Abstract: The present invention provides an anti-reflection material and a polarizing film which can exhibit excellent anti-reflection properties and can obtain a visible image without glittering and without reducing an image contrast while exhibiting an excellent wear resistance and chemical resistance, as well as, exhibiting an excellent stain resistance. A surface-roughened layer (12) is provided on one surface or double surfaces of a transparent substrate (11) directly or via another layer, and the surface-roughened layer (12) comprises an ultraviolet-curing resin comprising at least an epoxy compound and a photo-cationic polymerization initiator.

Abstract: The invention provides an antiglare material which exhibits excellent antiglare property by preventing shining of external light in a display and is suitable for display of vivid and high-definition images free of any glare, and a polarizing film using the same. The antiglare material includes a transparent substrate provided with a roughened surface layer on one or both sides thereof. The roughened surface layer is formed from an ultraviolet curing resin containing at least an epoxy compound and a photo-cationic polymerization initiator, and beads of a crosslinked acrylic resin.

Abstract: An adhesive tape for electronic parts, comprising(a) a heat resistant base film, and(b) an adhesive layer laminated on at least one surface of said base film, said adhesive layer comprising(i) a resol type phenol resin, and(ii) an acrylonitrile/butadiene copolymer,in a proportion of from 100 to 500 parts by weight of said resol type phenol resin per 100 parts by weight of said acrylonitrile/butadiene copolymer,said resol type phenol resin being selected from the group consisting of bisphenol A type resins, alkylphenol type resins, phenol type resins and their co-condensed type phenol resins which contain as the phenol component at least one member selected from the group consisting of bisphenol A, alkylphenols and phenol.

Abstract: An antiglare material capable of exhibiting an excellent antiglare effect by preventing imaging reflection of an external light source and suitable for an image display with sharpness and high resolution as well as a polarizing film by utilizing the same. The antiglare material of the invention is a transparent substrate of which at least one of the surfaces is roughened to a predetermined surface roughness. The polarizing film of the invention is a laminate consisting of a first protective layer which is the above defined antiglare material and a second protective layer laminated onto the unroughened surface of the first protective layer with intervention of a polarizing substrate. The roughened surface of the transparent substrate in the above mentioned antiglare material, which may be used in the above described polarizing film, preferably has a haze value in the range from 1 to 25 according to JIS K7105 and the transparent substrate is preferably a transparent film.

Abstract: An adhesive tape for electronic parts, comprising (a) a heat resistant base film, and (b) an adhesive layer laminated on at least one surface of said base film, said adhesive layer comprising(i) a resol type phenol resin, and(ii) an acrylonitrile/butadiene copolymer,in a proportion of from 100 to 500 parts by weight of said resol type phenol resin per 100 parts by weight of said acrylonitrile/butadiene copolymer, said resol type phenol resin being selected from the group consisting of bisphenol A type resins, alkylphenol type resins, phenol type resins and their co-condensed type phenol resins which contain as the phenol component at least one member selected from the group consisting of bisphenol A, alkylphenols and phenol.

Abstract: An adhesive tape for electronic parts, comprising (a) a heat resistant base film, and (b) an adhesive layer laminated on at least one surface of said base film, said adhesive layer comprising(i) a resol type phenol resin, and(ii) an acrylonitrile/butadiene copolymer,in a proportion of from 100 to 500 parts by weight of said resol phenol resin per 100 parts by weight of said acrylonitrile/butadiene copolymer, said resol type phenol resin being selected from the group consisting of bisphenol A type resins, alkylphenol type resins, phenol type resins and their co-condensed type phenol resins which contain as the phenol component at least one member selected from the group consisting of bisphenol A, alkylphenols and phenol.

Abstract: Adhesive tapes which can be adhered and cured at a relatively low temperature, keeps enough electric insulation in case of adhering to the leadframe of semiconductor devices. The adhesive tape comprises a releasing film and an adhesive layer provided on a surface of said releasing film, said adhesive layer being semi-cured into a B-stage and composed of:(a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight and an amino equivalent of 500-10,000, represented by the formula (I): ##STR1## wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.

Abstract: This invention is to provide a liquid adhesive of the present invention can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same.The liquid adhesive of this invention is obtainable by dissolving (a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight, and an amino equivalent of 500-10,000, represented by the following formula (I): ##STR1## wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in the range of 10 to 900 parts by weight.

Abstract: This invention is to provide a liquid adhesive of the present invention can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same.The liquid adhesive of this invention is obtainable by dissolving (a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight, and an amino equivalent of 500-10,000, represented by the following formula (I): ##STR1## wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in the range of 10 to 900 parts by weight.

Abstract: A bisimide compound of the following general formula (I). ##STR1## (wherein each of the R's is an alkyl group having 1 to 4 carbon atoms, a phenyl group or a phenyl group substituted with an alkyl or alkoxy group having 1 to 4 carbon atoms, a plurality of these R's may be the same or different, each of the Z's is ##STR2## a plurality of these Z's may be the same or different, Y is an arylene group or an aryleneoxy group whose terminal oxygen atom bonds to (CH.sub.2).sub.n, n is an integer of 0 to 20, and m is an integer of 1 to 30.), and a process for the production of the above bisimide compound, which comprises reacting a bisamic acid corresponding to this bisimide compound in a cyclodehydration reaction.

Abstract: This invention is to provide a liquid adhesive can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same. The liquid adhesive of this invention is obtainable by dissolving(a) a butadiene-acrylonitrile copolymer having piperazinylethylaminocarbonyl groups at both terminals and having a weight average molecular weight of 1,000-50,000, and an acrylonitrile content of 5-50% by weight, represented by the following formula (I): ##STR1## wherein, m=50-95, and n=5-50; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in the range of 10 to 900 parts by weight. This is applied to one or both surfaces of a heat resistant film or one surface of a release film to form an adhesive layer, thereby obtaining an adhesive tape for electronic parts.

Abstract: This invention is to provide a liquid adhesive of the present invention can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same.The liquid adhesive of this invention is obtainable by dissolving (a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight, and an amino equivalent of 500-10,000, represented by the following formula (I): ##STR1## wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in the range of 10 to 900 parts by weight.

Abstract: A liquid adhesive comprising a dispersion of the following component (b) in a solution of the following component (a) in an organic solvent:(a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer(b) a maleimide compound having at least two maleimide groups.An insulating pattern or insulating layer is formed by applying the liquid adhesive onto an electronic part by a dispensing or screen printing method, followed by thermally curing.

Abstract: The piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer of this invention is a novel substance useful as an adhesive component for adhesive tapes, which tapes are used in the interior of a resin-sealed type semiconductor device. The copolymer has a weight average molecular weight of 10,000-200,000, and is represented by the following general formula (I) and obtained by condensing a carboxyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000 with N-aminoethylpiperazine in the presence of a phosphite and a pyridine derivative to undergo the amidation. ##STR1## wherein k, m, and n indicate molar proportions, where n is taken as 1, k is a number in the range of 3-175, and m is a number in the range of 0.3-93.

Abstract: An adhesive tape for electronic parts, comprising (a) a heat resistant base film, and (b) an adhesive layer laminated on at least one surface of said base film, said adhesive layer comprising(i) a resol type phenol resin, and(ii) an acrylonitrile/butadiene copolymer, in a proportion of from 100 to 500 parts by weight of said resol type phenol resin per 100 parts by weight of said acrylonitrile/butadiene copolymer, said resol type phenol resin being selected from the group consisting of bisphenol A type resins, alkylphenol type resins, phenol type resins and their co-condensed type phenol resins which contain as the phenol component at least one member selected from the group consisting of bisphenol A, alkylphenols and phenol.

Abstract: Adhesive tapes suitable for use in wire-bonded semiconductor devices are disclosed. They are each composed of a heat-resistant substrate formed of at least one layer, a copper foil provided on one side of the substrate, and a semi-cured adhesive layer and a protective film provided successively on the other side of the substrate. Semiconductor devices fabricated using such adhesive tapes are also disclosed.

Abstract: Disclosed is wrapped glass cap article, comprising at least one glass cap and a pair of plastic films having located therein the at least one glass cap, at least one of the pair of plastic films being imparted on its inner surface with a weak adhesiveness so that the glass cap is tightly sealed due to the weak adhesiveness of the plastic film. The article gives rise to glass caps with less contamination when the plastic film is peeled off.

Abstract: An adhesive tape for die bonding is disclosed, comprising a release film having a release layer on at least one side of a support and an adhesive layer attached to said release layer, wherein the exposed surface of said adhesive layer is a mirror-like surface having an average roughness on center line (Ra) of not more than 2.5 .mu.m and a maximal height (Rmax) of not more than 20 .mu.m.

Abstract: An adhesive tape for die bonding is disclosed, comprising a continuous tape wound on a reel, the continuous tape having a structure that an adhesive layer composed mainly of a filler and a binder comprised of an epoxy resin and a polyester resin is laminated on a release film. According to the adhesive tape for die bonding of the invention, bonding of semiconductor elements can be attained with good workability and high reliability by very easily handling of the adhesive tape.