Patents by Inventor Yukihiro Kuriki

Yukihiro Kuriki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board
    Patent number: 6875638
    Abstract: A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor element formed on an opposite side surface of the redistribution board with regard to the base board; a base board separating step separates the base board from the redistribution board and exposes the other surface of the redistribution board; a redistribution board mounting step mounts the redistribution board on a package board via electrode pads exposed from the other surface of the redistribution board.
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: April 5, 2005
    Assignee: Fujitsu Limited
    Inventors: Yoshiyuki Yoneda, Masaharu Minamizawa, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi, Masaru Nukiwa, Osamu Yamaguchi, Yasunori Fujimoto, Takumi Ihara, Muneharu Morioka, Yukihiro Kuriki, Masaki Uchida
  • Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board
    Publication number: 20040053444
    Abstract: A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor element formed on an opposite side surface of the redistribution board with regard to the base board; a base board separating step separates the base board from the redistribution board and exposes the other surface of the redistribution board; a redistribution board mounting step mounts the redistribution board on a package board via electrode pads exposed from the other surface of the redistribution board.
    Type: Application
    Filed: August 29, 2003
    Publication date: March 18, 2004
    Applicant: FUJITSU LIMITED
    Inventors: Yoshiyuki Yoneda, Masaharu Minamizawa, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi, Masaru Nukiwa, Osamu Yamaguchi, Yasunori Fujimoto, Takumi Ihara, Muneharu Morioka, Yukihiro Kuriki, Masaki Uchida
  • Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board
    Publication number: 20030082846
    Abstract: A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor element formed on an opposite side surface of the redistribution board with regard to the base board; a base board separating step separates the base board from the redistribution board and exposes the other surface of the redistribution board; a redistribution board mounting step mounts the redistribution board on a package board via electrode pads exposed from the other surface of the redistribution board.
    Type: Application
    Filed: March 19, 2002
    Publication date: May 1, 2003
    Applicant: Fujitsu Limited
    Inventors: Yoshiyuki Yoneda, Masaharu Minamizawa, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi, Masaru Nukiwa, Osamu Yamaguchi, Yasunori Fujimoto, Takumi Ihara, Muneharu Morioka, Yukihiro Kuriki, Masaki Uchida