Abstract: A test circuit is connected to a memory core integrated unit of SRAM. When the memory core integrated unit is to be tested, a test start signal is set to a high level so that one of a bit line and an inverted bit line is used for data write and the test circuit sets data to this selected bit line. The other bit line is used for data read, and the written data is set to this bit line in the normal operation. Whether each memory core is not defective is judged by EOR which confirms data set to the bit line and data set to the inverted bit line are mutually inverted each other. A test method is realized which can test a defect of each memory core of a semiconductor memory such as SRAM in a short time.

Abstract: A test circuit is connected to a memory core integrated unit of SRAM. When the memory core integrated unit is to be tested, a test start signal is set to a high level so that one of a bit line and an inverted bit line is used for data write and the test circuit sets data to this selected bit line. The other bit line is used for data read, and the written data is set to this bit line in the normal operation. Whether each memory core is not defective is judged by EOR which confirms data set to the bit line and data set to the inverted bit line are mutually inverted each other. A test method is realized which can test a defect of each memory core of a semiconductor memory such as SRAM in a short time.

Abstract: A test circuit is connected to a memory core integrated unit of SRAM. When the memory core integrated unit is to be tested, a test start signal is set to a high level so that one of a bit line and an inverted bit line is used for data write and the test circuit sets data to this selected bit line. The other bit line is used for data read, and the written data is set to this bit line in the normal operation. Whether each memory core is not defective is judged by EOR which confirms data set to the bit line and data set to the inverted bit line are mutually inverted each other. A test method is realized which can test a defect of each memory core of a semiconductor memory such as SRAM in a short time.

Abstract: A semiconductor integrated circuit device has: a semiconductor substrate defining a plurality of rows, each row including areas for a sequence of cells; a plurality of active regions disposed in each of the rows constituting semiconductor elements of associated cells; and a wiring region of stripe shape elongated along a direction of row, defined on the semiconductor substrate outside of the active regions in each row, and including wirings belonging to the associated cells, each wiring region having height in a direction crossing the row direction, the wiring region having locally different height.

Abstract: A test circuit is connected to a memory core integrated unit of SRAM. When the memory core integrated unit is to be tested, a test start signal is set to a high level so that one of a bit line and an inverted bit line is used for data write and the test circuit sets data to this selected bit line. The other bit line is used for data read, and the written data is set to this bit line in the normal operation. Whether each memory core is not defective is judged by EOR which confirms data set to the bit line and data set to the inverted bit line are mutually inverted each other. A test method is realized which can test a defect of each memory core of a semiconductor memory such as SRAM in a short time.

Abstract: A semiconductor integrated circuit device has: a semiconductor substrate defining a plurality of rows, each row including areas for a sequence of cells; a plurality of active regions disposed in each of the rows constituting semiconductor elements of associated cells; and a wiring region of stripe shape elongated along a direction of row, defined on the semiconductor substrate outside of the active regions in each row, and including wirings belonging to the associated cells, each wiring region having height in a direction crossing the row direction, the wiring region having locally different height.

Abstract: A semiconductor integrated circuit device has: a semiconductor substrate defining a plurality of rows, each row including areas for a sequence of cells; a plurality of active regions disposed in each of the rows constituting semiconductor elements of associated cells; and a wiring region of stripe shape elongated along a direction of row, defined on the semiconductor substrate outside of the active regions in each row, and including wirings belonging to the associated cells, each wiring region having height in a direction crossing the row direction, the wiring region having locally different height.

Abstract: A semiconductor integrated circuit device has: a semiconductor substrate defining a plurality of rows, each row including areas for a sequence of cells; a plurality of active regions disposed in each of the rows constituting semiconductor elements of associated cells; and a wiring region of stripe shape elongated along a direction of row, defined on the semiconductor substrate outside of the active regions in each row, and including wirings belonging to the associated cells, each wiring region having height in a direction crossing the row direction, the wiring region having locally different height.

Abstract: A semiconductor device comprising a semiconductor chip substrate, an integrated circuit formed on a surface of the semiconductor chip substrate, and metal electrodes extending from the integrated circuit to at least one of the side surfaces of the semiconductor chip substrate. Occupation area on a wiring circuit board can be reduced. Damaged chips can be exchanged easily. When it is set vertically, heat radiation efficiency can be improved.