Patents by Inventor Yukiko Iwama

Yukiko Iwama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6094344
    Abstract: A personal computer including a bottomed case, a keyboard, a top cover forming with said keyboard, an upper face covering said bottomed case, and a heat dissipation structure disposed between the upper face and the bottomed case. The heat dissipation structure includes a printed circuit board having a current consuming device mounted thereon, a first heat dissipation plate disposed under the keyboard, and a first heat conductive block coupled to the first heat dissipation plate and the printed circuit board. The heat conductive block conducts heat generated by the current consuming device to the first heat dissipation plate. The heat dissipation structure further includes a second heat dissipation plate disposed on the bottomed case, and a second heat conductive block coupled to the second heat dissipation plate and the printed board, wherein the second heat conductive block conducts the heat generated by the current consuming device to the second heat dissipation plate.
    Type: Grant
    Filed: November 4, 1999
    Date of Patent: July 25, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Tsuyoshi Nakagawa, Yasushi Neho, Naoyuki Sakamoto, Shigeo Ohashi, Yoshito Ohmura, Yukiko Iwama, Tadakatsu Nakajima, Yoshihiro Kondo, Susumu Iwai, Hitoshi Matsushima
  • Patent number: 6094343
    Abstract: A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case.
    Type: Grant
    Filed: September 2, 1998
    Date of Patent: July 25, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Tsuyoshi Nakagawa, Yasushi Neho, Naoyuki Sakamoto, Shigeo Ohashi, Yoshito Ohmura, Yukiko Iwama, Tadakatsu Nakajima, Yoshihiro Kondo, Susumu Iwai, Hitoshi Matsushima
  • Patent number: 5936679
    Abstract: The present invention makes a variety of improvements on the conventional television receiver to enhance the home communication capability thereof, thereby making the television receiver available as an information terminal apparatus for household use. The novel television receiver that receives a television signal to display a television image on screen comprising: a memory; a microphone through which voice information is entered externally; writing section for writing at least one piece of the voice information entered through the microphone and additional information associated with the at least one piece of voice information into the memory; and a display device for reproducing the at least one piece of voice information stored in the memory and outputting the reproduced voice information through a speaker and displaying the additional information associated with the at least one piece of voice information onto the screen.
    Type: Grant
    Filed: August 20, 1996
    Date of Patent: August 10, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Yasuhiro Kasahara, Tadashi Sube, Tadahiro Yamaguchi, Yukiko Iwama, Masahide Aoki
  • Patent number: 5805417
    Abstract: A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case.
    Type: Grant
    Filed: October 9, 1996
    Date of Patent: September 8, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Tsuyoshi Nakagawa, Yasushi Neho, Naoyuki Sakamoto, Shigeo Ohashi, Yoshito Ohmura, Yukiko Iwama, Tadakatsu Nakajima, Yoshihiro Kondo, Susumu Iwai, Hitoshi Matsushima
  • Patent number: D385534
    Type: Grant
    Filed: April 15, 1996
    Date of Patent: October 28, 1997
    Assignee: Hitachi, Ltd.
    Inventors: Yukiko Iwama, Noriyoshi Ogura, Atsuhiko Urushihara, Taisuke Kashima, Tooru Kiyota, Yasushi Neho, Naoyuki Sakamoto