Abstract: An edge exposure unit includes a projector, a projector holding unit, a substrate rotating unit, an outer edge detecting unit and a surface inspection processing unit. Each component of the projector holding unit operates to move the projector in an X direction and a Y direction. The projector irradiates a peripheral portion of a substrate with light transmitted from a light source for exposure through a light guide. Edge sampling processing is performed based on distribution of an amount of light received in a CCD line sensor of the outer edge detecting unit. Surface inspection processing is performed based on distribution of an amount of light received in a CCD line sensor of the surface inspection processing unit.

Abstract: A coating head is constructed of a solvent feed mechanism connected to a forward side in a direction of movement of a coating solution feed mechanism, and a gas jet mechanism connected to a rearward side in the direction of movement. While moving the coating head relative to a substrate, a solvent is supplied onto the substrate from the solvent feed mechanism, then a coating solution is supplied onto a film of the solvent from the coating solution feed mechanism, and finally a gas is jetted to an uneven surface of the coating solution from the gas jet mechanism to smooth a thin film surface of the coating solution.

Abstract: A coating method includes a step of forming a film of a coating solution having a larger thickness in a central region of a substrate than in an edge region of the substrate by discharging droplets of the coating solution from a plurality of nozzles formed on an inkjet head to the substrate, and a step of moving the coating solution in the film from the central region toward the edge region of the substrate by rotating the substrate. This reduces a difference in thickness of the film between the central region and the edge region of the substrate, thereby to make the film thickness substantially uniform. At the same time, the movement of the coating solution in the film can make the surface of the film smoother.

Abstract: In a substrate processing apparatus, a storage device, an indexer block, a processing block and an interface block are arranged to line up in this order. The storage device includes a plurality of openers on which a carrier storing a plurality of substrates can be placed. The carrier is carried in the storage device. In the storage device, the carrier is transported among the plurality of openers by a transport device. The transport device includes first and second hands configured to be able to hold the carrier and move in a horizontal direction and a vertical direction. The second hand is provided below the first hand.

Abstract: An edge exposure unit includes a projector, a projector holding unit, a substrate rotating unit, an outer edge detecting unit and a surface inspection processing unit. Each component of the projector holding unit operates to move the projector in an X direction and a Y direction. The projector irradiates a peripheral portion of a substrate with light transmitted from a light source for exposure through a light guide. Edge sampling processing is performed based on distribution of an amount of light received in a CCD line sensor of the outer edge detecting unit. Surface inspection processing is performed based on distribution of an amount of light received in a CCD line sensor of the surface inspection processing unit.

Abstract: Prior to edge exposure, the type of a photo resist that has been coated on a semiconductor wafer is identified. Then, the sensitivity of this resist is determined based on the information of the identified resist type. Based on the determined resist sensitivity, a laser output from a semiconductor laser light source, and a wafer rotation speed attained by a wafer rotating part are determined, and the edge exposure is then performed in accordance with these determined values. Thus, both of the laser output and the wafer rotation speed can be determined based on the resist sensitivity, and the edge exposure can be advanced in accordance with these values. It is therefore capable of flexibly coping with the sensitivity of the resist used.

Abstract: A substrate processing apparatus comprises a plurality of second coating processing units responsible for coating, a gas supply mechanism for supplying clean air through a supply path, and a cell controller. Each of the second coating processing units is provided with a control plate and an exhaust fun unit. The opening of the supply path is controlled by adjusting the angle of rotation of the control plate. The cell controller adjusts the angle of rotation of each control plate based on a setting previously determined to independently control the amount of air supply to the second coating processing units. Thus the pressures within the second coating processing units are controlled such that the second coating processing units provide substantially the same processing result. As a result, the difference among the plurality of second coating processing units can be suppressed.

Abstract: A substrate treating apparatus disclosed herein realizes improved throughput. The substrate treating apparatus according to this invention includes an antireflection film forming block, a resist film forming block and a developing block arranged in juxtaposition. Each block includes chemical treating modules, heat-treating modules and a single main transport mechanism. The main transport mechanism transports substrates within each block. Transfer of the substrates between adjacent blocks is carried out through substrate rests. The main transport mechanism of each block is not affected by movement of the main transport mechanisms of the adjoining blocks. Consequently, the substrates may be transported efficiently to improve the throughput of the substrate treating apparatus.

Abstract: A substrate treating apparatus includes a heat-treating unit having a cooling unit and a local transport mechanism. The local transport mechanism, in time of standby, is placed in a standby position inside the cooling unit. The local transport mechanism in the standby position influences, and is influenced by, the environment outside the heat-treating unit less than where the local transport mechanism is kept on standby outside the heat-treating unit. Variations in substrate treating precision due to such adverse influences are reduced to perform substrate treatment with high precision.

Abstract: A manifold communicatively connects a plurality of coating processing units with an air conditioning unit. The manifold is formed by branching a common pipe into a plurality of distributing pipes. The air conditioning unit performs temperature control to set air passing through a branch point of the manifold to a temperature slightly lower than a target temperature in processing units. Secondary heaters secondarily heat air passing through joints between the distributing pipes and the processing units to the target temperature thereby supplying accurately temperature-controlled air to processing parts. Air from the air conditioning unit is diverted thereby suppressing the height of the overall apparatus. Thus, a substrate processing apparatus capable of inhibiting the height of the overall apparatus from remarkable increase also when vertically stacking processing parts in multiple stages and supplying temperature-controlled air to the processing parts with sufficient accuracy.

Abstract: A manifold communicatively connects a plurality of coating processing units with an air conditioning unit. The manifold is formed by branching a common pipe into a plurality of distributing pipes. The air conditioning unit performs temperature control to set air passing through a branch point of the manifold to a temperature slightly lower than a target temperature in processing units. Secondary heaters secondarily heat air passing through joints between the distributing pipes and the processing units to the target temperature thereby supplying accurately temperature-controlled air to processing parts. Air from the air conditioning unit is diverted thereby suppressing the height of the overall apparatus. Thus, a substrate processing apparatus capable of inhibiting the height of the overall apparatus from remarkable increase also when vertically stacking processing parts in multiple stages and supplying temperature-controlled air to the processing parts with sufficient accuracy.

Abstract: A substrate treating apparatus disclosed herein realizes improved throughput. The substrate treating apparatus according to this invention includes an antireflection film forming block, a resist film forming block and a developing block arranged in juxtaposition. Each block includes chemical treating modules, heat-treating modules and a single main transport mechanism. The main transport mechanism transports substrates within each block. Transfer of the substrates between adjacent blocks is carried out through substrate rests. The main transport mechanism of each block is not affected by movement of the main transport mechanisms of the adjoining blocks. Consequently, the substrates may be transported efficiently to improve the throughput of the substrate treating apparatus.

Abstract: A substrate treating apparatus includes a heat-treating unit having a cooling unit and a local transport mechanism. The local transport mechanism, in time of standby, is placed in a standby position inside the cooling unit. The local transport mechanism in the standby position influences, and is influenced by, the environment outside the heat-treating unit less than where the local transport mechanism is kept on standby outside the heat-treating unit. Variations in substrate treating precision due to such adverse influences are reduced to perform substrate treatment with high precision.

Abstract: A substrate processing apparatus includes a coating section, a developing section, a heat-treating section and a transport mechanism. The coating section has first processing units each for performing a coverage process to supply a photoresist solution to a substrate and cover a surface of the substrate with the photoresist solution, a second processing unit for spinning the substrate, after the coverage process, at high speed to make the photoresist solution into a film, dry the photoresist film, and clean the substrate. All substrates are processed with the same coating conditions to suppress differences in quality among the substrates. The first and second processing units perform the respective processes concurrently to improve the throughput of substrate processing.

Abstract: A substrate processing apparatus includes a coating section, a developing section, a heat-treating section and a transport mechanism. The coating section has first processing units each for performing a coverage process to supply a photoresist solution to a substrate and cover a surface of the substrate with the photoresist solution, a second processing unit for spinning the substrate, after the coverage process, at high speed to make the photoresist solution into a film, dry the photoresist film, and clean the substrate. All substrates are processed with the same coating conditions to suppress differences in quality among the substrates. The first and second processing units perform the respective processes concurrently to improve the throughput of substrate processing.

Abstract: A holder (10) is movably inserted in a through hole (22A) of a base portion (22) of a scanning head which is movable along a central axis (27) of a cylindrical inner surface drum, through a ball guide (13). Projections (25, 10B) of the base portion (22) and the holder (10) are coupled with each other by a ball screw (15). Further, a lens holder (2) is inserted/supported in a through hole (10E), and an imaging lens (1) is fixedly provided in the lens holder (2). A pulse motor (24) which is coupled to the ball screw (15) is rotated by the number of pulses as applied. As the result, the holder (10) and the lens holder (2) are moved toward the central axis (27), followed by movement of an imaging position of the lens (1).

Abstract: A light beam scanning system for scanning an object with a light beam emitted from a light source to record or read images includes a lattice plate disposed in a position equivalent to a scanning plane of the light beam and extending in a primary scanning direction. The lattice plate includes a plurality of light transmitting sections each having a width substantially corresponding to a diameter of the light beam in an in-focus position. Photodiodes or the like are provided to detect quantity of the light beam having passed through the light transmitting sections of the lattice plate. Since the detected quantity of the light beam is correlated with focus displacement of the light beam, amounts of focus displacement of the light beam at different points in the primary scanning direction are determined from the detected quantity of the light beam.

Abstract: Color separation image signals (Y, M, C, K) are converted into halftone dot image signals (Y.sub.d, M.sub.d, C.sub.d, K.sub.d) by a halftone block circuit (29). Red, green, blue and white beams are obtained from red, green and blue light sources (31R, 31G, 31B) or from a single white light source. These beams are modulated by acousto-optical modulators (32R, 32G, 32B, 35) responsive to the halftone dot image signals (Y.sub.d, M.sub.d, C.sub.d, K.sub.d) and thereafter converged onto a color photosensitive material (23), to produce a halftone dot color image on the color photosensitive material (23).