Abstract: An apparatus including a canister and an accessory component associated with the canister. The canister may be filled with an adsorption material for adsorbing fuel vapor generated within a fuel tank. A communicating pipe extends downwardly from a housing of the accessory component for communication with the canister. An engaging protrusion is provided on an outer peripheral surface of the housing. An outer peripheral portion of an upper portion of the canister includes a wall portion for engagement with the engaging protrusion.

Abstract: An apparatus including a canister and an accessory component associated with the canister. The canister may be filled with an adsorption material for adsorbing fuel vapor generated within a fuel tank. A communicating pipe extends downwardly from a housing of the accessory component for communication with the canister. An engaging protrusion is provided on an outer peripheral surface of the housing. An outer peripheral portion of an upper portion of the canister includes a wall portion for engagement with the engaging protrusion.

Abstract: A canister includes a canister case having an adsorbent chamber, an adsorbent housed in the adsorbent chamber of the canister case, a filter disposed between the adsorbent chamber and a port mounted on an end wall of the adsorbent chamber, and a tentative filter engaging projection provided in the adsorbent chamber. The filter is loosely fitted within the adsorbent chamber and then welded on the end wall of the adsorbent chamber. The tentative filter engaging projection tentatively holds the filter loosely fitted within the adsorbent chamber in a welding step of the filter.

Abstract: One aspect according to the present disclosure includes a first coupling device and a second coupling device. The first coupling device can mechanically couple the canister and the accessory component to each other. The second coupling device can couple the canister and the accessory component to allow flow communication with each other. The second coupling device is operable in conjunction with the operation of the first coupling device.

Abstract: One aspect according to the present disclosure includes a first coupling device and a second coupling device. The first coupling device can mechanically couple the canister and the accessory component to each other. The second coupling device can couple the canister and the accessory component to allow flow communication with each other. The second coupling device is operable in conjunction with the operation of the first coupling device.

Abstract: A canister includes a canister case having an adsorbent chamber, an adsorbent housed in the adsorbent chamber of the canister case, a filter disposed between the adsorbent chamber and a port mounted on an end wall of the adsorbent chamber, and a tentative filter engaging projection provided in the adsorbent chamber. The filter is loosely fitted within the adsorbent chamber and then welded on the end wall of the adsorbent chamber. The tentative filter engaging projection tentatively holds the filter loosely fitted within the adsorbent chamber in a welding step of the filter.

Abstract: A method for producing a heat sink for cooling a semiconductor device including forming plural base members, the base member being each in plate or block-shape, the base member each having paths shaped on one or both sides of surfaces thereof, and the base member each having connecting regions on one or both sides of surfaces thereof, coating a coating layer of Au onto the base members, putting a solder of Sn or Au—Sn alloy onto connecting regions, the connecting region being coated with the coating layer of Au, assembling the base members together such that the base members are bonding to each other at the connecting region and the paths shaped on each of the surfaces of the base members form a communicating flow path for a cooling medium inside the bonded base members, and heating to diffuse Sn from the solder of Sn or Au—Sn alloy into the coating layer of Au, and to make a bond layer of alloy containing at least 91 wt % of Au and at most 9 wt % of Sn, the bond layer being interposed between connecting regi

Abstract: A method for producing a heat sink for cooling a semiconductor device including forming plural base members, the base member being each in plate or block-shape, the base member each having paths shaped on one or both sides of surfaces thereof, and the base member each having connecting regions on one or both sides of surfaces thereof, coating a coating layer of Au onto the base members, putting a solder of Sn or Au—Sn alloy onto connecting regions, the connecting region being coated with the coating layer of Au, assembling the base members together such that the base members are bonding to each other at the connecting region and the paths shaped on each of the surfaces of the base members form a communicating flow path for a cooling medium inside the bonded base members, and heating to diffuse Sn from the solder of Sn or Au—Sn alloy into the coating layer of Au, and to make a bond layer of alloy containing at least 91 wt % of Au and at most 9 wt % of Sn, the bond layer being interposed between connecting regi

Abstract: The present invention provides a liquid-cooling type heat sink which has a high pressure-resistibility and is resistible against the corrosion or erosion-corrosion or electrolytic etching, and a method for its production. The heat sink of the present invention comprises plural base members 21, 31 and 41, the base member being each in plate or block-shape, the base member each having paths 60 shaped on one or both sides of surfaces thereof, and the base members being bonded to each other, wherein a communicating flow path 60a including path 60, through holes 61, 62, and 63, is formed for a cooling medium to flow in and out. The base members are bonded to each other with a solder layer 54 made of Au—Sn alloy or Sn, while a coating layer of Au 53 is formed on each of the inner surfaces of the bonded base members.

Abstract: The present invention provides a liquid-cooling type heat sink which has a high pressure-resistibility and is resistible against the corrosion or erosion-corrosion or electrolytic etching, and a method for its production. The heat sink of the present invention comprises plural base members 21, 31 and 41, the base member being each in plate or block-shape, the base member each having paths 60 shaped on one or both sides of surfaces thereof, and the base members being bonded to each other, wherein a communicating flow path 60a including path 60, through holes 61, 62, and 63, is formed for a cooling medium to flow in and out. The base members are bonded to each other with a solder layer 54 made of Au—Sn alloy or Sn, while a coating layer of Au 53 is formed on each of the inner surfaces of the bonded base members.

Abstract: Disclosed is a method of grinding semiconductor articles comprising the steps of: dicing a semiconductor wafer having bumps formed on one surface into individual chips or pellets; putting the pellets on a printed-wiring board with their flat, bump-less surfaces up; bonding the bumps of the pellets to the electrodes of the printed-wiring board; and grinding the flat, bump-less surfaces of the pellets simultaneously so that they may have a predetermined reduced thickness. The grinding post bonding has the advantageous effect of preventing pellets from being broken or fractured.