: an obtainer that obtains video of the subject; a derivation unit that derives displacement of each of a plurality of regions in the obtained video; a selector that selects, from among the plurality of regions, two or more regions each having displacement similar to displacement of a reference region included in the plurality of regions; and an identification unit that identifies, as the growth direction, the longitudinal direction of a collective region made up of the two or more selected regions.

Abstract: A solid-state imaging element according to the present disclosure is provided with a first substrate (light reception chip) and a second substrate (detection chip). The first substrate (light reception chip) is provided with a photodiode that photoelectrically converts incident light to generate a photocurrent. The second substrate (detection chip) is provided with a luminance change detection circuit (current-voltage conversion circuit) that detects a change in luminance of the incident light on the basis of a voltage signal converted by a conversion circuit (current-voltage conversion circuit) that converts the photocurrent into the voltage signal, and is bonded to the first substrate (light reception chip). A light shielding unit (light shielding film) provided in at least any one of the first substrate (light reception chip) or the second substrate (detection chip) and shields light between an active element (transistor TR) provided in the second substrate (detection chip) and the photodiode is included.

Abstract: Please replace the currently pending Abstract with the following amended A solid-state imaging device is provided with a plurality of photoelectric conversion elements, a plurality of current-voltage conversion circuits, a plurality of address event detection circuits, first ground wiring, and second ground wiring. The plurality of photoelectric conversion elements is arranged side by side in a first region. The plurality of current-voltage conversion circuits converts currents output from the plurality of photoelectric conversion elements into voltages, respectively. The plurality of address event detection circuits detects changes in voltages output from the plurality of current-voltage conversion circuits, respectively. The first ground wiring is provided in a second region located outside the first region, and supplies first ground potential to the plurality of photoelectric conversion elements.

Abstract: A solid-state image sensor according to the present disclosure includes a photodiode, a conversion circuit (current-voltage conversion circuit), a luminance change detection circuit (comparator), and a light-shielding unit (light-shielding film). The photodiode photoelectrically converts incident light to generate a photocurrent. The conversion circuit (current-voltage conversion circuit) converts the photocurrent into a voltage signal. The luminance change detection circuit (comparator) detects a change in luminance of the incident light on the basis of the voltage signal. The light-shielding unit (light-shielding film) shields incidence of light on the impurity diffusion region included in a circuit that inputs the voltage signal to the luminance change detection circuit (comparator).

Abstract: A solid-state imaging device according to the present disclosure includes a light-receiving substrate, a circuit board, and a plurality of first connections. The light-receiving substrate includes a plurality of light-receiving circuits provided with photoelectric conversion elements. The circuit board is directly bonded to the light-receiving substrate and includes a plurality of address event detection circuits that detects individual changes in voltages output from the photoelectric conversion elements of the plurality of light-receiving circuits. The plurality of first connections is provided at a joint between the light-receiving substrate and the circuit board to electrically connect the light-receiving circuits and the address event detection circuits corresponding to each other.

Abstract: A solid-state imaging element according to the present disclosure includes a plurality of first photoelectric conversion elements, a plurality of second photoelectric conversion elements, a plurality of current-voltage conversion circuits, and a plurality of address event detection circuits. The plurality of first photoelectric conversion elements are arranged side by side in a first region. The second photoelectric conversion elements are arranged side by side in a second region adjacent to the first region. The current-voltage conversion circuits each convert currents output from the first photoelectric conversion elements or the second photoelectric conversion elements into voltages. The address event detection circuits each detect a change in the voltages output from the current-voltage conversion circuits.

Abstract: A wiring sheet includes one or more carbon wires each of which is one of a signal line and a power supply line, and which are conductors including carbon as a main material and have flexibility; and an insulation sheet that encloses substantially an entirety of the one or more carbon wires, includes an electrical insulator as a main material, and has flexibility.

Abstract: An electrostatic atomizing apparatus includes a main body portion, a container, a first air flow path, a second air flow path, an electrostatic atomization unit, and an air flow generation unit. The container is detachable from the main body portion, is capable of storing a liquid, and includes a first ventilation hole and a second ventilation hole. The first air flow path includes a first end that includes an air suction port, and a second end that connects to the first ventilation hole. The second air flow path includes a third end that connects to the second ventilation hole, and a fourth end that includes an air exhaust port. The electrostatic atomization unit is disposed on the second air flow path. The air flow generation unit generates an air flow that causes air to flow through the first air flow path, through the container, and through the second air flow path.

Abstract: A wiring sheet includes one or more carbon wires each of which is one of a signal line and a power supply line, and which are conductors including carbon as a main material and have flexibility; and an insulation sheet that encloses substantially an entirety of the one or more carbon wires, includes an electrical insulator as a main material, and has flexibility.

Abstract: A top sheet includes a skin contact surface configured to contact the skin of a wearer. The skin contact surface includes at least one projection and at least one recess. The top sheet further includes a back surface opposite the skin contact surface. The top sheet further includes a coating on the at least one projection. The coating essentially includes a blood slipping agent having a kinematic viscosity of 0.01 to 80 mm2/s at 40° C., a water holding percentage of 0.01 to 4.0 mass %, and a weight-average molecular weight of less than 1,000, and the coating is configured to slip from the skin contact surface, through the top sheet, to the back surface along with menstrual blood.

Abstract: A method of manufacturing a semiconductor device includes stacking a first substrate comprising a first surface having a semiconductor element and an opposing second surface and a second substrate comprising a third surface having a semiconductor element and an opposing fourth surface, forming a first contact hole extending from the second surface to the first surface of the first substrate and forming a first groove inwardly of a first region of the second surface of the first substrate by etching inwardly of the first substrate from the second surface thereof, forming a first patterned mask on the first substrate, so that the first groove is covered by the material of the first patterned mask, forming a first metal electrode in the first contact hole through an opening in the first mask as a mask, and removing the first mask and subsequently cutting through the first substrate in the first groove.

Abstract: An electrostatic atomizing system includes an air flow path having an air intake port and an air exhaust port, a humidifying device, an electrostatic atomizing apparatus, a first sensor, and a control unit. The humidifying device humidifies the air taken in through the air intake port. The electrostatic atomizing apparatus includes an electrode section operable to produce charged particulate water by causing the water in the air humidified by the humidifying device to condense on an electrode and applying voltage to that electrode. Moreover, the electrostatic atomizing apparatus exhausts air that contains the charged particulate water through the air exhaust port. The first sensor senses at least one of humidity and temperature of the air humidified by the humidifying device. The control unit determines, based on a sensing result of the first sensor, if there is a fault in the humidifying device or the electrostatic atomizing apparatus, and outputs the result of the determination.

Abstract: An electrostatic atomizing apparatus includes a main body portion, a container, a first air flow path, a second air flow path, an electrostatic atomization unit, and an air flow generation unit. The container is detachable from the main body portion, is capable of storing a liquid, and includes a first ventilation hole and a second ventilation hole. The first air flow path includes a first end that includes an air suction port, and a second end that connects to the first ventilation hole. The second air flow path includes a third end that connects to the second ventilation hole, and a fourth end that includes an air exhaust port. The electrostatic atomization unit is disposed on the second air flow path. The air flow generation unit generates an air flow that causes air to flow through the first air flow path, through the container, and through the second air flow path.

Abstract: An absorbent article includes a liquid-permeable top sheet, a liquid-impermeable back sheet, and an absorbent body between the liquid-permeable top sheet and liquid-impermeable back sheet. The liquid-permeable top sheet includes a blood modifying agent with an IOB of 0.00-0.60, a melting point of no higher than 45° C., a water solubility of 0.00-0.05 g in 100 g of water at 25° C., and a weight-average molecular weight of no greater than 1,000.

Abstract: A semiconductor device according to an embodiment includes a semiconductor substrate including a first face having semiconductor elements, and a second face on an opposite side to the first face. A first insulating film is located on the first face of the semiconductor substrate. A conductor is located on the first insulating film. A metal electrode is located between the first face and the second face and passes through the semiconductor substrate to be in contact with the conductor. A second insulating film is located between the metal electrode and the semiconductor substrate. A boundary face between the first insulating film and the second insulating film is located on a side of the conductor relative to the first face of the semiconductor substrate and is inclined to approach the conductor toward a center portion of the metal electrode.

Abstract: An object of the present disclosure is to provide an absorbent body that is both soft and resistant to twisting. The absorbent body of the present disclosure is as follows. An absorbent body for an absorbent article includes thermoplastic resin fibers and cellulose-based water-absorbing fibers, at least some of the thermoplastic resin fibers have a first section 6? exposed on a surface of the liquid-permeable layer side of the absorbent body, a second section 6? exposed on a surface of the liquid-impermeable layer side of the absorbent body and a joint section 6?? connecting the first section 6? and second section 6?, and the tensile strength in a thickness direction of the absorbent body is 100 Pa or greater.