Abstract: A method of making a circuit board (10) on which surface electronic components (15) are mounted during the method using a solder reflow process. The board comprises a circuit portion (12), a surrounding circumferential portion (13) and at least one elongated opening (14) formed in the surrounding circumferential portion substantially parallel to the direction that the board travels during the reflow direction (16), thereby preventing electronic component soldering failures that may occur as a result of the deflection of the circuit board during the reflow process.

Abstract: A printed wiring board comprises an insulating layer having a plurality of recesses formed along a predetermined edge portion of the insulating layer to extend through a side surface of the insulating layer, tabs for establishing electrical connection with an external electronic apparatus and which are formed on a surface of the insulating layer along the predetermined edge portion in correspondence with the plurality of recesses, and extensions connected electrically to the respective tabs and extending into the respective recesses. The printed wiring board may further comprise a plurality of dummy pads which are buried under the insulating layer in correspondence with the tabs and the extensions and which are electrically insulated from each other. The extensions are joined to the dummy pads through the recesses. The resulting board comprises a structure in which tabs are not easily peeled from an insulating layer.

Abstract: A printed wiring board comprises an insulating layer having a plurality of recesses formed along a predetermined edge portion of the insulating layer to extend through a side surface of the insulating layer, tabs for establishing electrical connection with an external electronic apparatus and which are formed on a surface of the insulating layer along the predetermined edge portion in correspondence with the plurality of recesses, and extensions connected electrically to the respective tabs and extending into the respective recesses. The printed wiring board may further comprise a plurality of dummy pads which are buried under the insulating layer in correspondence with the tabs and the extensions and which are electrically insulated from each other. The extensions are joined to the dummy pads through the recesses. The resulting board comprises a structure in which tabs are not easily peeled from an insulating layer.

Abstract: A method of making a circuit board (10) on which surface electronic components (15) are mounted during the method using a solder reflow process. The board comprises a circuit portion (12), a surrounding circumferential portion (13) and at least one elongated opening (14) formed in the surrounding circumferential portion substantially parallel to the direction that the board travels during the reflow direction (16), thereby preventing electronic component soldering failures that may occur as a result of the deflection of the circuit board during the reflow process.

Abstract: A circuit board (10) on which surface electronic components (15) are mounted during a reflow process comprises a circuit portion (12), a surrounding circumferential portion (13) and at least one elongated opening (14) formed in the surrounding circumferential portion substantially parallel to the direction the board travels during the reflow direction (16) to prevent electronic component soldering failures that may occur as a result of the deflection of the circuit board flow process.