Abstract: An electronic device (1) is provided with a wiring board (2) and a semiconductor chip (5). The wiring board (2) is provided with a first resin layer (3a) and a second resin layer (3b) stacked one over another by having a wiring (4) in between. The semiconductor chip (5) has bumps (6) on one side and is connected with the wiring (4) by entering into the first resin layer (3a) to bring the bumps (6) into contact with the wiring (4). The first resin layer (3a) includes a thermoplastic resin, and the second resin layer (3b) has an elasticity of 1 GPa or higher at a melting point of the first resin layer (3a).

Abstract: A portable information terminal according to the present invention uses a main board and a memory sheet. The main board has a complicated configuration. The memory sheet has silicon chips for memory. The memory sheet comprises a film-shaped circuit board and the silicon chips mounted on the film-shaped circuit board. A contact for the memory sheet is connected to a connecting terminal of the main board. This configuration allows the mounting of a large capacity of memory while keeping the thickness of the portable information terminal in a thin state. As a result, a portability-improved portable information terminal can be obtained in which a large capacity of memory was contained and miniaturization, thickness reduction and weight reduction were achieved.

Abstract: A portable information terminal according to the present invention uses a main board and a memory sheet. The main board has a complicated configuration. The memory sheet has silicon chips for memory. The memory sheet comprises a film-shaped circuit board and the silicon chips mounted on the film-shaped circuit board. A contact for the memory sheet is connected to a connecting terminal of the main board. This configuration allows the mounting of a large capacity of memory while keeping the thickness of the portable information terminal in a thin state. As a result, a portability-improved portable information terminal can be obtained in which a large capacity of memory was contained and miniaturization, thickness reduction and weight reduction were achieved.

Abstract: The electronic device is provide that includes a body having an underside; a plurality of conducting members for transferring electronic signals; and at least two alignment pins mounted perpendicularly on the underside. Each of the alignment pins has a flexible portion that is more easily bendable than the other portions.

Abstract: A mounting structure wherein, in a semiconductor package mounting position on a wiring board, a package bearing substrate whose external size is substantially equal to or larger than that of the semiconductor package and which has on its upper surface pads for connection to a semiconductor package and on its lower surface pads for connection to the wiring board is arranged, the pads on the wiring board and those on the lower surface of the package bearing substrate are connected by soldering, and the soldered junction is filled and fixed with an under-fill.

Abstract: A semiconductor device having an IC (Integrated Circuit) chip packaged on a circuit board, and a cap for hermetically sealing the chip. The cap is bonded to the circuit board at the edges of an open end thereof and bonded to the chip at the underside or bottom thereof. To accurately position the chip on the circuit board, the circuit board is provided with a groove or a shoulder in a position where it faces the edges of the open end of the cap. After the chip has been positioned on the circuit board, the cap is bonded to the circuit board via the groove or the shoulder.

Abstract: A method for forming a package, and corresponding package structure are disclosed. An electronic component is mounted on a substrate via a spacer, and the component is electrically connected to wiring embedded in the substrate. A space is defined in between the component, the spacer, and the substrate by the electrical connecting path. A first silicone material is filled within said defined space, and a second relatively more hardened silicone material is disposed in an area outside of said defined space and covering the electrical connecting path and portions of the upper surface of the substrate. More particularly, some first silicone material may also be disposed outside the defined space, and covered by the second silicone material. The second silicone material is at first in liquid form and of less viscosity than the first silicone material when originally disposed, and is subsequently hardened by either heating or irradiation.