Abstract: According to one embodiment, a cooling device includes a cooling fan, a heat sink, an inserting portion, a projection, and a holder. The inserting portion is provided on one of the cooling fan and the heat sink. The projection is provided on the inserting portion, and protrudes in a direction intersecting an inserting direction of the inserting portion. The holder is provided on the other one of the cooling fan and the heat sink, and configured to receive the inserting portion. The holder includes (i) an opening portion configured to engage with the projection, (ii) a first supporter facing the inserting portion in a first direction intersecting the inserting direction of the inserting portion and a protruding direction of the projection, and (iii) a second supporter facing the inserting portion in a second direction different from the first direction.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a first heating element in the housing, a heat sink in the housing, a first pressing member, a first heat pipe, and a second heat pipe. The first heat pipe has a plate shape, includes a first portion facing the first heating element and a second portion being outside the first heating element. The first heat pipe is configured to be bent by the first pressing member. The second heat pipe is connected to the second portion of the first heat pipe and the heat sink.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a heat dissipating member disposed inside the housing, a first heat generating element mounted on the circuit board, a second heat generating element mounted on the circuit board, a first heat pipe, and a second heat pipe. The first heat pipe includes a first heat receiving portion thermally connected to the first heat generating element, and a first heat releasing portion thermally connected to the heat dissipating member. The second heat pipe includes a second heat receiving portion thermally connected to the second heat generating element, a second heat releasing portion thermally connected to the heat dissipating member, and a fluid capturing structure configured to temporarily hold a working fluid enclosed inside the second heat pipe.

Abstract: According to one embodiment, an electronic apparatus includes a housing provided with air intake holes, a circuit board contained in the housing, with a heat producing component mounted on the circuit board, a heat sink contained in the housing, and a fan which sends cooling air to the heat sink in the housing, and includes a fan casing and an impeller contained in the fan casing. The fan casing includes a first suction port and a second suction port which face each other with the impeller inserted therebetween, and an exhaust port which faces the heat sink. The first suction port communicates with the air intake holes of the housing. The second suction port comprises an open area which faces the heat producing component in the housing, and another open area which is open to inside of the housing at a position deviated from the circuit board.

Abstract: According to one embodiment, a cooling device includes a heat diffusion plate, a heat receiving portion, a heat sink and a heat pipe. The heat receiving portion is provided on the heat diffusion plate and thermally connected to an object to be cooled. The heat sink is provided on the heat diffusion plate, and it releases the heat of the heat receiving portion to outside. The heat pipe has a first end portion to be connected to the heat receiving portion and a second end portion located on an opposite side to the first end portion and to be connected to the heat sink.

Abstract: An electronic device is provided with an enclosure having a side wall in which vent holes are formed, a heat generator stored in the enclosure, a radiator disposed adjacent to the vent holes, a heat receiver thermally connected to the heat generator, a heat transmission member having one end thermally connected to the heat receiver and the other end thermally connected to the radiator, a fan disposed adjacent to the radiator to generate cooling air toward the radiator, and a seal member that seals a gap formed between the radiator and the side wall having the vent holes formed therein.

Abstract: According to one embodiment, a fan case of a cooling fan includes first and second exhaust openings separately provided in two side surface portions. The first exhaust opening and the second exhaust opening are arranged in a rotational direction of a fan blade in the order named. A first heating element has a heating value greater than that of a second heating element. A first heat radiating member is thermally connected to the first heating element through a first heat transfer member and opposed to the first exhaust opening of the cooling fan. A second heat radiating member is thermally connected to the second heating element through a second heat transfer member and opposed to the second exhaust opening of the fan.

Abstract: A heat-receiving plate of a pump has a heat-receiving surface and a guide. The heat-receiving surface is thermally connected to a heat-generating body. The guide is provided on the heat-receiving surface. The guide is opposed to the heat-generating body.

Abstract: The cooling unit includes a heat receiving portion, a heat radiating portion and a circulation path. The heat radiating portion has an impeller, a heat-radiating member and a case. The heat-radiating member surround the impeller that applies cooling air. The heat-radiating member has a coolant passage in which liquid coolant flows, and a plurality of heat-radiating fins which are thermally connected to the coolant passage. The case contains the impeller and the heat-radiating member and has at least one outlet port through which the cooling air is expelled.

Abstract: According to one embodiment, an electronic apparatus is provided with first and second heating elements mounted on a circuit board. The first heat pipe includes a first end portion thermally connected to the first heating element and a second end portion thermally connected to a heat radiating section. The second heat pipe includes a first end portion thermally connected to the second heating element, a second end portion thermally connected to the heat radiating section, and a middle portion opposed to the first heating element. A heat conductive member has flexibility and is provided between the middle portion of the second heat pipe and the first heating element so as to thermally connect the middle portion of the second heat pipe to the first heating element.

Abstract: A heat-receiving plate of a pump has a heat-receiving surface and a guide. The heat-receiving surface is thermally connected to a heat-generating body. The guide is provided on the heat-receiving surface. The guide is opposed to the heat-generating body.

Abstract: According to one embodiment, a cooling device includes a heat diffusion plate, a heat receiving portion, a heat sink and a heat pipe. The heat receiving portion is provided on the heat diffusion plate and thermally connected to an object to be cooled. The heat sink is provided on the heat diffusion plate, and it releases the heat of the heat receiving portion to outside. The heat pipe has a first end portion to be connected to the heat receiving portion and a second end portion located on an opposite side to the first end portion and to be connected to the heat sink.

Abstract: A cooling device comprises a circulation passage through which a liquid coolant flows, and a pump provided in the circulation passage configured to circulate the liquid coolant along the circulation passage. The pump includes, (1) a pump casing including a pump chamber into which the liquid coolant flows, (2) an impeller mounted in the pump chamber to push out the liquid coolant from the pump chamber to the circulation passage, and (3) an injection portion provided in the pump casing configured to inject the liquid coolant to the pump chamber.

Abstract: A heat-receiving plate of a pump has a heat-receiving surface and a guide. The heat-receiving surface is thermally connected to a heat-generating body. The guide is provided on the heat-receiving surface. The guide is opposed to the heat-generating body.

Abstract: In one embodiment of the invention, a pump includes a pump housing, an impeller, and a motor. The pump housing has a pump chamber and a heat receiving plate to couple to a heat generating unit, such as a CPU. The impeller is provided in the pump chamber. The motor couples to the impeller to rotate it. A region of the heat receiving plate projects further outward than other regions to couple the heat receiving plate to the IC chip.

Abstract: An electronic apparatus includes a main unit, display unit and support unit. The main unit has a heat-receiving portion thermally connected to a heat-generating component. The display unit is separated from the main unit. The support unit is coupled to the main unit and display unit. The support unit includes a heat-radiating portion to cool a liquid coolant, and a reserve tank to temporarily store the liquid coolant. The liquid coolant absorbs heat produced by the heat-generating component and transferred by the heat-receiving portion. The liquid coolant is circulated between the heat-receiving portion and the heat-radiating portion.

Abstract: An electronic apparatus includes a main unit, support unit and display unit. The main unit has a heat-receiving portion thermally connected to a heat-generating component. The support unit has first and second edges. The first edge is coupled to the main unit. The second edge is located opposite to the first edge. The display unit is coupled to the second edge of the support unit. The support unit contains a heat-radiating portion. The heat-radiating portion includes a tube to convey the medium heated at the heat-receiving portion, a plurality of heat-radiating fins coupled to the tube, and a fan to supply cooling air to the fins.

Abstract: According to one embodiment of the invention, an electronic apparatus comprises a main unit, a display unit and a support unit. The main unit contains a heat-generating component and a heat-receiving portion. The heat-receiving portion is thermally connected to the heat-generating component. The support unit supports the display unit on the main unit and contains a heat-radiating portion that radiates the heat of the heat-generating component. The heat of the heat-generating component is transmitted to a heat-transferring medium and transferred to the heat-radiating portion through the heat-transferring medium.

Abstract: An electronic device is provided with an enclosure having a side wall in which vent holes are formed, a heat generator stored in the enclosure, a radiator disposed adjacent to the vent holes, a heat receiver thermally connected to the heat generator, a heat transmission member having one end thermally connected to the heat receiver and the other end thermally connected to the radiator, a fan disposed adjacent to the radiator to generate cooling air toward the radiator, and a seal member that seals a gap formed between the radiator and the side wall having the vent holes formed therein.

Abstract: The present invention provides a cooling pump, an electronic apparatus, and a cooling system in which positioning between a heat generating unit and a cooling pump can be achieved easily.