Abstract: A wavelength conversion component includes a plurality of semiconductor multilayer film segments, a first member arranged between adjacent ones of the semiconductor multilayer film segments, and a substrate disposed above the plurality of semiconductor multilayer film segments, the substrate defining a groove.

Abstract: A light emitting device includes: a base body including two conductive members, a resin body, and a fiber member placed inside the resin body, and a light-emitting element. The resin body includes an isolation section located between the two conductive members, and includes a pair of sandwiching portions sandwiching the isolation section. The fiber member has a length which is greater than a distance between the two conductive members, and is located at least in an adjoining region of at least one of the pair of sandwiching portions, the adjoining region adjoining the isolation section. In the adjoining region, the fiber member extends in a direction which is non-orthogonal to a direction in which that the pair of sandwiching portions extend.

Abstract: A wavelength conversion component includes a plurality of semiconductor multilayer film segments, a first member arranged between adjacent ones of the semiconductor multilayer film segments, and a substrate disposed above the plurality of semiconductor multilayer film segments, the substrate defining a groove.

Abstract: A display device includes: a mounting substrate; and a plurality of light-emitting devices arranged on the mounting substrate. The mounting substrate includes: a plurality of thin-film transistor (TFT) elements, and a plurality of conductive pads, each of which is connected to one of the plurality of TFT elements. Each of the plurality of light-emitting devices includes: a semiconductor stacked body, a first metallic section electrically connected to the semiconductor stacked body, and a second metallic section electrically connected to the semiconductor stacked body. The plurality of conductive pads include: a plurality of first conductive pads, each electrically connected to the first metallic section of a respective light-emitting device, and a plurality of second conductive pads, each electrically connected to the second metallic section of the respective light-emitting device. The TFT elements are disposed in regions other than underneath the first metallic sections and the second metallic sections.

Abstract: A wavelength conversion component includes a plurality of wavelength conversion members, a plurality of transmission type optical members respectively disposed on the wavelength conversion members, and a first member including a plurality of wall portions respectively located between adjacent ones of the wavelength conversion members. A light emitting device includes such wavelength conversion component.

Abstract: A light-emitting device includes: a semiconductor stacked body comprising a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked in this order; a first insulating film that covers the active layer and the second conductive semiconductor layer; a first conductive layer that continuously surrounds a lateral surface of the first conductive semiconductor layer that is exposed from the first insulating film; a second insulating film that covers the first conductive layer, the active layer, and the second conductive semiconductor layer and that has a hole disposed above the second conductive semiconductor layer; and a second conductive layer that continuously covers, via the second insulating film, an end portion of the first conductive layer located in proximity to an end portion of the second conductive semiconductor layer, wherein the second conductive layer is connected to an upper surface of the second conductive semiconductor layer through the hole.

Abstract: A light emitting element mounting base member for mounting a light emitting element is provided that includes electrical conductor cores, light-reflecting insulating members, and light blocking resin. The insulating members each cover a lateral surface of each of the electrical conductor cores. The insulating members have a reflectivity of 70% or more to light emission wavelength of the light emitting element in a range of 440 nm to 630 nm. The light blocking resin joins at least two insulating members, and is capable of blocking light from the light emitting element by reflecting or absorbing the light. At least one upper surface of the electrical conductor cores, at least one lower surface of the electrical conductor cores are exposed from the insulating members and the light blocking resin respectively.

Abstract: A wiring board according to one embodiment of the present disclosure includes: partitions each having insulating property; and conductive members that are respectively disposed in at least two adjacent regions among a plurality of regions partitioned by the partitions. Two of the conductive members respectively disposed in the adjacent regions are joined to each other through an opening formed on one of the partitions interposed between the two of the conductive members, to serve as part of a wiring.

Abstract: A method of manufacturing a light emitting element mounting base member includes: providing a first insulating member in a plate shaped having at least one recess portion or at least one through-hole; disposing in the recess portion or in the through-hole a light blocking resin and a plurality of core members each equipped with a second insulating member having light reflectivity on each surface of a plurality of electrical conductor cores; and exposing at least one of the surface of the electrical conductor cores from the second insulating members by removing each part of at least one of the second insulating members.

Abstract: A light emitting device includes a flexible substrate, a light emitting element, a conductive connecting material and a first holding member. The flexible substrate includes a flexible base and a wire. The first holding member is arranged on an opposite side surface to a surface of a side of the substrate on which the light emitting element is mounted. The first holding member surrounds a region corresponding to a region on the substrate including the light emitting element and the conductive connecting material in a plan view. The first holding member is arranged adjacent to the wire. The first holding member includes an inner region arranged on an inner side of the first holding member, and having higher rigidity than rigidity of the flexible base, and an outer region arranged adjacent to the inner region outside the inner region, and having lower rigidity than rigidity of the inner region.

Abstract: A method of producing a transmission grating includes: providing first and second glass plates, each having a first main surface defining a plurality of elongated reverse trapezoidal grooves, each having a reverse trapezoidal shape in a vertical cross-section and being defined by a first wall, a second wall, and a bottom surface, wherein the elongated reverse trapezoidal grooves are formed at an uniform interval, thus defining a plurality of elongated trapezoidal protrusions, each having a first wall, a second wall, and an upper surface; engaging the elongated trapezoidal protrusions of the first glass plate with the elongated reverse trapezoidal grooves of the second glass plate; and fitting the first walls of the protrusions with the first walls of the grooves and closely fitting the upper surfaces of the protrusions with the bottom surfaces of the grooves, and bonding the first glass plate to the second glass plate.

Abstract: A transmission grating includes: first light-transmissive regions having a refractive index of n1; and second light-transmissive regions having a refractive index of n2 that is smaller than n1. Light-reflecting interfaces on which light transmitted through the first light-transmissive regions is incident are in parallel with one another and are inclined such that a line normal to each of light-reflecting interfaces is at an inclination angle ? with respect to the flat light-incident surface and to the flat light-emitting surface, wherein 0°<?<90°. When a thickness of the first light-transmissive regions in a direction perpendicular to the light-reflecting surfaces is t1 and a thickness of the second light-transmissive regions in a direction perpendicular to the light-reflecting surfaces is t2, the thickness t2, in ?m, is in a range of 0.1/?(n12?n22)1/2 to t1.

Abstract: A light emitting device includes: a base body including two conductive members, a resin body, and a fiber member placed inside the resin body, and a light-emitting element. The resin body includes an isolation section located between the two conductive members, and includes a pair of sandwiching portions sandwiching the isolation section. The fiber member has a length which is greater than a distance between the two conductive members, and is located at least in an adjoining region of at least one of the pair of sandwiching portions, the adjoining region adjoining the isolation section. In the adjoining region, the fiber member extends in a direction which is non-orthogonal to a direction in which that the pair of sandwiching portions extend.

Abstract: A light emitting device includes: a base body including two conductive members, a resin body, and a fiber member placed inside the resin body, and a light-emitting element. The resin body includes an isolation section located between the two conductive members, and includes a pair of sandwiching portions sandwiching the isolation section. The fiber member has a length which is greater than a distance between the two conductive members, and is located at least in an adjoining region of at least one of the pair of sandwiching portions, the adjoining region adjoining the isolation section. In the adjoining region, the fiber member extends in a direction which is non-orthogonal to a direction in which that the pair of sandwiching portions extend.

Abstract: A light emitting element mounting base member for mounting a light emitting element is provided that includes electrical conductor cores, light-reflecting insulating members, and light blocking resin. The insulating members each cover a lateral surface of each of the electrical conductor cores. The insulating members have a reflectivity of 70% or more to light emission wavelength of the light emitting element in a range of 440 nm to 630 nm. The light blocking resin joins at least two insulating members, and is capable of blocking light from the light emitting element by reflecting or absorbing the light. At least one upper surface of the electrical conductor cores, at least one lower surface of the electrical conductor cores are exposed from the insulating members and the light blocking resin respectively.

Abstract: A wiring board according to one embodiment of the present disclosure includes: partitions each having insulating property; and conductive members that are respectively disposed in at least two adjacent regions among a plurality of regions partitioned by the partitions. Two of the conductive members respectively disposed in the adjacent regions are joined to each other through an opening formed on one of the partitions interposed between the two of the conductive members, to serve as part of a wiring.

Abstract: A method of manufacturing a wiring board according to one embodiment of the present disclosure includes: providing at least one first conductive member that serves as part of a wiring; covering the at least one first conductive member with an insulating member that has at least one opening; disposing at least one second conductive member on the opening of the insulating member, the second conductive member serving as part of the wiring; electrically joining the at least one first conductive member and the at least one second conductive member to each other at the opening; and cutting a region including the at least one first conductive member, the insulating member, and the at least one second conductive member, to form an element mounting surface.

Abstract: A method of manufacturing a light emitting element mounting base member includes: arranging a plurality of core members each including an electrical conductor core and a light-reflecting insulating member provided on a surface of the electrical conductor core; integrally holding the core members with a light blocking resin; and partially removing the insulating members such that at least one surface of the electrical conductor cores is exposed from the light blocking resin.

Abstract: A method of manufacturing a light-emitting device includes: providing a substrate having: a first surface, a second surface opposite to the first surface, a first through-hole extending from the first surface to the second surface, and wiring on the first surface; mounting a light-emitting element on the first surface to electrically connect an electrode of the light-emitting element and the wiring; providing a cover member having a concave portion for accommodating the light-emitting element; disposing the cover member such that the cover member faces the first surface of the substrate and the concave portion accommodates the light-emitting element and leads to the first through-hole; forming a light-transmissive resin in the concave portion such that a cavity is formed between (i) part of the first surface of the substrate around the light-emitting element and (ii) the light-transmissive resin; and injecting a reflective resin material into the cavity and the first through-hole.

Abstract: A method of manufacturing a wiring board includes: providing an insulating member that includes a plurality of regions partitioned by partitions provided with openings at each of which adjacent ones of the regions are joined to each other; disposing conductive members respectively in the plurality of regions; and joining adjacent ones of the conductive members through one of the partitions to each other at the opening of the partition.