Patents by Inventor Yukihiko Oashi

Yukihiko Oashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090289100
    Abstract: A method is disclosed for performing rework soldering for removing an electronic component from a printed circuit board and re-soldering the electronic component to the printed circuit board. The method includes the steps of positioning a dual structure body including a heating member and a cooling member between a rework target and a non-rework target placed on the printed circuit board, the heating member and the cooling member being arranged facing each other with a slight space provided therebetween, the heating member being situated toward the rework target, the cooling member being situated toward the non-rework target; heating the heating member; and cooling the cooling member.
    Type: Application
    Filed: January 27, 2009
    Publication date: November 26, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Tetsuji Ishikawa, Yukihiko Oashi, Shizuo Ishijima
  • Patent number: D354048
    Type: Grant
    Filed: April 12, 1993
    Date of Patent: January 3, 1995
    Assignee: Fujitsu Limited
    Inventors: Koji Kimura, Yoshihiro Ueda, Takeshi Ichimaru, Yukihiko Oashi